Subambient temperature operations of advanced semiconductor devices offer many benefits, including improved reliability, reduced leakage currents, and enhanced signal to noise ratios. We discuss a new design concept for compact solid-state refrigerators based on the electrocaloric (EC) effect. The EC refrigerators are attractive because they may approach the Carnot efficiency more closely than Peltier coolers, which involve intrinsically irreversible processes. To address parasitic losses and other practical considerations that limit the actual performance of EC coolers, we incorporate laterally interdigitated electrode arrays with high effective thermal conductivity and switchable thermal interfaces with high switching ratios and high off-state thermal resistance. Numerical simulations are used to quantify the impact of various design parameters and the expected performance of the module, focusing in particular on the heat diffusion time and thermal time constant. Based on the material properties reported in the literature, we project that cooling power densities may be achieved across of the order of 10 K at . The present work motivates further experimental studies to develop advanced electrocaloric materials and fabricate/test cooling modules to assess the feasibility of their practical application.
Skip Nav Destination
e-mail: just@seas.ucla.edu
Article navigation
December 2010
Research Papers
Solid-State Refrigeration Based on the Electrocaloric Effect for Electronics Cooling
Y. Sungtaek Ju
Y. Sungtaek Ju
Department of Mechanical and Aerospace Engineering,
e-mail: just@seas.ucla.edu
University of California
, Los Angeles, CA 90095-1597
Search for other works by this author on:
Y. Sungtaek Ju
Department of Mechanical and Aerospace Engineering,
University of California
, Los Angeles, CA 90095-1597e-mail: just@seas.ucla.edu
J. Electron. Packag. Dec 2010, 132(4): 041004 (6 pages)
Published Online: November 23, 2010
Article history
Received:
July 13, 2010
Revised:
September 1, 2010
Online:
November 23, 2010
Published:
November 23, 2010
Citation
Ju, Y. S. (November 23, 2010). "Solid-State Refrigeration Based on the Electrocaloric Effect for Electronics Cooling." ASME. J. Electron. Packag. December 2010; 132(4): 041004. https://doi.org/10.1115/1.4002896
Download citation file:
Get Email Alerts
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag
Anand Model Constants of Sn-Ag-Cu Solders: What Do They Actually Mean?
J. Electron. Packag
Related Articles
Thermal Investigations of Integrated Circuits and Systems, THERMINIC'09
J. Electron. Packag (March,2011)
A Review of Recent Developments in Some Practical Aspects of Air-Cooled Electronic Packages
J. Heat Transfer (November,1998)
Assessment of Some Integrated Cooling Mechanisms for an Active Integrated Power Electronics Module
J. Electron. Packag (March,2007)
A Simplified Conduction Based Modeling Scheme for Design Sensitivity Study of Thermal Solution Utilizing Heat Pipe and Vapor Chamber Technology
J. Electron. Packag (September,2003)
Related Proceedings Papers
Related Chapters
Thermoelectric Coolers
Thermal Management of Microelectronic Equipment
Part 2, Section II—Materials and Specifications
Companion Guide to the ASME Boiler and Pressure Vessel Code, Volume 1, Third Edition
Part 2, Section II—Materials and Specifications
Companion Guide to the ASME Boiler & Pressure Vessel Code, Volume 1, Second Edition