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Journal Articles

A Technique for High-Speed Microscopic Imaging of Dynamic Failure Events and Its Application to Shear Band Initiation in Polycarbonate

P. Malhotra, S. Niu, V. Srivastava, P. R. Guduru
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. April 2022, 89(4): 041001.
Paper No: JAM-21-1397
https://doi.org/10.1115/1.4053080
Published Online: December 8, 2021
View Article titled, A Technique for High-Speed Microscopic Imaging of Dynamic Failure Events and Its Application to Shear Band Initiation in Polycarbonate
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Topics: Deformation, Fracture (Materials), Imaging, Particulate matter, Resolution (Optics), Shear (Mechanics), Simulation, Displacement, Failure, Constitutive equations
Includes: Supplementary data
Journal Articles

Thermomechanical Modeling of Scanning Joule Expansion Microscopy Imaging of Single-Walled Carbon Nanotube Devices

Jizhou Song, Chaofeng Lu, Xu Xie, Yuhang Li, Yihui Zhang, Kyle L. Grosse, Simon Dunham, Yonggang Huang, William P. King, John A. Rogers
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research-Article
J. Appl. Mech. July 2013, 80(4): 040907.
Paper No: JAM-13-1030
https://doi.org/10.1115/1.4024175
Published Online: May 31, 2013
View Article titled, Thermomechanical Modeling of Scanning Joule Expansion Microscopy Imaging of Single-Walled Carbon Nanotube Devices
Open the PDF for Thermomechanical Modeling of Scanning Joule Expansion Microscopy Imaging of Single-Walled Carbon Nanotube Devices in another window
Topics: Imaging, Joules, Microscopy, Modeling, Single-walled carbon nanotubes, Single-walled nanotubes, Temperature, Temperature distribution, Thermal expansion, Thermomechanics
Journal Articles

Temperature Rise in Polymeric Materials During High Rate Deformation

M. Garg, A. D. Mulliken, M. C. Boyce
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. January 2008, 75(1): 011009.
https://doi.org/10.1115/1.2745388
Published Online: January 11, 2008
View Article titled, Temperature Rise in Polymeric Materials During High Rate Deformation
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Topics: Deformation, Epoxy adhesives, Epoxy resins, Polymers, Sensors, Temperature, Temperature measurement, Compression, Testing, Imaging
Journal Articles

Seismic Migration—Imaging of Acoustic Energy by Wave Field Extrapolation

A. J. Berkhout, Author, Y.-H. Pao, Reviewer
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Book Reviews
J. Appl. Mech. September 1982, 49(3): 682–683.
https://doi.org/10.1115/1.3162563
Published Online: September 1, 1982
View Article titled, Seismic Migration—Imaging of Acoustic Energy by Wave Field Extrapolation
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Topics: Acoustics, Imaging, Waves