We previously proposed an elastic-plastic-creep model to estimate the fatigue strength of lead-free solder joints subjected to cyclic thermal loading. The proposed model requires detailed experimental data regarding the time-independent plastic strain and the time-dependent creep strain during cyclic thermal loading. This paper proposes an experimental method for determining the characteristics of both the plastic and creep strains generated during cyclic loading that employs stepped ramp waves. This method is applied to cyclic tension-compression loadings using a Sn–3.0Ag–0.5Cu lead-free solder for several loading conditions. The method can separate between the time-independent plastic strain and the time-dependent creep strain in cyclic inelastic deformation of solder alloys.
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e-mail: ken@ipc.akita-u.ac.jp
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December 2010
Research Papers
Time-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test Using Stepped Ramp Waves
Ken-ichi Ohguchi,
Ken-ichi Ohguchi
Department of Materials Science and Engineering,
e-mail: ken@ipc.akita-u.ac.jp
Akita University
, Tegatagakuen-cho 1-1, Akita 010-8502, Japan
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Katsuhiko Sasaki
Katsuhiko Sasaki
Division of Human Mechanical Systems and Design,
Hokkaido University
, N13, W8, Kita-ku, Sapporo 060-8628, Japan
Search for other works by this author on:
Ken-ichi Ohguchi
Department of Materials Science and Engineering,
Akita University
, Tegatagakuen-cho 1-1, Akita 010-8502, Japane-mail: ken@ipc.akita-u.ac.jp
Katsuhiko Sasaki
Division of Human Mechanical Systems and Design,
Hokkaido University
, N13, W8, Kita-ku, Sapporo 060-8628, JapanJ. Electron. Packag. Dec 2010, 132(4): 041003 (7 pages)
Published Online: November 23, 2010
Article history
Received:
December 9, 2009
Revised:
September 14, 2010
Online:
November 23, 2010
Published:
November 23, 2010
Citation
Ohguchi, K., and Sasaki, K. (November 23, 2010). "Time-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test Using Stepped Ramp Waves." ASME. J. Electron. Packag. December 2010; 132(4): 041003. https://doi.org/10.1115/1.4002897
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