Hotspots on a microelectronic package can severely hurt the performance and long-term reliability of the chip. Thermoelectric coolers (TECs) can provide site-specific and on-demand cooling of hot spots in microprocessors. We develop a 3D compact model for fast and accurate modeling of a TEC device integrated inside an electronic package. A 1D compact model of a TEC is first built in SPICE and validated for steady-state and transient behavior against a finite-volume model. The 1D compact model of the TEC is then incorporated into a 3D compact model of a prototype electronic package. The results from the compact model for the packaged TEC are in good agreement with a finite-volume based model, which confirms the compact model's ability to accurately model the TEC's interaction with the package. Analysis of packaged TECs using this 3D compact model shows that (i) moving TECs closer to the chip results in faster response time and an increase in maximum cooling, (ii) high thermal contact resistance within the thermoelectric cooler significantly degrades performance of the device, and (iii) higher convective heat transfer coefficients (HTC) at the heat spreader surface increase steady-state cooling but decrease maximum transient cooling.
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Engineering, Georgia Institute of Technology,
Atlanta, GA 30332
Computer Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
Engineering, Georgia Institute of Technology,
Atlanta, GA 30332
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September 2013
Research-Article
3D Compact Model of Packaged Thermoelectric Coolers
Owen Sullivan,
Engineering, Georgia Institute of Technology,
Atlanta, GA 30332
Owen Sullivan
G. W. Woodruff School of Mechanical
Engineering, Georgia Institute of Technology,
Atlanta, GA 30332
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Saibal Mukhopadhyay,
Computer Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
Saibal Mukhopadhyay
Department of Electrical and
Computer Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
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Satish Kumar
Engineering, Georgia Institute of Technology,
Atlanta, GA 30332
Satish Kumar
G. W. Woodruff School of Mechanical
Engineering, Georgia Institute of Technology,
Atlanta, GA 30332
Search for other works by this author on:
Owen Sullivan
G. W. Woodruff School of Mechanical
Engineering, Georgia Institute of Technology,
Atlanta, GA 30332
Saibal Mukhopadhyay
Department of Electrical and
Computer Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
Satish Kumar
G. W. Woodruff School of Mechanical
Engineering, Georgia Institute of Technology,
Atlanta, GA 30332
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the Journal of Electronic Packaging. Manuscript received January 15, 2013; final manuscript received April 24, 2013; published online June 24, 2013. Assoc. Editor: Amy Fleischer.
J. Electron. Packag. Sep 2013, 135(3): 031006 (7 pages)
Published Online: June 24, 2013
Article history
Received:
January 15, 2013
Revision Received:
April 24, 2013
Citation
Sullivan, O., Alexandrov, B., Mukhopadhyay, S., and Kumar, S. (June 24, 2013). "3D Compact Model of Packaged Thermoelectric Coolers." ASME. J. Electron. Packag. September 2013; 135(3): 031006. https://doi.org/10.1115/1.4024653
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