7th International Congress on Thermal Stresses Taipei, Taiwan June 4–7, 2007 PUBLIC ACCESS

J. Appl. Mech 73(3), 524 (May 01, 2006) (1 page) doi:10.1115/1.2198194 History:

The 7th International Congress on Thermal Stresses will take place at National Taiwan University of Science and Technology (NTUST) in Taipei, Taiwan, from June 4–7, 2007. Abstracts are now being sought for sessions which will be organized to cover most areas of Thermal Stresses as well as Heat Transfer.

The Congress website www.ntust.edu.tw/~ts2007 provides detailed information and will be updated periodically. For further information or questions, please send an e-mail to ts2007@mail.ntust.edu.tw

The principal topics of interest are:
  • Thermal Stresses and Deformations
  • Thermoelasticity and Viscoelasticity
  • Thermoplasticity and Viscoplasticity
  • Thermal Stresses in Fracture and Fatigue
  • Thermoelastic Contact Problems
  • Active and Passive Control in High Temperature Structures
  • Thermal Shock
  • Engineering Approaches to High/Low Temperature Design
  • Anisotropic Thermomechanical Problems
  • Thermal Stresses in Dynamic Problems
  • Inverse and Optimization Methods for Thermal Problems
  • Thermal Stresses in Materials and Forming Processes
  • Thermal Stresses in Electronic Packaging
  • Thermal Stress Problems in Industrial Applications
  • Thermal Stresses in Welding
  • Heat Conduction and/or Radiation Problems
  • Computational Methods in Thermal Problems
  • Experimental Methods in Thermal Stresses
  • Instability and Localization Under Thermomechanical Loadings
  • Thermodynamics in Porous Media
  • Coupled Thermal and Electromechanical Effects
  • Thermal Problems at Moving Interfaces

Abstracts should be submitted by November 15, 2006, preferably by uploading to the website. Note that the abstracts of the papers to be presented at the Congress will be published in a Proceedings volume and distributed to all attendees.

We look forward to seeing you in Taipei!

General Chair:

Ching-Kong Chao, National Taiwan University of Science and Technology


Richard B. Hetnarski, Rochester Institute of Technology, USA

Naotake Noda, Shizuoka University, Japan


Chyi-Yeu Lin, National Taiwan University of Science and Technology

Copyright © 2006 by American Society of Mechanical Engineers
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