Relaxation of Thermal Stress Singularities in Bonded Viscoelastic Quarter Planes

[+] Author and Article Information
James P. Blanchard

Department of Nuclear Engineering and Engineering Physics, University of Wisconsin-Madison, Madison, Wis. 53706

Nasr M. Ghoniem

School of Engineering and Applied Science, University of California, Los Angeles, Los Angeles, Calif. 90024

J. Appl. Mech 56(4), 756-762 (Dec 01, 1989) (7 pages) doi:10.1115/1.3176169 History: Accepted October 21, 1988; Received October 21, 1988; Online July 21, 2009


Singular thermal stress fields in bonded viscoelastic quarter planes are studied with the use of the viscoelastic analogy. The order of the singularity is shown to depend on the material properties, indicating that it will vary with time in viscoelastic materials. This is studied in detail for Maxwell materials, and it is shown that the order of the singularity generally increases with time. This evolution of the singularity can, for certain combinations of material properties, lead to initial increases in the stress levels near the edge of the interface before relaxation occurs.

Copyright © 1989 by ASME
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