Flip-chip bonding is a kind of chip packaging technology, which can make fabricated chips lighter and smaller. Thermo-ultrasonic flip-chip bonding is a technology that directly joins gold pad and gold bump. This study combines principle component analysis and gray relational analysis to determine the optimal processing parameters for multiple quality characteristics of light emitting diodes (LEDs). The quality characteristics of this experiment include the candle light, forward voltage, and leakage current of LED and thrust value. First, this study determines the processing parameters that may affect the thermo-ultrasonic flip-chip bonding with the L18 orthogonal array, including substrate temperature, bonding downforce, ultrasonic working time, ultrasonic power, and rising and delay time of tool head bonding. Then, the gray relational analysis is applied to indicate the optimal processing parameters for the multiple quality characteristics of LED. Since the Taguchi method only takes one single quality characteristic into consideration, this study applies the Taguchi method to reduce the number of thermo-ultrasonic flip-chip bonding experiments. The experimental results prove that the optimal LED has good integral quality, which is above industrial standard.
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December 2010
Research Papers
Multi-Objective Optimization of Thermo-Ultrasonic Flip-Chip Bonding Process for High-Brightness Light Emitting Diodes
Chung-Feng Jeffrey Kuo,
Chung-Feng Jeffrey Kuo
Professor
Department of Polymer Engineering,
e-mail: jeffreykuo@mail.ntust.edu.tw
National Taiwan University of Science and Technology
, No. 43, Section 4, Keelung Road, Taipei 106, Taiwan
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Hui-Ta Chen,
Hui-Ta Chen
Laser Application Technology Center,
Industrial Technology Research Institute South
, No. 8, Gongyan Road, Lioujia Township, Tainan County 734, Taiwan
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Te-Li Su,
Te-Li Su
Department of Cosmetic Application and Management,
St. Mary's Medicine, Nursing and Management College
, Yilan County 266, Taiwan
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Jr-Da Huang
Jr-Da Huang
Department of Polymer Engineering,
National Taiwan University of Science and Technology
, No. 43, Section 4, Keelung Road, Taipei 106, Taiwan
Search for other works by this author on:
Chung-Feng Jeffrey Kuo
Professor
Department of Polymer Engineering,
National Taiwan University of Science and Technology
, No. 43, Section 4, Keelung Road, Taipei 106, Taiwane-mail: jeffreykuo@mail.ntust.edu.tw
Hui-Ta Chen
Laser Application Technology Center,
Industrial Technology Research Institute South
, No. 8, Gongyan Road, Lioujia Township, Tainan County 734, Taiwan
Te-Li Su
Department of Cosmetic Application and Management,
St. Mary's Medicine, Nursing and Management College
, Yilan County 266, Taiwan
Jr-Da Huang
Department of Polymer Engineering,
National Taiwan University of Science and Technology
, No. 43, Section 4, Keelung Road, Taipei 106, TaiwanJ. Electron. Packag. Dec 2010, 132(4): 041006 (7 pages)
Published Online: November 24, 2010
Article history
Received:
March 3, 2009
Revised:
September 19, 2010
Online:
November 24, 2010
Published:
November 24, 2010
Citation
Kuo, C. J., Chen, H., Su, T., and Huang, J. (November 24, 2010). "Multi-Objective Optimization of Thermo-Ultrasonic Flip-Chip Bonding Process for High-Brightness Light Emitting Diodes." ASME. J. Electron. Packag. December 2010; 132(4): 041006. https://doi.org/10.1115/1.4002727
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