The relationships between the force measured during wetting balance tests and the observed changes of contact angle and meniscus shape are studied. Experiments using silicone oil at 25, 50, and 100°C on glass plates as well as Pb-Sn eutectic solder on Au-coated glass plates are reported. Discrepancies between the measured force and height and those expected for a static meniscus are detailed. Equilibrium meniscus shapes are computed for wide plates using the elastica solution and for narrow plates using the public-domain software package, “Surface Evolver.” For room temperature experiments with oil, the measured force discrepancy disappears when the meniscus rise is complete. Thus, the force discrepancy may be due to shear stress exerted on the sample by fluid rising up the sample. For static menisci with heated liquids, force and meniscus height discrepancies do not disappear when the meniscus rise is complete. These discrepancies can be explained by Marangoni flow due to temperature gradients in the fluid for the oil experiments but not for the solder experiments.

1.
Braun
R. J.
,
Murray
B. T.
,
Boettinger
W. J.
, and
McFadden
G. B.
,
1995
,
Phys. Fluids
, Vol.
7
, p.
1797
1797
.
2.
Brakke
K.
,
1992
,
Experimental Mathematics
, Vol.
1
, pp.
141
165
.
3.
Boettinger, W. J., Handwerker, C. A., and Kattner, U. R., 1993, The Mechanics of Solder Alloy Wetting and Spreading, D. Frear, F. M. Hosking, F. Yost, eds., Van Nostrand Reinhold, New York, p. 103.
4.
deGennes
P. G.
,
1985
,
Rev. Mod. Phys.
, Vol.
57
, p.
827
827
.
5.
deGennes
P. G.
,
Hua
X.
, and
Levinson
P.
,
1990
,
J. Fluid Mech.
, Vol.
212
, pp.
55
63
.
6.
Dussan
V. E. B.
,
1979
,
Ann. Rev. Fluid Mech.
, Vol.
11
, pp.
371
400
.
7.
Ehrhard
P.
, and
Davis
S.
,
1991
,
J. Fluid Mech.
, Vol.
229
, pp.
365
388
.
8.
Ehrhard
P.
,
1993
,
J. Fluid Mech.
, Vol.
257
, pp.
463
483
.
9.
Engelman, M. S., 1993, FIDAP 7.0 Manuals, Fluid Dynamics Int., Evanston IL.
10.
Hansen
R. J.
, and
Toong
T. Y.
,
1971
,
J. Coll. & Int. Sci.
, Vol.
37
, pp.
197
207
.
11.
Hardy
S.
,
1979
,
J. Colloid and Interface Science
, Vol.
69
, pp.
157
162
.
12.
Heiser, E. A., Moy, P. C., Munie, G. C., Machusak, D. A., and Wernger, G. W., 1995, Proceedings of Technical Program, Surface Mount International 95, pp. 468–474.
13.
Jellison, J., Johnson, D. R., and Hosking, F. M., 1978, EEE Trans. on Parts, Hybrids, and Packaging PHP-12, p. 126.
14.
Klein Wassink, R. J., 1989, Soldering in Electronics, second edition, Electrochemical Publications, Ayr Scotland.
15.
Lea
C.
,
1990
a,
Soldering & Surface Mount Technology
, Vol.
4
, pp.
8
13
.
16.
Lea
C.
, and
Dench
W. A.
,
1990
b,
Soldering & Surface Mount Technology
, Vol.
5
, pp.
14
22
.
17.
Lea
C.
,
1990
b,
Soldering & Surface Mount Technology
, Vol.
5
, pp.
46
55
.
18.
Lea
C.
,
1990
c,
Soldering & Surface Mount Technology
, Vol.
6
, pp.
4
9
.
19.
Lea
C.
,
1991
a,
Soldering & Surface Mount Technology
, Vol.
7
, pp.
10
13
.
20.
Lea
C.
,
1991
b,
Soldering & Surface Mount Technology
, Vol.
8
, pp.
4
12
.
21.
Ludvksson
V.
, and
Lightfoot
E. N.
,
1971
,
AICHE J.
, Vol.
17
, pp.
1166
1173
.
22.
Munie, G. C., Wenger, G. M., Macbusak, D. A., Noctor, D. M., and Ejim, T. I., 1993, Proceedings of Technical Program, Surface Mount International ’93, p. 963.
23.
Okamoto
I.
,
Takemoto
T.
,
Mizutani
M.
, and
Mori
I.
,
1985
,
Trans. J. Weld. Res. Inst.
, Vol.
14
, p.
21
21
.
24.
Orr
F. M.
, and
Scriven
L. E.
,
1977
,
J. Colloid and Interface Science
, Vol.
60
, p.
402
402
.
25.
Ricci
E.
,
Sangiogi
R.
, and
Passerone
A.
,
1986
,
Surface and Coating Tech.
, Vol.
28
, pp.
215
223
.
26.
Schaneke
A. E.
,
Falke
Wilbert L.
, and
Miller
V. R.
,
1978
,
J. of Chemical and Engineering Data
, Vol.
23
, p.
298
298
.
27.
Schmidt, J., and Carillo-Nava, E., 1995, NIST, unpublished research.
28.
Thresh
H. R.
, and
Crawley
A. F.
,
1970
,
Metall, Trans.
, Vol.
1
, pp.
1531
1535
.
29.
Whalley, D. C., Conway, P. P., Sarvar, F., and Kalantary, M., 1995, Advances in Electronic Packaging, ASME, 1, ASME Publication No. EEP-Vol. 10-1, pp. 89–94.
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