Solder joints are commonly used in surface mount technology microelectronics packaging. It is well known that the dominant failure mode for solder joints is thermal fatigue. When semiconductor devices are used in a vibrating environment, such as in automotive and military applications, dynamic stresses contribute to the failure mechanism and in certain circumstances they can become the dominant failure cause. In this paper a unified constitutive model for Pb40/Sn60 solder joints is developed and then implemented in a finite element dynamic analysis procedure. The purpose of the material model and the implementation is to study the contribution of vibration induced strains to the fatigue life of solder interconnects in low cycle and high cycle fatigue. The proposed material model, which is based on the disturbed state concept (DSC), is used for a dynamic analysis of a solder joint in the following paper, Part II, Basaran and Chandaroy (1998).
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March 1999
Technical Papers
Nonlinear Dynamic Analysis of Surface Mount Interconnects: Part I—Theory
C. Basaran,
C. Basaran
Electronic Packaging Laboratory, State University of New York at Buffalo, Buffalo, NY 14260
e-mail: cjb@eng.buffalo.edu
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R. Chandaroy
R. Chandaroy
HKS ABAQUS Inc., Detroit, MI
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C. Basaran
Electronic Packaging Laboratory, State University of New York at Buffalo, Buffalo, NY 14260
e-mail: cjb@eng.buffalo.edu
R. Chandaroy
HKS ABAQUS Inc., Detroit, MI
J. Electron. Packag. Mar 1999, 121(1): 8-11 (4 pages)
Published Online: March 1, 1999
Article history
Received:
March 5, 1998
Revised:
April 26, 1998
Online:
November 5, 2007
Citation
Basaran, C., and Chandaroy, R. (March 1, 1999). "Nonlinear Dynamic Analysis of Surface Mount Interconnects: Part I—Theory." ASME. J. Electron. Packag. March 1999; 121(1): 8–11. https://doi.org/10.1115/1.2792663
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