... Abstract In this study, a control group of aluminum wire bonds is compared against a group of autocatalytically (electroless) nickel plated aluminum wire bonds in terms of fuse current and electromigration performance. Fuse current testing results demonstrated a negative relationship between...

... transmittance. In general, the density of electric current flowing through the interconnect line increases as devices become smaller. The increase in density of electric current leads to problems of line failure due to electromigration (EM), and it is known that resistance EM damage can be improved...

... Abstract The results contained within this paper examine the combined influence of electromigration stressors (elevated current density and elevated ambient temperature) and tensile stress on the lifetime of SAC305 solder joints (300[μm] diameter) compared to either individual stress condition...

... Abstract With the minimization trend of component size, electromigration is becoming an increasingly important concern. Current studies mainly focused on predicting the EM time to failure (TTF) based on Black’s equation. By simulating the current and temperature, TTF of test structures can...

... Abstract Numerical analysis of electromigration in solder joints has mainly examined ball grid arrays (BGAs) in flip-chip packages, and few numerical study has been reported on solder joints in power modules. This report describes an electromigration analysis of solder joints for power modules...

... deformation and the electrical stress due to electric current. According to scaling down of electric devices, the current density and Joule heat in interconnect line increase and electromigration (EM) damage becomes a serious problem. EM is a transportation phenomenon of metallic atoms caused by electron wind...

...ELECTROMIGRATION ANALYSIS OF SOLDER JOINTS FOR POWER MODULES USING AN ELECTRICAL-THERMAL-STRESS COUPLED MODEL Mitsuaki Kato1, Takahiro Omori1, Akihiro Goryu2, Tomoya Fumikura1, Kenji Hirohata1 1Corporate Research & Development Center, Toshiba Corporation, Kawasaki-shi, Japan 2Toshiba Electronic...

...NUMERICAL INVESTIGATION ON ELECTROMIGRATION ORIENTED FAILURE OF LEAD FREE SOLDER JOINTS WITH AGING EFFECTS Tusher Ahmed1, Mohammad Motalab1, Jeffrey C. Suhling2 1 Department of Mechanical Engineering, Bangladesh University of Engineering and Technology, Dhaka 1000, Bangladesh 2 Department...

... density. As outlined in the International Technology of Roadmap for Semiconductors (ITRS), this trend makes electromigration the limiting factor in high density packages. The heightened current density and correspondingly elevated operating temperatures are a critical issue in reliability since...