Portable electronics is subjected to extreme accelerations in shock and drop impact. Product development cycle times and the cost constraints often restrict the number of design variations tested for drop robustness prior to identification of the final configuration. Simulation models capable of predicting transient dynamics can provide valuable insight into the design reliability under shock environments. In this study, explicit finite-element models have been used to study the transient dynamics of printed circuit boards during drop from . Methodologies for modeling components using smeared-property formulations have been investigated. Reduced integration element formulations examined include shell and solid elements. Model predictions have been validated with experimental data. Results show that models with smeared properties can predict transient-dynamic response of board assemblies in drop impact fairly accurately. High-speed data acquisition system has been used to capture in situ strain, continuity, and acceleration data in excess of . Ultra-high-speed video at has been used to capture the deformation kinematics. Component types examined include plastic ball-grid arrays, tape-array ball-grid array, quad-flat-no-lead package, and conduction-cooled ball-grid array. Model predictions have been correlated with experimental data. Impact of experimental error sources on model correlation with experiments has been also investigated
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e-mail: lall@eng.auburn.edu
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December 2007
Research Papers
Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages
Pradeep Lall,
Pradeep Lall
Departments of Mechanical Engineering, Electrical Engineering, and NSF Center for Advanced Vehicle Electronics,
e-mail: lall@eng.auburn.edu
Auburn University
, Auburn, AL 36849
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Dhananjay Panchagade,
Dhananjay Panchagade
Departments of Mechanical Engineering, Electrical Engineering, and NSF Center for Advanced Vehicle Electronics,
Auburn University
, Auburn, AL 36849
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Yueli Liu,
Yueli Liu
Departments of Mechanical Engineering, Electrical Engineering, and NSF Center for Advanced Vehicle Electronics,
Auburn University
, Auburn, AL 36849
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Wayne Johnson,
Wayne Johnson
Departments of Mechanical Engineering, Electrical Engineering, and NSF Center for Advanced Vehicle Electronics,
Auburn University
, Auburn, AL 36849
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Jeff Suhling
Jeff Suhling
Departments of Mechanical Engineering, Electrical Engineering, and NSF Center for Advanced Vehicle Electronics,
Auburn University
, Auburn, AL 36849
Search for other works by this author on:
Pradeep Lall
Departments of Mechanical Engineering, Electrical Engineering, and NSF Center for Advanced Vehicle Electronics,
Auburn University
, Auburn, AL 36849e-mail: lall@eng.auburn.edu
Dhananjay Panchagade
Departments of Mechanical Engineering, Electrical Engineering, and NSF Center for Advanced Vehicle Electronics,
Auburn University
, Auburn, AL 36849
Yueli Liu
Departments of Mechanical Engineering, Electrical Engineering, and NSF Center for Advanced Vehicle Electronics,
Auburn University
, Auburn, AL 36849
Wayne Johnson
Departments of Mechanical Engineering, Electrical Engineering, and NSF Center for Advanced Vehicle Electronics,
Auburn University
, Auburn, AL 36849
Jeff Suhling
Departments of Mechanical Engineering, Electrical Engineering, and NSF Center for Advanced Vehicle Electronics,
Auburn University
, Auburn, AL 36849J. Electron. Packag. Dec 2007, 129(4): 373-381 (9 pages)
Published Online: March 25, 2007
Article history
Received:
December 29, 2004
Revised:
March 25, 2007
Citation
Lall, P., Panchagade, D., Liu, Y., Johnson, W., and Suhling, J. (March 25, 2007). "Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages." ASME. J. Electron. Packag. December 2007; 129(4): 373–381. https://doi.org/10.1115/1.2804085
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