This study concerns the prediction of crack growth rate for solder joints in electronic packages under thermal cycling. The crack growth rate, which is dependent on the intrinsic solder property and the current stress state, is calculated based on the strain energy density criterion. The critical value of the strain energy density represents the intrinsic property of the solder. The comparison of the crack growth predictions with the experimental measurements demonstrates the applicability of the strain energy density criterion for the reliability life prediction of solder joints.

1.
Lee
,
W. W.
,
Nguyen
,
L. T.
, and
Selvaduray
,
G. S.
,
2000
, “
Solder Joint Fatigue Models: Review and Applicability to Chip Scale Packages
,”
Microelectron. Reliab.
,
40
, pp.
231
244
.
2.
Iannuzzelli
,
R. J.
,
Pitarresi
,
J. M.
, and
Prakash
,
V.
,
1996
, “
Solder Joint Reliability Prediction by the Integrated Matrix Creep Method
,”
ASME J. Electron. Packag.
,
118
, pp.
55
61
.
3.
Syed, A., 1997, “Factors Affecting Creep-Fatigue Interaction in Eutectic Sn/Pb Solder Joints,” Advances in Electronic Packaging, ASME EEP-Vol. 19-2, pp. 1535–1532.
4.
Darveaux, R., 1996, “How to Use Finite Element Analysis to Predict Solder Joint Fatigue Life,” Proc. 6th International Congress on Experimental Mechanics, Elsevier, New York, pp. 41–48.
5.
Lau, J., Chang, C., and Lee, S. W. R., 2000, “Solder Joint Crack Propagation Analysis of Wafer-Level Chip Scale Package on Printed Circuit Board Assemblies,” Proc. 50th Electronic Components and Technology Conference, IEEE, New York, pp. 1360–1368.
6.
Anderson, T., Barut, A., Guven, I., and Madenci, E., 2000, “Revisit of Life Prediction Models for Solder Joints,” Proc. 50th Electronic Components and Technology Conference, IEEE, New York, pp. 1059–1063.
7.
Sih
,
G. C.
,
1973
, “
Some Basic Problems in Fracture Mechanics and New Concepts
,”
Eng. Fract. Mech.
,
5
, pp.
365
377
.
8.
Pan
,
T.
,
1994
, “
Critical Accumulated Strain Energy (CASE) Failure Criterion for Thermal Cycling Fatigue of Solder Joints
,”
ASME J. Electron. Packag.
,
116
, pp.
163
170
.
9.
Sih
,
G. C.
, and
MacDonald
,
B.
,
1974
, “
Fracture Mechanics Applied to Engineering Problems—Strain Energy Density Criterion
,”
Eng. Fract. Mech.
,
6
, pp.
361
386
.
10.
Sih
,
G. C.
, and
Moyer
, Jr.,
E. T.
1983
, “
Path Dependent Nature of Fatigue Crack Growth
,”
Eng. Fract. Mech.
,
17
, pp.
269
280
.
11.
Sih, G. C., 1991, Mechanics of Fracture Initiation and Propagation, Kluwer Academic Publishers, New York.
12.
ANSYS Procedures Manual, Release 5.4, ANSYS, Inc., Canonsburg, PA, 1998.
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