About the Journal
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Read more...
Y. C. Lee,
University of Colorado, Boulder
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Low Temperature Cu–Cu Bonding Technology in Three-Dimensional Integration: An Extensive Review
Asisa Kumar Panigrahy; Kuan-Neng Chen

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