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About the Journal

The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Read more...

Shi-Wei Ricky Lee,
The Hong Kong University of Science & Technology
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Impact Factor
1.931
A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the Ball-on-Ring and PoEF Tests
J. Electron. Packag (September 2023)
Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics
J. Electron. Packag (September 2023)
Reviewer's Recognition
J. Electron. Packag (June 2023)
Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches
J. Electron. Packag (September 2023)
Special Section on InterPACK2021
J. Electron. Packag (March 2023)
Accepted Manuscripts
No matches found for configured query.
 
Featured Article

A Review on Transient Thermal Management of Electronic Devices

John Mathew and Shankar Krishnan

Open Access

Open Access

The ASME Open Journal of Engineering (AOJE) is a rapid turnaround, multidisciplinary, open access, and rigorously peer-reviewed publication that expands the ASME Journal Program to offer original research across the broad spectrum of all ASME technical communities.

Call for Papers

Announcements and Call For Papers

ASME continuously publishes Special Issues in emerging areas. Stay up to date on the latest call for papers if you’d like to submit.

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Why Publish in ASME Journals?

Here are 10 important reasons to choose ASME. Become part of the ASME author community and its more than 140-year tradition of promoting the art, science, and practice of multidisciplinary engineering and the related sciences around the globe.

  • Online ISSN 1528-9044
  • Print ISSN 1043-7398

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