A novel heat sink based on a multilayer stack of liquid cooled microchannels is investigated. For a given pumping power and heat removal capability for the heat sink, the flow rate across a stack of microchannels is lower compared to a single layer of microchannels. Numerical simulations using a computationally efficient multigrid method [1] were carried out to investigate the detailed conjugate transport within the heat sink. The effects of the microchannel aspect ratio and total number of layers on thermal performance were studied for water as coolant. A heat sink of base area 10 mm by 10 mm with a height in the range 1.8 to 4.5 mm (2–5 layers) was considered with water flow rate in the range 0.83×10−6m3/s (50 ml/min) to 6.67×10−6m3/s (400 ml/min). The results of the computational simulations were also compared with a simplified thermal resistance network analysis.

Issue Section:
Technical Papers
Keywords:
heat sinks, thermal resistance, cooling, electronics packaging
Topics:
Flow (Dynamics), Heat sinks, Microchannels, Thermal resistance, Computer simulation, Cooling
1.
Tang
,
L.
, and
Joshi
,
Y.
,
1999
, “
Application of Block-Implicit Multigrid Approach to Three-Dimensional Heat Transfer Problems Involving Discrete Heating
,”
Numer. Heat Transfer, Part A
,
35
(
7
), pp.
717
717
.
2.
Tuckerman
,
D. B.
,
Pease
,
R. F. W.
,
1981
, “
High-performance Heat Sinking for VLSI
,”
IEEE Electron Device Lett.
,
2
(
5
), pp.
126
–
129
.
3.
Phillips, R. J., 1990 “Microchannel Heat Sinks,” Advances in Thermal Modeling of Electronic Components and Systems, Bar-Cohen, A., & Kraus, A. D., eds., 2, pp. 109–184.
4.
Weisberg
,
A.
,
Bau
,
H. H.
, and
Zemel
,
J. N.
,
1992
, “
Analysis of Microchannels for Integrated Cooling
,”
Int. J. Heat Mass Transfer
,
35
(
10
), pp.
2465
–
74
.
5.
Bau
,
H. H.
,
1998
, “
Optimization of Conduits’ Shape in Micro Heat Exchangers
,”
Int. J. Heat Mass Transfer
,
41
, pp.
2717
–
23
.
6.
Vafai
,
K.
, and
Zhu
,
L.
,
1999
, “
Analysis of Two-layered Microchannel Heat Sink Concept in Electronic Cooling
,”
Int. J. Heat Mass Transfer
,
42, pp.
2287
–
97
.
7.
Biber, R. C., and Belady, L. C., 1997, “Pressure Drop Prediction for Heat Sinks: What Is the Best Method?” Advances in Electronic Packaging, Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack ’97, 2, pp. 1829–1835.
8.
Shah, R. K., and London, A. L., 1978, “Laminar Flow Forced Convection in Ducts,” Supplement 1 in Advances in Heat Transfer, Irvine, T. F., and Hartnett, J. P., eds., Academic, New York.
9.
Yin
,
X.
, and
Bau
,
H. H.
,
1997
, “
Uniform Channel Micro Heat Exchangers
,”
J. Electronic Packaging
,
119
, pp.
89
–
94
.
Copyright © 2004
 by ASME
You do not currently have access to this content.