Using the unified constitutive model and the finite element procedure presented in Part I (the preceding paper), a material nonlinear time domain dynamic analysis of a solder joint was studied for low cycle and high cycle fatigue. Thermal effects were not included in order to understand the dynamic behavior of a Pb40/Sn60 solder joint without noise-effects from thermal behavior. The latter decision was a result of observations reported in Steinberg (1988), that having in-phase or out-of-phase thermal loading in conjunction with vibrations makes a significant difference in the fatigue life. The study of fatigue under concurrent loading will be the subject of another paper.

Issue Section:
Technical Papers
Topics:
Dynamic analysis, Surface mount packaging, Solder joints, Constitutive equations, Cycles, Fatigue, Fatigue life, Finite element analysis, High cycle fatigue, Noise (Sound), Temperature effects, Vibration
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