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Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1313-1321, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73417
... in the International Technology of Roadmap for Semiconductors (ITRS), this trend makes electromigration the limiting factor in high density packages. The heightened current density and correspondingly elevated operating temperatures are a critical issue in reliability since these factors facilitate the effects...