Silver (Ag) foils are bonded to alumina substrates by a low temperature solid state bonding process. The alumina substrate is premetalized with 40 nm titanium tungsten (TiW) and 2.54 μm gold (Au). The bonding temperature is just 260 °C, compatible with the peak reflow temperature of lead-free (Pb-free) solders used in electronic industries. The Ag foil is quite soft and ductile. It can deform to mate with the Au surface on alumina. Thus, only 1000 psi of static pressure is needed to bring Ag atoms and Au atoms within atomic distance on the interface. Ag has superior physical properties. It has the highest electrical and thermal conductivities among the metals. Scanning electron microscope (SEM) images show that the Ag foil is well bonded to the Au layer on alumina. A standard shear test is performed to determine the shear strength of the bonding. The shear strength of five samples tested far exceeds the strength requirement of MIL-STD-883 G standard.
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December 2011
Research Papers
Solid State Bonding of Silver Foils to Metalized Alumina Substrates at 260°C
Chu-Hsuan Sha,
Chu-Hsuan Sha
Electrical Engineering and Computer Science, Materials and Manufacturing Technology, University of California
, Irvine, CA 92697-2660
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Pin J. Wang,
Pin J. Wang
Electrical Engineering and Computer Science, Materials and Manufacturing Technology, University of California
, Irvine, CA 92697-2660
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Wen P. Lin,
Wen P. Lin
Electrical Engineering and Computer Science, Materials and Manufacturing Technology, University of California
, Irvine, CA 92697-2660
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Chin C. Lee
Chin C. Lee
Electrical Engineering and Computer Science, Materials and Manufacturing Technology, University of California
, Irvine, CA 92697-2660
Search for other works by this author on:
Chu-Hsuan Sha
Electrical Engineering and Computer Science, Materials and Manufacturing Technology, University of California
, Irvine, CA 92697-2660
Pin J. Wang
Electrical Engineering and Computer Science, Materials and Manufacturing Technology, University of California
, Irvine, CA 92697-2660
Wen P. Lin
Electrical Engineering and Computer Science, Materials and Manufacturing Technology, University of California
, Irvine, CA 92697-2660
Chin C. Lee
Electrical Engineering and Computer Science, Materials and Manufacturing Technology, University of California
, Irvine, CA 92697-2660J. Electron. Packag. Dec 2011, 133(4): 041007 (3 pages)
Published Online: December 9, 2011
Article history
Received:
February 13, 2011
Revised:
June 28, 2011
Online:
December 9, 2011
Published:
December 9, 2011
Citation
Sha, C., Wang, P. J., Lin, W. P., and Lee, C. C. (December 9, 2011). "Solid State Bonding of Silver Foils to Metalized Alumina Substrates at 260°C." ASME. J. Electron. Packag. December 2011; 133(4): 041007. https://doi.org/10.1115/1.4005295
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