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Keywords: multiphysics
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Proceedings Papers
Chongyang Cai, Jiefeng Xu, Yangyang Lai, Junbo Yang, Huayan Wang, Suresh Ramalingam, Gamal Refai-Ahmed, Seungbae Park
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97338
..., electromigration is a Multiphysics phenomenon that couples not only electric and thermal fields but also includes atomic diffusion and stress migration. To simulate the actual migration behavior, the influence of different physic fields needs to be considered. In this paper, we employed different physics fields...
Proceedings Papers
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A004, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97355
..., we develop a design space to correlate input and output parameters to generate response surfaces. We then use a multi-objective genetic algorithm-based optimization method to minimize the maximum junction temperature and thermal stresses within the power module. The multiphysics co-optimization...