Volumes | International Electronic Packaging Technical Conference and Exhibition | American Society of Mechanical Engineers Digital Collection

Topics: Cloud computing , Computational fluid dynamics , Coolants , Cooling , Cooling systems , Data centers , Design , Electronic components , Electronics , Energy consumption

Performance Analysis of Liquid-to-Air Heat Exchangers of High-Power Density Racks

Ali Heydari, Ahmad R. Gharaibeh, Mohammad Tradat, Qusai Soud, Yaman Manaserh, Vahideh Radmard, Bahareh Eslami, Bahgat Sammakia, Jeremy Rodriguez

InterPACK 2023; V001T01A017https://doi.org/10.1115/IPACK2023-112404

Abstract

View Articletitled, Performance Analysis of Liquid-to-Air Heat Exchangers of High-Power Density Racks

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Topics: Cooling , Data centers , Density , Heat , Heat exchangers

Experimental and CFD Analysis of a Rack Manifold for High Power Density Liquid-Cooled Rack

Pardeep Shahi, Ali Heydari, Pratik Bansode, Ashwin Siddarth, Uschas Chowdhury, Harold Miyamura, Himanshu Modi, Dereje Agonafer, Mohammad Tradat, Jeremy Rodriguez

InterPACK 2023; V001T01A018https://doi.org/10.1115/IPACK2023-114351

Abstract

View Articletitled, Experimental and CFD Analysis of a Rack Manifold for High Power Density Liquid-Cooled Rack

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Topics: Computational fluid dynamics , Cooling , Data centers , Flow (Dynamics) , Manifolds , Power density

Electronics Packaging

Application of the Reflowable Magnetic Jig on Thin MCM Package for Warpage Control

Jong-Chan Park, Young-Min Kim, Gil-Ho Lee, Hyeong-Kwan Kim, Tae-Keun Lee

InterPACK 2023; V001T02A001https://doi.org/10.1115/IPACK2023-109453

Abstract

View Articletitled, Application of the Reflowable Magnetic Jig on Thin MCM Package for Warpage Control

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Topics: Jigs and fixtures , Shades and shadows , Soldering , Warping

Experimental Characterization of Confined, Package-Level Direct Two-Phase Jet Impingement Cooling With Micro-Pin Fin Surface Enhancement

Qianying Wu, Zheng Gong, Chih-Yao Chan, Heungdong Kwon, Kenneth Goodson, Tiwei Wei

InterPACK 2023; V001T02A002https://doi.org/10.1115/IPACK2023-109944

Abstract

View Articletitled, Experimental Characterization of Confined, Package-Level Direct Two-Phase Jet Impingement Cooling With Micro-Pin Fin Surface Enhancement

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Topics: Boiling , Bubbles , Computer cooling , Coolants , Cooling , Cooling systems , Drying , Energy consumption , Experimental characterization , Flow (Dynamics)

Numerical Modeling of Forced Air Convection for Thermal Management in Automotive ECU: A Component and System Level Study

Joseph Oh, Kenneth Taylor

InterPACK 2023; V001T02A003https://doi.org/10.1115/IPACK2023-110688

Abstract

View Articletitled, Numerical Modeling of Forced Air Convection for Thermal Management in Automotive ECU: A Component and System Level Study

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Topics: Computer simulation , Convection , Cooling , Heat sinks , Heat transfer , Thermal management

Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core

Pratik Bansode, Mohan Sai Ramalingam, Rohit Suthar, Rabin Bhandari, Akshay Boovanahally Lakshminarayana, Gautam Gupta, Vibin Shalom Simon, Himanshu Modi, Vivek Nair, Krishna Bhavana Sivaraju, Pardeep Shahi, Satyam Saini, Dereje Agonafer

InterPACK 2023; V001T02A004https://doi.org/10.1115/IPACK2023-111056

Abstract

View Articletitled, Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core

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Topics: Cooling , Thermomechanics

Convection Cooling of Power Electronics Operating in Deep-Space

Jessica Harsono, Joseph P. Kozak, Hala Tomey, William Yerkes, Jonathan Neville

InterPACK 2023; V001T02A005https://doi.org/10.1115/IPACK2023-111414

Abstract

View Articletitled, Convection Cooling of Power Electronics Operating in Deep-Space

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Topics: Convection , Cooling , Electronics , Forced convection , Thermal management , Rotors , Temperature , Electronic packaging , Fans , Flow (Dynamics)

Study of Reliable Chip Last Process for Fan Out Wafer Level Package

Shuai-Lin Liu, Nicholas Kao, Vito Lin, Ken Zhang, Yu-Po Wang

InterPACK 2023; V001T02A006https://doi.org/10.1115/IPACK2023-111450

Abstract

View Articletitled, Study of Reliable Chip Last Process for Fan Out Wafer Level Package

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Topics: Package on package , Packaging , Semiconductor wafers

Performance of SAC305 Solder Joints Under Simultaneous Tensile and Electromigration Stressing

Whit Vinson, David Huitink

InterPACK 2023; V001T02A007https://doi.org/10.1115/IPACK2023-111909

Abstract

View Articletitled, Performance of SAC305 Solder Joints Under Simultaneous Tensile and Electromigration Stressing

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Topics: Electrodiffusion , Failure , Solder joints , Solders , Stress

Design and Fabrication of an Inverter Module Co-Designed With the Busbar and Gate Driver

Aishworya Roy, Christina DiMarino, Jesi Miranda-Santos

InterPACK 2023; V001T02A008https://doi.org/10.1115/IPACK2023-111921

Abstract

View Articletitled, Design and Fabrication of an Inverter Module Co-Designed With the Busbar and Gate Driver

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Topics: Design , Gates (Closures) , Manufacturing , Cooling , Bridges (Structures) , Electric vehicles , Energy dissipation , Heat , Junctions , MOSFET transistors

Condition Monitoring of Semiconductors Using Wide Band Acoustic Emission Sensors

Josef Frankhouse, Jackson Marsh, Han Hu

InterPACK 2023; V001T02A009https://doi.org/10.1115/IPACK2023-111922

Abstract

View Articletitled, Condition Monitoring of Semiconductors Using Wide Band Acoustic Emission Sensors

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Topics: Acoustic emissions , Condition monitoring , Semiconductors (Materials) , Sensors , Electric vertical take-off and landing aircraft , Electronics , Aircraft , Density , Electric vehicles , Electromagnetic interference

Study of Flow-Dependent Characteristics of HFE 7500 Coolant Dielectric Strength

Bryan Tunon, David Huitink

InterPACK 2023; V001T02A010https://doi.org/10.1115/IPACK2023-111951

Abstract

View Articletitled, Study of Flow-Dependent Characteristics of HFE 7500 Coolant Dielectric Strength

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Topics: Coolants , Flow (Dynamics) , Human failure events , Fluids , Electrodes , Needles , Cooling , Pressure , Electronics , Gages

Evolution in Lead-Free Solder Alloys Subjected to Both Mechanical Cycling and Aging

Mahbub Alam Maruf, Golam Rakib Mazumder, Souvik Chakraborty, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2023; V001T02A011https://doi.org/10.1115/IPACK2023-112023

Abstract

View Articletitled, Evolution in Lead-Free Solder Alloys Subjected to Both Mechanical Cycling and Aging

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Topics: Alloys , Lead-free solders , Nanoindentation

Incorporation of Damage in Creep Models for SAC305 Lead Free Solder

Golam Rakib Mazumder, Souvik Chakraborty, Mahbub Alam Maruf, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2023; V001T02A012https://doi.org/10.1115/IPACK2023-112030

Abstract

View Articletitled, Incorporation of Damage in Creep Models for SAC305 Lead Free Solder

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Topics: Creep , Damage , Energy dissipation , Lead-free solders

Effects of Grain to Sample Volume Ratio on the Deformation Behavior of Polycrystal SAC Samples Subjected to Shear Loads

Debabrata Mondal, Jeffrey C. Suhling, Elham Mirkoohi, Pradeep Lall

InterPACK 2023; V001T02A013https://doi.org/10.1115/IPACK2023-112034

Abstract

View Articletitled, Effects of Grain to Sample Volume Ratio on the Deformation Behavior of Polycrystal SAC Samples Subjected to Shear Loads

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Topics: Crystals , Deformation , Dislocations , Plasticity , Shear (Mechanics) , Stress

Comparative Finite Element Analyses of the Thermal Cycling Performances of BGA Packages With SAC, LTS, and Mixed SAC-LTS Solder Joints

Souvik Chakraborty, Debabrata Mondal, Golam Rakib Mazumder, Mahbub Alam Maruf, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2023; V001T02A014https://doi.org/10.1115/IPACK2023-112041

Abstract

View Articletitled, Comparative Finite Element Analyses of the Thermal Cycling Performances of BGA Packages With SAC, LTS, and Mixed SAC-LTS Solder Joints

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Topics: Ball-Grid-Array packages , Ball-Grid-Array packaging , Fatigue life , Finishes , Finite element analysis , Reliability , Solder joints

Effects of Pores on Crack Propagation in Sintered-Silver Die Attach: A Baseline Model

Emmanuel Arriola, Guo-Quan Lu, Aristotle Ubando

InterPACK 2023; V001T02A015https://doi.org/10.1115/IPACK2023-113208

Abstract

View Articletitled, Effects of Pores on Crack Propagation in Sintered-Silver Die Attach: A Baseline Model

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Topics: Crack propagation , Reliability , Silver

Characterization of SAC305 Solder Joints Under Elevated Current, Temperature, and Varying Shear Stress Conditions

Collin Ruby, David R. Huitink

InterPACK 2023; V001T02A016https://doi.org/10.1115/IPACK2023-113756

Abstract

View Articletitled, Characterization of SAC305 Solder Joints Under Elevated Current, Temperature, and Varying Shear Stress Conditions

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Topics: Reliability , Shear stress , Solder joints , Stress , Temperature

Reliability of Copper Inverse Opal Surfaces for Extreme-Heat-Flux Micro-Coolers in Low-Global-Warming-Potential Refrigerant R-1233zd Pool Boiling Experiments

Bidzina Kekelia, Qianying Wu, Sreekant Narumanchi, Joshua Major, Gilbert Moreno, Mehdi Asheghi, Ercan M. Dede, James Palko, Kenneth Goodson

InterPACK 2023; V001T02A017https://doi.org/10.1115/IPACK2023-113781

Abstract

View Articletitled, Reliability of Copper Inverse Opal Surfaces for Extreme-Heat-Flux Micro-Coolers in Low-Global-Warming-Potential Refrigerant R-1233zd Pool Boiling Experiments

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Topics: Copper , Critical heat flux , Data centers , Heat , Heat transfer , Microcoolers , Pool boiling , Refrigerants , Reliability

Enhancing Mechanical Reliability of Silver Sintered Joints With Copper Nanowires in High-Power Electronic Devices

Alicia Medina Garcia, John Harris, David R. Huitink

InterPACK 2023; V001T02A018https://doi.org/10.1115/IPACK2023-113792

Abstract

View Articletitled, Enhancing Mechanical Reliability of Silver Sintered Joints With Copper Nanowires in High-Power Electronic Devices

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Topics: Copper , Nanowires , Reliability , Silver , Mechanical properties , High temperature , Resilience , Shear strength , Shear stress , Temperature

Development of Thermal Metrology Standards for Experimental Characterization of Thermal Resistance for Single-Phase Liquid Cold Plates

Alfonso Ortega, Victor A. Martinez, Carol Caceres, Ali Heydari, Uschas Chowdhury

InterPACK 2023; V001T02A019https://doi.org/10.1115/IPACK2023-113883

Abstract

View Articletitled, Development of Thermal Metrology Standards for Experimental Characterization of Thermal Resistance for Single-Phase Liquid Cold Plates

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Topics: Experimental characterization , Metrology , Plates (structures) , Temperature , Thermal resistance , Engineering simulation , Errors , Simulation , Uncertainty , Boundary-value problems

Quick Turn Methodology for High Temperature Solder Fatigue Reliability

Matthew Norris, David Huitink

InterPACK 2023; V001T02A020https://doi.org/10.1115/IPACK2023-113999

Abstract

View Articletitled, Quick Turn Methodology for High Temperature Solder Fatigue Reliability

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Topics: Fatigue , High temperature , Lead-free solders , Reliability , Solders , Cycles , Failure , Geometry , Temperature , Thermal shock

Flexible, Wearable, and Printed Electronics

Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes

Hisham Abusalma, Hayden Richards, Abhijit Dasgupta, Andres Bujanda, Jian Yu, Harvey Tsang

InterPACK 2023; V001T03A001https://doi.org/10.1115/IPACK2023-111312

Abstract

View Articletitled, Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes

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Topics: Additive manufacturing , Aerosols , Durability , Electronics , Extruding , Silver

Effect of Sintering Conditions on Electrical Resistivity of Printed Silver Inks

Hua Xu, Jeffery C. C. Lo, Xing Qiu, Yuanjie Cheng, Mian Tao, S. W. Ricky Lee, Lawrence C. L. Ko, Ho Ki Yeung, Chun Ho Yau

InterPACK 2023; V001T03A002https://doi.org/10.1115/IPACK2023-111648

Abstract

View Articletitled, Effect of Sintering Conditions on Electrical Resistivity of Printed Silver Inks

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Topics: Electrical resistivity , Electronics , Inks , Silver , Sintering

Survivability and Reliability Testing and Modeling of Printed Hybrid Electronic (PHE) Assemblies Subject to Extreme Acceleration Levels

Hayden Richards, Hisham Abusalma, Abhijit Dasgupta, Jian Yu, Andres Bujanda, Harvey Tsang

InterPACK 2023; V001T03A003https://doi.org/10.1115/IPACK2023-111895

Abstract

View Articletitled, Survivability and Reliability Testing and Modeling of Printed Hybrid Electronic (PHE) Assemblies Subject to Extreme Acceleration Levels

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Topics: Accelerated life testing , Accelerometers , Additive manufacturing , Aluminum , Circuits , Computer numerical control machine tools , Cracking (Materials) , Delamination , Domes (Structural elements) , Durability

Surface-Mount Component Attachment on Aerosol Jet Printed Sustainable Water-Base Silver Nanoparticle Ink

Pradeep Lall, Daniel Karakitie, Scott Miller

InterPACK 2023; V001T03A004https://doi.org/10.1115/IPACK2023-111957

Abstract

View Articletitled, Surface-Mount Component Attachment on Aerosol Jet Printed Sustainable Water-Base Silver Nanoparticle Ink

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Topics: Additive manufacturing , Aerosols , Circuits , Inks , Nanoparticles , Silver , Surface mount components , Sustainability , Water

Process Performance Interactions for Additively Printed Water-Based Nanoparticle Sustainable Silver-Ink With Ultrasonic Atomization on Aerosol Jet Printer

Pradeep Lall, Daniel Karakitie, Scott Miller

InterPACK 2023; V001T03A005https://doi.org/10.1115/IPACK2023-111958

Abstract

View Articletitled, Process Performance Interactions for Additively Printed Water-Based Nanoparticle Sustainable Silver-Ink With Ultrasonic Atomization on Aerosol Jet Printer

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Topics: Aerosols , Failure , Inks , Nanoparticles , Shear (Mechanics) , Silver , Stress , Sustainability , Water

Development and Reliability Evaluation of Additively Printed Biosensing Device for Wearable Applications in Harsh Environment

Pradeep Lall, Hyesoo Jang, Jinesh Narangaparambil, Curtis Hill

InterPACK 2023; V001T03A006https://doi.org/10.1115/IPACK2023-111968

Abstract

View Articletitled, Development and Reliability Evaluation of Additively Printed Biosensing Device for Wearable Applications in Harsh Environment

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Topics: Manufacturing , Reliability , Sensors , Wearable devices

Additive Printing of Wearable EDA Sensors on In-Mold Electronics on Automotive Platform

Pradeep Lall, Hyesoo Jang, Scott Miller

InterPACK 2023; V001T03A007https://doi.org/10.1115/IPACK2023-111973

Abstract

View Articletitled, Additive Printing of Wearable EDA Sensors on In-Mold Electronics on Automotive Platform

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Topics: Electronics , Manufacturing , Printing , Reliability , Sensors

Comparative Study of SMD Components Attached Using Electrically Conductive Adhesive and Magnetically Oriented Anisotropic Conductive Adhesive on Inkjet Printed Structures

Pradeep Lall, Shriram Kulkarni, Jinesh Narangaparambil, Scott Miller

InterPACK 2023; V001T03A008https://doi.org/10.1115/IPACK2023-111979

Abstract

View Articletitled, Comparative Study of SMD Components Attached Using Electrically Conductive Adhesive and Magnetically Oriented Anisotropic Conductive Adhesive on Inkjet Printed Structures

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Topics: Adhesives , Anisotropy , Surface mount devices

Line Width and Electrical Performance Prediction for Inkjet Printed Conductors-Resistors-Inductors-Capacitors

Pradeep Lall, Shriram Kulkarni, Ved Soni, Scott Miller

InterPACK 2023; V001T03A009https://doi.org/10.1115/IPACK2023-111980

Abstract

View Articletitled, Line Width and Electrical Performance Prediction for Inkjet Printed Conductors-Resistors-Inductors-Capacitors

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Topics: Capacitors , Inductors , Resistors , Printing , Circuits , Drops , Electronics , Inks , Particulate matter , Resolution (Optics)

Sustainable Silver Ink Flexible Circuits Fabrication Using Direct Write Additive Manufacturing Techniques

Pradeep Lall, Fatahi Musa, Ved Soni, Scott Miller

InterPACK 2023; V001T03A010https://doi.org/10.1115/IPACK2023-112001

Abstract

View Articletitled, Sustainable Silver Ink Flexible Circuits Fabrication Using Direct Write Additive Manufacturing Techniques

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Topics: Additive manufacturing , Filters , Flexible electronics , Inks , Manufacturing , Silver , Sustainability , Circuits , Surface mount components , Biodegradable materials

Impact of Component Interconnectivity on Mechanical and Electrical Properties of Flexible Hybrid Electronics with Printed Water-based Silver Ink Circuits

Pradeep Lall, Fatahi Musa, Ved Soni, Scott Miller

InterPACK 2023; V001T03A011https://doi.org/10.1115/IPACK2023-112012

Abstract

View Articletitled, Impact of Component Interconnectivity on Mechanical and Electrical Properties of Flexible Hybrid Electronics with Printed Water-based Silver Ink Circuits

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Topics: Bonding , Circuits , Electrical properties , Electronics , Inks , Silver , Water , Adhesives , Low temperature , Solders

Comparison of Machine Learning Approaches for Correlating Print Process Parameters to Realized Physical and Electrical Characteristics of Printed Electronics Using Inkjet Platform

Pradeep Lall, Ved Soni, Shriram Kulkarni, Scott Miller

InterPACK 2023; V001T03A012https://doi.org/10.1115/IPACK2023-112056

Abstract

View Articletitled, Comparison of Machine Learning Approaches for Correlating Print Process Parameters to Realized Physical and Electrical Characteristics of Printed Electronics Using Inkjet Platform

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Topics: Electronics , Machine learning , Printing

Evaluation of Additive Circuits Printed With Sustainable Aqueous Silver Inks Using Aerosol Jet Printing and Gravure Offset Printing and Investigation of Circuit Repairability

Pradeep Lall, Ved Soni, Scott Miller

InterPACK 2023; V001T03A013https://doi.org/10.1115/IPACK2023-112058

Abstract

View Articletitled, Evaluation of Additive Circuits Printed With Sustainable Aqueous Silver Inks Using Aerosol Jet Printing and Gravure Offset Printing and Investigation of Circuit Repairability

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Topics: Aerosols , Batteries , Circuits , Electronics , Inks , Offset printing , Printing , Silver , Sustainability

Evaluation of Thermoformability of Additively Printed Circuits Printed Using Gravure Offset Printing Technique and Investigation of In-Mold Electronic Circuits

Pradeep Lall, Ved Soni, Jinesh Narangaparambil, Scott Miller

InterPACK 2023; V001T03A014https://doi.org/10.1115/IPACK2023-112060

Abstract

View Articletitled, Evaluation of Thermoformability of Additively Printed Circuits Printed Using Gravure Offset Printing Technique and Investigation of In-Mold Electronic Circuits

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Topics: Circuits , Electronic circuits , Electronics , Offset printing

Repairability of SMDs on 3D Printed Circuitry for Sustainable Electronics Utilizing Direct Write Technique

Pradeep Lall, Md Golam Sarwar, Ved Soni, Scott Miller

InterPACK 2023; V001T03A015https://doi.org/10.1115/IPACK2023-112061

Abstract

View Articletitled, Repairability of SMDs on 3D Printed Circuitry for Sustainable Electronics Utilizing Direct Write Technique

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Topics: Additive manufacturing , Adhesives , Electronics , Flexible electronics , Printing , Surface mount devices , Sustainability

Direct Write Thermoformed Additive Silver Circuits With SMDs Attachment for In-Mold Electronics

Pradeep Lall, Md Golam Sarwar, Ved Soni, Scott Miller

InterPACK 2023; V001T03A016https://doi.org/10.1115/IPACK2023-112063

Abstract

View Articletitled, Direct Write Thermoformed Additive Silver Circuits With SMDs Attachment for In-Mold Electronics

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Topics: Circuits , Electronics , Printing , Silver , Surface mount devices

Reparability Test of Aerosol-Jet Printed Sustainable Silver Ink Circuit

Pradeep Lall, Sabina Bimali, Scott Miller

InterPACK 2023; V001T03A017https://doi.org/10.1115/IPACK2023-112064

Abstract

View Articletitled, Reparability Test of Aerosol-Jet Printed Sustainable Silver Ink Circuit

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Topics: Adhesives , Aerosols , Circuits , Failure , Inks , Shear (Mechanics) , Silver , Stress , Sustainability

Component Attach Process Recipe and Performance on Aerosol Printed Sustainable Silver Ink

Pradeep Lall, Sabina Bimali, Jinesh Narangaparambil, Scott Miller

InterPACK 2023; V001T03A018https://doi.org/10.1115/IPACK2023-112066

Abstract

View Articletitled, Component Attach Process Recipe and Performance on Aerosol Printed Sustainable Silver Ink

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Topics: Adhesives , Aerosols , Failure , Inks , Printing , Shear (Mechanics) , Silver , Sintering , Stress , Sustainability

Functional Circuit Performance of Printable Formable Inks for In-Mold Electronics Applications

Pradeep Lall, Jinesh Narangaparambil, Ved Soni, Scott Miller

InterPACK 2023; V001T03A019https://doi.org/10.1115/IPACK2023-112069

Abstract

View Articletitled, Functional Circuit Performance of Printable Formable Inks for In-Mold Electronics Applications

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Topics: Adhesives , Circuits , Electronics , Inks , Printing

Investigation of Performance and Repairability of Additively Printed Functional Circuits With Water-Based Silver Ink on an Inkjet Platform

Pradeep Lall, Shriram Kulkarni, Scott Miller

InterPACK 2023; V001T03A020https://doi.org/10.1115/IPACK2023-114686

Abstract

View Articletitled, Investigation of Performance and Repairability of Additively Printed Functional Circuits With Water-Based Silver Ink on an Inkjet Platform

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Topics: Circuits , Inks , Silver , Water , Printing , Manufacturing , Adhesives , Electronic circuits , Electronics , Filters

Heterogeneous Integration

Computational Analysis of Thermal Performance of Water-Cooled Cold Plate for Chips With Hotspots

Mahdi Farahikia, Ping-Chuan Wang

InterPACK 2023; V001T04A001https://doi.org/10.1115/IPACK2023-111725

Abstract

View Articletitled, Computational Analysis of Thermal Performance of Water-Cooled Cold Plate for Chips With Hotspots

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Topics: Additive manufacturing , Pressure drop , Temperature uniformity , Thermal management , Water , Temperature , Temperature distribution , Heat transfer , Integrated circuits , Laminar flow

Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multi-Chip Module

Ahmad R. Gharaibeh, Qusai Soud, Yaman Manaserh, Mohammad Tradat, Bahgat Sammakia

InterPACK 2023; V001T04A002https://doi.org/10.1115/IPACK2023-112452

Abstract

View Articletitled, Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multi-Chip Module

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Topics: Cooling , Heat sinks , Multi-chip modules

Multiscale Thermal Transport and Energy Storage

Thermal Property Estimation of Thin Layered Structures by Means of Thermoreflectance Measurement and NID Algorithm

Daiki Higuma, João Vitor Thomsen Silveira, Kazuyoshi Fushinobu

InterPACK 2023; V001T06A001https://doi.org/10.1115/IPACK2023-111269

Abstract

View Articletitled, Thermal Property Estimation of Thin Layered Structures by Means of Thermoreflectance Measurement and NID Algorithm

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Topics: Algorithms , Thermal properties , Thermoreflectance

Thermal and Hydraulic Performance Analyses of Machined and Hybrid Printed Oblique-Fin Cold Plates

Matthew Law, Sin Liang Soh, Wei Wang, Poh Seng Lee, Wen Feng Lu

InterPACK 2023; V001T06A002https://doi.org/10.1115/IPACK2023-111575

Abstract

View Articletitled, Thermal and Hydraulic Performance Analyses of Machined and Hybrid Printed Oblique-Fin Cold Plates

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Topics: Additive manufacturing , Fins , Plates (structures) , Printing , Surface roughness , Thermal resistance , Cooling , Graphics processing units , Copper , Machining

Evolution of Physical Properties of Liquid Film During Evaporation Process: Drying and Evaporation Process of Inkjet Liquid Film

Keisuke Kichise, Yoshihiro Harada, Shinichi Kuramoto, Masami Kadonaga, Kazuyoshi Fushinobu, Koichi Kato

InterPACK 2023; V001T06A003https://doi.org/10.1115/IPACK2023-111660

Abstract

View Articletitled, Evolution of Physical Properties of Liquid Film During Evaporation Process: Drying and Evaporation Process of Inkjet Liquid Film

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Topics: Drying , Dynamic light scattering , Evaporation , Liquid films , Viscosity , Inks , Lubrication theory , Drops , Heat , Mass transfer

Wetting Behavior of Droplet on Inclined Surface: From Inkjet Printing on Non-Paper Media

Riki Kawano, Kimiharu Yamazaki, Shinichi Kuramoto, Koichi Kato, Kazuyoshi Fushinobu

InterPACK 2023; V001T06A004https://doi.org/10.1115/IPACK2023-111666

Abstract

View Articletitled, Wetting Behavior of Droplet on Inclined Surface: From Inkjet Printing on Non-Paper Media

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Topics: Drops , Printing , Viscosity , Wetting

Boiling Limit on Textured Oil-Impregnated Surfaces

Yimin Zhou, Solomon Adera

InterPACK 2023; V001T06A005https://doi.org/10.1115/IPACK2023-111736

Abstract

View Articletitled, Boiling Limit on Textured Oil-Impregnated Surfaces

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Topics: Boiling , Bubbles , Critical heat flux , Pool boiling , Thermal management , Vapors , Heat , Copper , Delays , Failure

Experimental Validation of a Heuristic Control Strategy for a Transient Thermal Management System With Latent Thermal Energy Storage

Michael Shanks, Uduak Inyang-Udoh, Neera Jain

InterPACK 2023; V001T06A006https://doi.org/10.1115/IPACK2023-111816

Abstract

View Articletitled, Experimental Validation of a Heuristic Control Strategy for a Transient Thermal Management System With Latent Thermal Energy Storage

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Topics: Thermal energy storage , Thermal management , Transients (Dynamics) , Control equipment , Heat , Simulation , Architecture , Computer cooling , Feedback , Fluids

Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies

Sagar Singh, Mostafa Olyaei, Katherine Jiang, Yashraj Gurumukhi, Kenneth Goodson, Mehdi Asheghi, Nenad Miljkovic

InterPACK 2023; V001T06A007https://doi.org/10.1115/IPACK2023-111825

Abstract

View Articletitled, Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies

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Topics: Batteries , Cooling , Event history analysis , Thermal management

Development of Ceramic Pulsating Heat Pipes for Medium-Voltage Power Electronics

Ramy Abdelmaksoud, Jeffrey Diebold, Sai Kiran Hota, Kuan-Lin Lee, Shivangi Sinha, Dragan Maksimovic

InterPACK 2023; V001T06A008https://doi.org/10.1115/IPACK2023-111917

Abstract

View Articletitled, Development of Ceramic Pulsating Heat Pipes for Medium-Voltage Power Electronics

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Topics: Ceramics , Electronics , Heat pipes , Thermal management

Thermal and Electrical Performance of Silicone Gel Insulation With Encapsulated Phase Change Material Additives

Joshua Kasitz, Muhammad Ghufran, David Huitink

InterPACK 2023; V001T06A009https://doi.org/10.1115/IPACK2023-111964

Abstract

View Articletitled, Thermal and Electrical Performance of Silicone Gel Insulation With Encapsulated Phase Change Material Additives

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Topics: Composite materials , Cooling , Insulation , Phase change materials , Silicones

Power/RF Electronics and Photonics

Additively Manufactured Hybrid Two-Phase Cold Plate

Mohammad Reza Shaeri, Richard Bonner, Jana Catuche

InterPACK 2023; V001T07A001https://doi.org/10.1115/IPACK2023-109991

Abstract

View Articletitled, Additively Manufactured Hybrid Two-Phase Cold Plate

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Topics: Additive manufacturing , Cooling , Thermal management

Design of Power Transistor Embedded in PCB Supported by 3D Simulations

Aleš Chvála, Juraj Marek, Alexander Šatka, Jue Chen

InterPACK 2023; V001T07A002https://doi.org/10.1115/IPACK2023-111389

Abstract

View Articletitled, Design of Power Transistor Embedded in PCB Supported by 3D Simulations

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Topics: Design , Printed circuit boards , Simulation , Transistors

Prediction of the Localized Heating-Induced Size Effects in Semiconductors Based on the Heat Generation Characteristics and the Material Thermophysical Properties

Amir Abdolhosseinzadeh, Emine Goktepe, Nazli Donmezer

InterPACK 2023; V001T07A003https://doi.org/10.1115/IPACK2023-111501

Abstract

View Articletitled, Prediction of the Localized Heating-Induced Size Effects in Semiconductors Based on the Heat Generation Characteristics and the Material Thermophysical Properties

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Topics: Heat , Heating , Phonons , Semiconductors (Materials)

Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick DBC Substrates for Power Electronics

Margie Guerrero, Pedro Quintero, Ozan Cagatay Ozdemir

InterPACK 2023; V001T07A004https://doi.org/10.1115/IPACK2023-111534

Abstract

View Articletitled, Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick DBC Substrates for Power Electronics

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Topics: Ceramics , Copper , Electronics , Plasma spraying , Spraying (Coating processes) , Coatings , Sprays , Surface roughness , Electronic packaging , Additive manufacturing

Investigation of Silicon Carbide Embedded Cooling Technology for Compact Electronic Systems

Jarred Wilhite, Chirag Kharangate

InterPACK 2023; V001T07A005https://doi.org/10.1115/IPACK2023-111613

Abstract

View Articletitled, Investigation of Silicon Carbide Embedded Cooling Technology for Compact Electronic Systems

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Topics: Cooling , Electronic systems , Silicon carbide

Variable Area Jet Impingement for High Voltage Power Electronics

Reece Whitt, David Huitink

InterPACK 2023; V001T07A006https://doi.org/10.1115/IPACK2023-111996

Abstract

View Articletitled, Variable Area Jet Impingement for High Voltage Power Electronics

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Topics: Electronics , Nozzles , Convection , Coolants , Cooling , Flow (Dynamics) , Impingement cooling , Reliability , Temperature , Transients (Dynamics)

Development of Thermal Interface Materials Tape Using Vertically Aligned Copper Nanowire-PDMS Composites

Hansen Qiao, Katherine Jiang, Tiwei Wei, Yujui Lin, Chris Perez, Mehdi Asheghi, Kenneth Goodson

InterPACK 2023; V001T07A007https://doi.org/10.1115/IPACK2023-113126

Abstract

View Articletitled, Development of Thermal Interface Materials Tape Using Vertically Aligned Copper Nanowire-PDMS Composites

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Topics: Composite materials , Copper , Nanowires , Plasma desorption mass spectrometry

Transportation Systems, AI and Machine Learning

Explainable Machine Learning Approach to Yield and Quality Improvements Using Deep Topological Data Analytics

Janhavi Giri, Attila Lengyel

InterPACK 2023; V001T08A001https://doi.org/10.1115/IPACK2023-111525

Abstract

View Articletitled, Explainable Machine Learning Approach to Yield and Quality Improvements Using Deep Topological Data Analytics

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Topics: Machine learning , Manufacturing , Semiconductor wafers , Topology

Prediction of Pad Cratering Performance at Copper-Resin Interfaces With Multiple Reflows

Pradeep Lall, Aathi Raja Ram Pandurangan, Padmanava Choudhury

InterPACK 2023; V001T08A002https://doi.org/10.1115/IPACK2023-111925

Abstract

View Articletitled, Prediction of Pad Cratering Performance at Copper-Resin Interfaces With Multiple Reflows

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Topics: Copper , Fracture (Materials) , Fracture (Process) , Resins

Enhancing Manual Visual Inspection Process by Using OpenCV AI and Anomalib for Defect Detection in Automotive Assembly and Manufacturing Process

Stewart Christie, Anna Prakash, Elaina Ashton, Veronica Tanner

InterPACK 2023; V001T08A003https://doi.org/10.1115/IPACK2023-111936

Abstract

View Articletitled, Enhancing Manual Visual Inspection Process by Using OpenCV AI and Anomalib for Defect Detection in Automotive Assembly and Manufacturing Process

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Topics: Artificial intelligence , Flaw detection , Manufacturing , Optical quality control , Errors , Computers , Electronics , Flat heat pipes , Inspection , Laptop computers

Prediction of Failure at FCBGA Interfaces Under Thermo-Mechanical Loads Using a Competing Risk Cohesive Zone Model

Pradeep Lall, Aathi Raja Ram Pandurangan, Madhu Katsuri

InterPACK 2023; V001T08A004https://doi.org/10.1115/IPACK2023-111937

Abstract

View Articletitled, Prediction of Failure at FCBGA Interfaces Under Thermo-Mechanical Loads Using a Competing Risk Cohesive Zone Model

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Topics: Architecture , Automobiles , Ball-Grid-Array packaging , Delamination , Electronics , Engines , Failure , Failure mechanisms , Fatigue , Finite element model

Predictive Modeling of High-G Potted Assemblies With Fine Pitch Electronics After Sustained High-Temperature Exposure

Pradeep Lall, Aathi Raja Ram Pandurangan, Ken Blecker

InterPACK 2023; V001T08A005https://doi.org/10.1115/IPACK2023-111950

Abstract

View Articletitled, Predictive Modeling of High-G Potted Assemblies With Fine Pitch Electronics After Sustained High-Temperature Exposure

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Topics: Delamination , Electronics , High temperature , Modeling , Shock (Mechanics)

Effect of Thermal Cycling on Interfacial Fracture Toughness of Electronic Mold Compound-to-Substrate Interface Subjected to Monotonic and Fatigue Loading

Pradeep Lall, Madhu Kasturi

InterPACK 2023; V001T08A006https://doi.org/10.1115/IPACK2023-111976

Abstract

View Articletitled, Effect of Thermal Cycling on Interfacial Fracture Toughness of Electronic Mold Compound-to-Substrate Interface Subjected to Monotonic and Fatigue Loading

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Topics: Fatigue , Fracture (Materials) , Fracture toughness

Evolution of Thermal Interface Material-to-Copper Interfacial Fracture Toughness Subjected to Monotonic and Fatigue Loading After Thermal Cycling

Pradeep Lall, Madhu Kasturi

InterPACK 2023; V001T08A007https://doi.org/10.1115/IPACK2023-111977

Abstract

View Articletitled, Evolution of Thermal Interface Material-to-Copper Interfacial Fracture Toughness Subjected to Monotonic and Fatigue Loading After Thermal Cycling

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Topics: Copper , Fatigue , Fracture (Materials) , Fracture toughness

High-G Level Shock Damage-Accrual in Doped/Undoped SnAgCu Solders Under 100°C Sustained Operation Up to 1-Year

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker

InterPACK 2023; V001T08A008https://doi.org/10.1115/IPACK2023-111981

Abstract

View Articletitled, High-G Level Shock Damage-Accrual in Doped/Undoped SnAgCu Solders Under 100°C Sustained Operation Up to 1-Year

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Topics: Damage , Shock (Mechanics) , Solders , Temperature , Viscoplasticity

Study of Sustained High-Temperature on the Reliability of Lead-Free Solder Joint Assemblies Under Vibration

Pradeep Lall, Vishal Mehta, Jeff Suhling, David Locker

InterPACK 2023; V001T08A009https://doi.org/10.1115/IPACK2023-111984

Abstract

View Articletitled, Study of Sustained High-Temperature on the Reliability of Lead-Free Solder Joint Assemblies Under Vibration

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Topics: Finite element analysis , High temperature , Lead-free solders , Reliability , Solders , Temperature , Testing , Vibration , Viscoplasticity

Assessment of Propensity for Pad Cratering at the Board Resin-Glass Interface Under Assembly and Rework

Pradeep Lall, Padmanava Choudhury, Aathi Raja Ram Pandurangan

InterPACK 2023; V001T08A010https://doi.org/10.1115/IPACK2023-112014

Abstract

View Articletitled, Assessment of Propensity for Pad Cratering at the Board Resin-Glass Interface Under Assembly and Rework

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Topics: Elastic moduli , Glass , Manufacturing , Resins , Stress , Tensile strength

Assessment of Effect of Operating Temperature on SAC-R Solders at High Strain Rates After Prolonged Storage

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, David Locker

InterPACK 2023; V001T08A011https://doi.org/10.1115/IPACK2023-112036

Abstract

View Articletitled, Assessment of Effect of Operating Temperature on SAC-R Solders at High Strain Rates After Prolonged Storage

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Topics: Operating temperature , Solders , Storage , Alloys , Constitutive equations , Shock (Mechanics) , Temperature , Aerospace industry , Automobiles , Climate

Propensity for Fatigue Failure of the FCBGA UF-Substrate Interface After Prolonged Storage

Pradeep Lall, Padmanava Choudhury

InterPACK 2023; V001T08A012https://doi.org/10.1115/IPACK2023-112052

Abstract

View Articletitled, Propensity for Fatigue Failure of the FCBGA UF-Substrate Interface After Prolonged Storage

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Topics: Fatigue failure , Storage , Failure , Reliability , Electronics , Temperature , Cycles , Fatigue , Flip-chip , Stress

Polarization Curves, Package-Level Multiphysics Simulation of Cu₈₅Al₁₅ and Cu₉₄Al₆ WB Corrosion for Automotive and Rugged Environment Applications

Pradeep Lall, Sungmo Jung

InterPACK 2023; V001T08A013https://doi.org/10.1115/IPACK2023-112067

Abstract

View Articletitled, Polarization Curves, Package-Level Multiphysics Simulation of Cu85Al15 and Cu94Al6 WB Corrosion for Automotive and Rugged Environment Applications

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Topics: Corrosion , Polarization (Electricity) , Polarization (Light) , Polarization (Waves) , Simulation

Effect of Surface Treatment on the Fatigue Crack Propagation in a TIM/Copper Interface Subjected to High-Temperature Long-Term Exposure

Pradeep Lall, Yunli Zhang

InterPACK 2023; V001T08A014https://doi.org/10.1115/IPACK2023-112070

Abstract

View Articletitled, Effect of Surface Treatment on the Fatigue Crack Propagation in a TIM/Copper Interface Subjected to High-Temperature Long-Term Exposure

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Topics: Copper , Delamination , Fatigue , Fatigue cracks , Fracture (Materials) , Fracture toughness , High temperature , Stress , Surface finishing , Low cycle fatigue

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