A three-dimensional numerical model is developed to simulate the mold filling behavior in the plastic encapsulation of microchips. The conventional Hele–Shaw approximation is inadequate to analyze a complex molding compound flow behavior with multiple microchips in a single cavity. The developed numerical algorithm is based on the finite difference method combined with the robustness of volume of fluid volume-tracking method to solve the two-phase flow field in complex mold and die geometries. Twelve dies are arranged in a matrix-array in a single mold cavity. Short-shot experimental data are used to validate the numerical results for the melt flow front at different flow times. Close agreement between the experimental data and the numerical results demonstrates the applicability of the present computational model for the simulation of practical epoxy molding compound encapsulation.
1.
Manzione
, L. T.
, 1990, Plastic Packaging of Microelectronic Devices
, Van Nostrand
, New York
.2.
Yang
, H. Q.
, Bayyuk
, S.
, Mazumder
, S.
, Lowry
, S.
, Krishnan
, A.
, Przekwas
, A.
, and Nguyen
, L.
, 2001, “Time-Accurate, 3-D Computation of Wire Sweep During Plastic Encapsulation of Electronic Components
,” ASME J. Pressure Vessel Technol.
0094-9930, 123
, pp. 501
–509
.3.
Han
, R.
, Shi
, L.
, and Gupta
, M.
, 2000, “Three-Dimensional Simulation of Microchip Encapsulation Process
,” Polym. Eng. Sci.
0032-3888, 40
(3
), pp. 776
–785
.4.
Zhou
, H.
, Geng
, T.
, and Li
, D.
, 2005, “Numerical Filling Simulation of Injection Molding Based on 3-D Finite Element Model
,” J. Reinf. Plast. Compos.
0731-6844, 24
(8
), pp. 823
–830
.5.
Hieber
, C. A.
, and Shen
, S. F.
, 1980, “A Finite-Element/Finite-Difference Simulation of the Injection-Molding
,” J. Non-Newtonian Fluid Mech.
0377-0257, 7
(1
), pp. 1
–32
.6.
Liang
, C. W.
, Kulkarni
, V. M.
, Narayana
, P. A. A.
, and Seetharamu
, K. N.
, 2005, “Parametric Studies in Transfer Molding for Newtonian Fluids
,” Journal of Physical Science
, 16
(2
), pp. 103
–114
.7.
Han
, S.
, and Wang
, K. K.
, 2000, “Integrated Flow Analysis During Filling and Post-filling Stage of Semiconductor Encapsulation
,” ASME J. Electron. Packag.
1043-7398, 122
, pp. 20
–27
.8.
Han
, S.
, and Wang
, K. K.
, 2000, “Flow Analysis in a Chip Cavity During Semiconductor Encapsulation
,” ASME J. Electron. Packag.
1043-7398, 122
, pp. 160
–167
.9.
Nguyen
, L.
, Quentin
, C. G.
, and Lee
, W. W.
, 1999, “Flow Modeling and Visualization of the Transfer Molding of Plastic Ball Grid Array Packages
,” Electronic Components and Technology Conference
, Santa Clara, pp. 177
–184
.10.
Shen
, Y. K.
, Ye
, T. W.
, Chen
, S. L.
, Yin
, C. H.
, and Song
, W. D.
, 2001, “Study of Mold Flow Analysis of Flip Chip Package
,” Int. Commun. Heat Mass Transfer
0735-1933, 28
(7
), pp. 943
–952
.11.
Chai
, K.
, Liu
, V.
, Wang
, Y. P.
, and Her
, T. D.
, 2000, “The Application of Mold Flow Simulation in Electronic Package
,” IEEE International Symposium on Electronic Material and Packaging
, Hong Kong, pp. 330
–334
.12.
Kulkarni
, V. M.
, Seetharamu
, K. N.
, Azid
, A. I.
, Narayana
, P. A. A.
, and Quadir
, A. G.
, 2006, “Numerical Simulation of Underfill Encapsulation Process Based on Characteristic Split Method
,” Int. J. Numer. Methods Eng.
0029-5981, 66
, pp. 1658
–1671
.13.
Han
, R.
, and Gupta
, M.
, 2002, “Three-Dimensional Simulation of Reactive Polymeric Flow During Microchip Encapsulation
,” J. Injection Molding Technol.
1533-905X, 6
(3
), pp. 203
–219
.14.
Haagh
, G. A. A. V.
, and De Vosse
, F. N. V.
, 1998, “Simulation of three-Dimensional Polymer Mould Filling Processes Using a Pseudo-Concentration Method
,” Int. J. Numer. Methods Fluids
0271-2091, 28
, pp. 1355
–1369
.15.
Chang
, R. Y.
, and Yang
, W. H.
, 2001, “Numerical Simulation of Mold Filling in Injection Molding Using a Three-Dimensional Finite Volume Approach
,” Int. J. Numer. Methods Fluids
0271-2091, 37
, pp. 125
–148
.16.
Carreau
, P. J.
, De Kee
, D. C. R.
, and Chabra
, R. P.
, 1997, Rheology of Polymeric Systems, Principles and Applications
, Henser/Gardner
, Cincinnati
.17.
Pozrikidis
, C.
, 1996, Introduction to Theoretical and Computational Fluid Dynamics
, Oxford University Press
, New York
.18.
Kawamura
, T.
, and Kuwahara
, K.
, 1984, “Computation of High Reynolds Number Flow Around a Circular Cylinder With Surface Roughness
,” AIAA 22nd Aerospace Science Meeting
, Nevada, pp. 1
–11
.19.
Pei
, C. C.
, and Hwang
, S. J.
, 2005, “Three-Dimensional Paddle Shift Modelling for I.C. Packaging
,” ASME J. Electron. Packag.
1043-7398, 127
, pp. 324
–334
.20.
Abdullah
, M. K.
, Abdullah
, M. Z.
, Mujeebu
, M. A.
, Kamaruddin
, S.
, and Ariff
, Z. M.
, 2008, “Study on the Effect of Stack Thickness During Encapsulation of Stacked-Chip Scale Packages (S-CSPs)
,” Journal of Microelectronics and Electronic Packaging
, 5
, pp. 62
–67
.21.
Halley
, P. J.
, and George
, G. A.
, 2009, Chemorheology of Polymers: From Fundamental Principles to Reactive Processing
, Cambridge University Press
, New York
.22.
Kulkarni
, V. M.
, 2006, “Computational Fluid Flow Analysis of Mold Filling Process in Electronic Packaging
,” Ph.D. thesis, Universiti Sains Malaysia, Malaysia.Copyright © 2010
by American Society of Mechanical Engineers
You do not currently have access to this content.
