An analytical solution using Ritz method for the electronic assembly vibration problem has been presented in detail. In this solution, a special treatment for plate-mounted-on-standoffs boundary conditions scheme was required, and hence described. Also, a simple equation for estimating ball grid array (BGA) solder joint axial stiffness was developed. The results of the analytical solution were validated with modal analysis measurements and finite element (FE) models data in terms of natural frequencies and mode shapes. Then, the analytical solution was used to estimate the most critical solder joint deformations and stresses. Finally, the so developed solution provided an effective tool to examine the effect of several geometric and material configurations of electronic package structure on the fatigue performance of electronic products under mechanical vibration loadings.
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March 2016
Research-Article
Analytical Solution for Electronic Assemblies Under Vibration
Mohammad A. Gharaibeh,
Mohammad A. Gharaibeh
Mechanical Engineering Department,
Thomas J. Watson School of Engineering and Applied Sciences,
Binghamton University,
State University of New York,
4400 Vestal Parkway East,
Binghamton, NY 13902-6000
e-mail: mgharai1@binghamton.edu
Thomas J. Watson School of Engineering and Applied Sciences,
Binghamton University,
State University of New York,
4400 Vestal Parkway East,
Binghamton, NY 13902-6000
e-mail: mgharai1@binghamton.edu
Search for other works by this author on:
Quang T. Su,
Quang T. Su
Mechanical Engineering Department,
Thomas J. Watson School of Engineering and Applied Sciences,
Binghamton University,
State University of New York,
4400 Vestal Parkway East,
Binghamton, NY 13902-6000
e-mail: qsu@binghamton.edu
Thomas J. Watson School of Engineering and Applied Sciences,
Binghamton University,
State University of New York,
4400 Vestal Parkway East,
Binghamton, NY 13902-6000
e-mail: qsu@binghamton.edu
Search for other works by this author on:
James M. Pitarresi
James M. Pitarresi
Mechanical Engineering Department,
Thomas J. Watson School of Engineering and Applied Sciences,
Binghamton University,
State University of New York,
4400 Vestal Parkway East,
Binghamton, NY 13902-6000
e-mail: jmp@binghamton.edu
Thomas J. Watson School of Engineering and Applied Sciences,
Binghamton University,
State University of New York,
4400 Vestal Parkway East,
Binghamton, NY 13902-6000
e-mail: jmp@binghamton.edu
Search for other works by this author on:
Mohammad A. Gharaibeh
Mechanical Engineering Department,
Thomas J. Watson School of Engineering and Applied Sciences,
Binghamton University,
State University of New York,
4400 Vestal Parkway East,
Binghamton, NY 13902-6000
e-mail: mgharai1@binghamton.edu
Thomas J. Watson School of Engineering and Applied Sciences,
Binghamton University,
State University of New York,
4400 Vestal Parkway East,
Binghamton, NY 13902-6000
e-mail: mgharai1@binghamton.edu
Quang T. Su
Mechanical Engineering Department,
Thomas J. Watson School of Engineering and Applied Sciences,
Binghamton University,
State University of New York,
4400 Vestal Parkway East,
Binghamton, NY 13902-6000
e-mail: qsu@binghamton.edu
Thomas J. Watson School of Engineering and Applied Sciences,
Binghamton University,
State University of New York,
4400 Vestal Parkway East,
Binghamton, NY 13902-6000
e-mail: qsu@binghamton.edu
James M. Pitarresi
Mechanical Engineering Department,
Thomas J. Watson School of Engineering and Applied Sciences,
Binghamton University,
State University of New York,
4400 Vestal Parkway East,
Binghamton, NY 13902-6000
e-mail: jmp@binghamton.edu
Thomas J. Watson School of Engineering and Applied Sciences,
Binghamton University,
State University of New York,
4400 Vestal Parkway East,
Binghamton, NY 13902-6000
e-mail: jmp@binghamton.edu
1Corresponding author.
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received October 11, 2015; final manuscript received December 30, 2015; published online March 10, 2016. Assoc. Editor: Eric Wong.
J. Electron. Packag. Mar 2016, 138(1): 011003 (10 pages)
Published Online: March 10, 2016
Article history
Received:
October 11, 2015
Revised:
December 30, 2015
Citation
Gharaibeh, M. A., Su, Q. T., and Pitarresi, J. M. (March 10, 2016). "Analytical Solution for Electronic Assemblies Under Vibration." ASME. J. Electron. Packag. March 2016; 138(1): 011003. https://doi.org/10.1115/1.4032497
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