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Proceedings Papers

Fabrication of Al Micro-Coil and Loop by Utilizing Electromigration

Yuxin Sun, Masumi Saka
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 589-592, June 3–5, 2008
Paper No: MicroNano2008-70073
https://doi.org/10.1115/MicroNano2008-70073
View Paper titled, Fabrication of Al Micro-Coil and Loop by Utilizing Electromigration
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Topics: Electrodiffusion, Manufacturing, Fibers, Aluminum, Anodes, Atoms, Crystallization, Current density, Temperature
Proceedings Papers

Improvement of Printed Circuit Board Assembly Process in 2.4GHz RF Circuit Products

Mu-Chun Wang, Zhen-Ying Hsieh, Ting-Yu Yang, Chia-Hao Tu, Shuang-Yuan Chen
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 737-741, June 3–5, 2008
Paper No: MicroNano2008-70093
https://doi.org/10.1115/MicroNano2008-70093
View Paper titled, Improvement of Printed Circuit Board Assembly Process in 2.4GHz RF Circuit Products
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Topics: Circuits, Printed circuit board assemblies, Electronic components, Copper, Energy dissipation, Shapes, Temperature, Assembly lines, Circuit design, Contact resistance
Proceedings Papers

PFPE Modified Silicon Nano-Textured Surfaces for Adhesion and Friction Reduction

Ying Song, Hengyu Wang, Min Zou
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 65-67, June 3–5, 2008
Paper No: MicroNano2008-70144
https://doi.org/10.1115/MicroNano2008-70144
View Paper titled, PFPE Modified Silicon Nano-Textured Surfaces for Adhesion and Friction Reduction
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Topics: Adhesion, Crystallization, Friction, Silicon
Proceedings Papers

Visualization of Micro Vapor Bubble Dynamic Behaviors in Open Capillary Microgrooves

Xuegong Hu, Liyuan Wu, Dawei Tang
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 395-400, June 3–5, 2008
Paper No: MicroNano2008-70244
https://doi.org/10.1115/MicroNano2008-70244
View Paper titled, Visualization of Micro Vapor Bubble Dynamic Behaviors in Open Capillary Microgrooves
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Topics: Bubbles, Vapors, Visualization, Microbubbles, Collapse, Heat transfer, Image processing, Matlab, Nucleate boiling, Theoretical analysis
Proceedings Papers

Total Internal Reflection (TIR) Lens Design for Surface Mount Techonology (SMT) LED Application

JaeYoung Joo, Do Kyun Woo, ChaBum Lee, SunKyu Lee
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 105-106, June 3–5, 2008
Paper No: MicroNano2008-70261
https://doi.org/10.1115/MicroNano2008-70261
View Paper titled, Total Internal Reflection (TIR) Lens Design for Surface Mount Techonology (SMT) LED Application
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Topics: Design, Lenses (Optics), Reflection, Surface mount packaging, Diamond turning, Geometry, Matlab, Simulation results, Surface mount technology
Proceedings Papers

A DSMC Study of the Si/Ge Interface Thermal Resistance

Mei-Jiau Huang, Dong-Jiun Tsai, Liang-Chun Liu
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 455-460, June 3–5, 2008
Paper No: MicroNano2008-70330
https://doi.org/10.1115/MicroNano2008-70330
View Paper titled, A DSMC Study of the Si/Ge Interface Thermal Resistance
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Topics: Thermal resistance, Phonons, Simulation, Simulation results, Acoustics, Approximation, Dispersion relations, Reflection, Relaxation (Physics), Temperature
Proceedings Papers

Characterizing Metallization Introduced Polysilicon Corrosion of Surface Micromachined Structures With Submicron Capacitive Gap

Yunda Wang, Ming Cai, Ying Wang, Jing Chen
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 51-54, June 3–5, 2008
Paper No: MicroNano2008-70116
https://doi.org/10.1115/MicroNano2008-70116
View Paper titled, Characterizing Metallization Introduced Polysilicon Corrosion of Surface Micromachined Structures With Submicron Capacitive Gap
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Topics: Corrosion, Micromachining, Polysilicon
Proceedings Papers

Study of Package Technologies for Implantable Microdevices

Weihong Li, Zhenjiang Shi, Hang Guo, Shiqing Chen, Xiuhan Li, Haixia Zhang
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 167-170, June 3–5, 2008
Paper No: MicroNano2008-70194
https://doi.org/10.1115/MicroNano2008-70194
View Paper titled, Study of Package Technologies for Implantable Microdevices
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Topics: Circuits, Packaging, Resonance, Silicones, Thin films
Proceedings Papers

Study on the Shockwave Pressure Testing Method for Detonating Cords

Ying-Wei Bai, Zhuang-De Jiang, Yu-Long Zhao, En-Yi Chu, Kexuan Wang
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 303-307, June 3–5, 2008
Paper No: MicroNano2008-70078
https://doi.org/10.1115/MicroNano2008-70078
View Paper titled, Study on the Shockwave Pressure Testing Method for Detonating Cords
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Topics: Cordage, Pressure testing, Shock waves
Proceedings Papers

Relationship Between Distance of Photonic Crystal Rods Array and Wavelength of Light Propagating in Right-Angular, Cross, and Y-Shapes Waveguide

Meng-Ju Lin
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 225-230, June 3–5, 2008
Paper No: MicroNano2008-70307
https://doi.org/10.1115/MicroNano2008-70307
View Paper titled, Relationship Between Distance of Photonic Crystal Rods Array and Wavelength of Light Propagating in Right-Angular, Cross, and Y-Shapes Waveguide
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Topics: Crystals, Rods, Shapes, Waveguides, Wavelength, Bifurcation, Artificial neural networks, Columns (Structural), Computer software, Finite element methods
Proceedings Papers

Numerical Analysis of Dry Gas Face Seals With Spiral Groove and Inner Annular Groove

Xu-Dong Peng, Li-Li Tan, Ji-Yun Li, Song-En Sheng, Shao-Xian Bai
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 73-77, June 3–5, 2008
Paper No: MicroNano2008-70185
https://doi.org/10.1115/MicroNano2008-70185
View Paper titled, Numerical Analysis of Dry Gas Face Seals With Spiral Groove and Inner Annular Groove
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Topics: Finite element methods, Leakage, Numerical analysis, Optimization, Sealing (Process), Stiffness
Proceedings Papers

Fabrication of a Novel Resonant Pressure Sensor Based on SOI Wafer

Zhibo Ma, Sen Ren, Dayong Qiao, Weizheng Yuan
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 593-596, June 3–5, 2008
Paper No: MicroNano2008-70079
https://doi.org/10.1115/MicroNano2008-70079
View Paper titled, Fabrication of a Novel Resonant Pressure Sensor Based on SOI Wafer
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Topics: Manufacturing, Pressure sensors, Resonance, Semiconductor wafers, Silicon-on-insulator, Diaphragms (Mechanical devices), Diaphragms (Structural), Pressure, Silicon, Chemical etching
Proceedings Papers

A NEMD Study of the Thermal Conductivity and Surface Roughness of Silicon Thin Films

Tai-Ming Chang, Chien-Chou Weng, Mei-Jiau Huang
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 461-466, June 3–5, 2008
Paper No: MicroNano2008-70331
https://doi.org/10.1115/MicroNano2008-70331
View Paper titled, A NEMD Study of the Thermal Conductivity and Surface Roughness of Silicon Thin Films
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Topics: Silicon, Surface roughness, Thermal conductivity, Thin films, Temperature, Atoms, Simulation, Boundary-value problems, Computation, Evaporation
Proceedings Papers

Leakage Current Influence on Microdevice Performance and Reliability

Oren Lahav, Its’hak Yomtovian, Lior Kogut
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 39-42, June 3–5, 2008
Paper No: MicroNano2008-70097
https://doi.org/10.1115/MicroNano2008-70097
View Paper titled, Leakage Current Influence on Microdevice Performance and Reliability
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Topics: Leakage, Reliability, Currents, Failure
Proceedings Papers

Hermetic Packaging Technique Featuring Through-Wafer Interconnects and Low Temperature Direct Bond

James Lee, Tony Rogers
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 107-112, June 3–5, 2008
Paper No: MicroNano2008-70288
https://doi.org/10.1115/MicroNano2008-70288
View Paper titled, Hermetic Packaging Technique Featuring Through-Wafer Interconnects and Low Temperature Direct Bond
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Topics: Low temperature, Packaging, Semiconductor wafers, Bonding, Silicon, Vacuum, Complementary metal oxide semiconductors, Damage, Electrodes, Integrated systems
Proceedings Papers

Preparation and Characterization of Pt/WO 3 Nano-Film and Its Hydrogen-Sensing Properties

Changjun Hou, Jiale Dong, Yan Xu, Danqun Huo, Yike Tang, Jun Yang
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 231-236, June 3–5, 2008
Paper No: MicroNano2008-70010
https://doi.org/10.1115/MicroNano2008-70010
View Paper titled, Preparation and Characterization of Pt/WO 3 Nano-Film and Its Hydrogen-Sensing Properties
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Topics: Hydrogen, Ions, Tungsten, Crystals, Atomic force microscopy, Catalysts, Electric potential, Membranes, Metal oxide semiconductors, Platinum
Proceedings Papers

Dynamics Evolution of Shock Waves in Laser-Material Interaction

Sobieslaw Gacek, Xinwei Wang
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 667-675, June 3–5, 2008
Paper No: MicroNano2008-70181
https://doi.org/10.1115/MicroNano2008-70181
View Paper titled, Dynamics Evolution of Shock Waves in Laser-Material Interaction
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Topics: Dynamics (Mechanics), Laser materials, Shock waves, Absorption, Density, Engineering simulation, Lasers, Molecular dynamics, Plumes (Fluid dynamics), Pressure
Proceedings Papers

Analysis of Electrostatically Actuated Narrow Microcantilevers Using Rayleigh-Ritz Energy Technique

Manish M. Joglekar, Kedar Y. Hardikar, Dnyanesh N. Pawaskar
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 309-319, June 3–5, 2008
Paper No: MicroNano2008-70130
https://doi.org/10.1115/MicroNano2008-70130
View Paper titled, Analysis of Electrostatically Actuated Narrow Microcantilevers Using Rayleigh-Ritz Energy Technique
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Topics: Microcantilevers, Accounting, Algebra, Algorithms, Boundary-value problems, Capacitance, Deflection, Design, Displacement, Microelectromechanical systems
Proceedings Papers

Design and Fabrication of a Micro-Knife for Minimally Invasive Surgery

Hang Guo, Hui Yang, Liming Zou
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 171-173, June 3–5, 2008
Paper No: MicroNano2008-70195
https://doi.org/10.1115/MicroNano2008-70195
View Paper titled, Design and Fabrication of a Micro-Knife for Minimally Invasive Surgery
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Topics: Design, Manufacturing, Surgery, Displacement, Finite element methods, Microfabrication, Oscillating frequencies, Shapes, Silicon, Vibration
Proceedings Papers

Thermal Control for Droplet-Based Microfluidics

Nam-Trung Nguyen
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 523-528, June 3–5, 2008
Paper No: MicroNano2008-70277
https://doi.org/10.1115/MicroNano2008-70277
View Paper titled, Thermal Control for Droplet-Based Microfluidics
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Topics: Drops, Microfluidics