Optimization of pin-fin heat sinks for impingement cooling of electronic components was studied. The study was based on a semi-empirical zonal model for determining thermal resistance as well as pressure drop. To test the validity of the model’s predictions, experiments and flow visualization were performed. The experimental results validated the model. The model enables cost-effective designs to be calculated in order to optimize pin-fin heat sinks. These calculations took into consideration 16 design parameters including pin diameter, minimum spacing between pins, and fin height. For the particular blower considered in our study, the optimum pin diameter was found being 0.35 mm. And the characteristics and limitations of air-cooling for such applications were investigated under various conditions. [S1043-7398(00)01704-7]

Issue Section:
Technical Papers
Keywords:
heat sinks, integrated circuit packaging, cooling, thermal resistance, flow visualisation, integrated circuit modelling
Topics:
Cooling, Heat sinks, Optimization, Pins (Engineering), Pressure drop, Thermal resistance, Impingement cooling, Flow (Dynamics), Fins, Flow visualization
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