The present study focuses on the development of reliable response surface models (RSM’s) for the major packaging processes of a typical electronic package. The major objective is to optimize the product/process designs against the possible failure mode of vertical die cracks. First, the finite element mode (FEM)-based physics of failure models are developed and the reliability of the predicted stress levels was verified by experiments. In the development of reliable thermo-mechanical simulation models, both the process (time and temperature) dependent material nonlinearity and geometric nonlinearity are taken into account. Afterwards, RSM’s covering the whole specified geometric design spaces are constructed. Finally, these RSM’s are used to predict, evaluate, optimize, and eventually qualify the thermo-mechanical behavior of this electronic package against the actual design requirements prior to major physical prototyping and manufacturing investments.

Issue Section:
Technical Papers
Keywords:
response surface methodology, integrated circuit packaging, cracks, finite element analysis, failure analysis, integrated circuit reliability
Topics:
Design, Finite element model, Packaging, Response surface methodology, Stress, Temperature, Optimization, Modeling, Solders, Testing
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