A field-use induced damage mapping methodology is presented that can take into consideration the field-use thermal environment profile to develop accelerated thermal cycling guidelines for packages intended to be used in military avionics thermal environment. The board-level assembly process mechanics and critical geometric features with appropriate material models are taken into consideration while developing the methodology. The models developed are validated against in-house and published accelerated thermal cycling experimental data. The developed mapping methodology is employed to design alternate accelerated thermal cycles by matching the creep and plastic strain contributions to total inelastic strain accumulation in solder under military field-use and accelerated thermal cycling environments, while reducing the time for accelerated thermal cycling and qualification.
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e-mail: suresh.sitarman@me.gatech.edu
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June 2004
Technical Papers
Accelerated Thermal Cycling Guidelines for Electronic Packages in Military Avionics Thermal Environment
Raghuram V. Pucha,
Raghuram V. Pucha
Computer-Aided Simulation of Packaging Reliability (CASPaR) Laboratory, The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405
Member ASME
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Krishna Tunga,
Krishna Tunga
Computer-Aided Simulation of Packaging Reliability (CASPaR) Laboratory, The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405
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James Pyland,
James Pyland
Computer-Aided Simulation of Packaging Reliability (CASPaR) Laboratory, The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405
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Suresh K. Sitaraman
e-mail: suresh.sitarman@me.gatech.edu
Suresh K. Sitaraman
Computer-Aided Simulation of Packaging Reliability (CASPaR) Laboratory, The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405
Search for other works by this author on:
Raghuram V. Pucha
Member ASME
Computer-Aided Simulation of Packaging Reliability (CASPaR) Laboratory, The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405
Krishna Tunga
Computer-Aided Simulation of Packaging Reliability (CASPaR) Laboratory, The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405
James Pyland
Computer-Aided Simulation of Packaging Reliability (CASPaR) Laboratory, The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405
Suresh K. Sitaraman
Computer-Aided Simulation of Packaging Reliability (CASPaR) Laboratory, The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405
e-mail: suresh.sitarman@me.gatech.edu
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received March 2003; final revision, Jan. 04. Associate Editor: G.-Q. Lu.
J. Electron. Packag. Jun 2004, 126(2): 256-264 (9 pages)
Published Online: July 8, 2004
Article history
Revised:
January 1, 1904
Received:
March 1, 2003
Online:
July 8, 2004
Citation
Pucha, R. V., Tunga , K., Pyland , J., and Sitaraman, S. K. (July 8, 2004). "Accelerated Thermal Cycling Guidelines for Electronic Packages in Military Avionics Thermal Environment ." ASME. J. Electron. Packag. June 2004; 126(2): 256–264. https://doi.org/10.1115/1.1756150
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