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Proceedings Papers

Analysis for Evaluation of Threshold Current Density of Electromigration Damage in Taper-Shaped Metal Line

Hiroki Kikuchi, Kazuhiko Sasagawa, Kazuhiro Fujisaki
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74059
https://doi.org/10.1115/IPACK2017-74059
View Paper titled, Analysis for Evaluation of Threshold Current Density of Electromigration Damage in Taper-Shaped Metal Line
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Topics: Current density, Damage, Electrodiffusion, Metals, Evaluation methods, Atoms, Circuit design, Computer simulation, Density, Electrons
Proceedings Papers

Relationship Between Threshold Current Density of Electromigration Damage Considering Void and Hillock Formation and Reservoir Shape in Interconnect Line

Ryuji Takaya, Kazuhiko Sasagawa, Kazuhiro Fujisaki, Takeshi Moriwaki
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74092
https://doi.org/10.1115/IPACK2017-74092
View Paper titled, Relationship Between Threshold Current Density of Electromigration Damage Considering Void and Hillock Formation and Reservoir Shape in Interconnect Line
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Topics: Current density, Damage, Electrodiffusion, Reservoirs, Shapes, Density, Anodes, Computer simulation
Proceedings Papers

Reliability Implications of Thermo-Mechanically and Electrically Induced Interfacial Sliding of Through-Silicon Vias in 3D Packages

Lutz Meinshausen, Ming Liu, Tae-Kyu Lee, Indranath Dutta, Li Li
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A002, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48124
https://doi.org/10.1115/IPACK2015-48124
View Paper titled, Reliability Implications of Thermo-Mechanically and Electrically Induced Interfacial Sliding of Through-Silicon Vias in 3D Packages
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Topics: Reliability, Silicon, Finite element analysis, Finite element model, Shear stress, Temperature, Copper, Creep, Diffusion (Physics), Electrodiffusion
Proceedings Papers

DiffCode: A System for the Simulation of Diffusion Driven Phase Evolution in Solids

Subramanya Sadasiva, Ganesh Subbarayan
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A013, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48655
https://doi.org/10.1115/IPACK2015-48655
View Paper titled, DiffCode: A System for the Simulation of Diffusion Driven Phase Evolution in Solids
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Topics: Diffusion (Physics), Simulation, Solids, Stress, Electrodiffusion, Failure, Solder joints, Dynamics (Mechanics), Finite element analysis, Solders
Proceedings Papers

Improvement of Thermal Conductivity of Electroplated Copper Interconnections by Controlling Their Crystallinity

Masaru Gotoh, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A005, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48197
https://doi.org/10.1115/IPACK2015-48197
View Paper titled, Improvement of Thermal Conductivity of Electroplated Copper Interconnections by Controlling Their Crystallinity
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Topics: Copper, Thermal conductivity, Thin films, Grain boundaries, Electrical resistivity, Heating, Joules, Stress, Thermal properties, Diffusion (Physics)
Proceedings Papers

Modeling and Simulation Challenges in Embedded Two Phase Cooling: DARPA’s ICECool Program

Kaiser Matin, Avram Bar-Cohen, Joseph J. Maurer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A024, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48334
https://doi.org/10.1115/IPACK2015-48334
View Paper titled, Modeling and Simulation Challenges in Embedded Two Phase Cooling: DARPA’s ICECool Program
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Topics: Cooling, Modeling, Simulation, Critical heat flux, Corrosion, Design, Electrodiffusion, Erosion, Fluids, Gallium nitride
Proceedings Papers

Numerical Analysis of Allowable Current Density for Electromigration of Interconnect Tree Structure With Reservoir

Kazuhiro Fujisaki, Hikaru Narita, Kazuhiko Sasagawa
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A015, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48744
https://doi.org/10.1115/IPACK2015-48744
View Paper titled, Numerical Analysis of Allowable Current Density for Electromigration of Interconnect Tree Structure With Reservoir
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Topics: Current density, Electrodiffusion, Numerical analysis, Reservoirs, Tree (Data structure), Damage, Metals, Electric current, Circuits, Computer simulation
Proceedings Papers

Electrical-Thermal-Reliability Co-Design for TSV-Based 3D-ICs

Tiantao Lu, Ankur Srivastava
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A037, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48386
https://doi.org/10.1115/IPACK2015-48386
View Paper titled, Electrical-Thermal-Reliability Co-Design for TSV-Based 3D-ICs
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Topics: Design, Reliability, Finite element methods, Stress, Circuits, Design methodology, Electrodiffusion, Flow (Dynamics), Heat conduction, Optimization
Proceedings Papers

Experimental Study of Damage Mechanism of Carbon Nanotube as Nano-Component of Electronic Devices Under High Current Density

Kazuhiko Sasagawa, Kazuhiro Fujisaki, Jun Unuma, Ryota Azuma
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A003, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73130
https://doi.org/10.1115/IPACK2013-73130
View Paper titled, Experimental Study of Damage Mechanism of Carbon Nanotube as Nano-Component of Electronic Devices Under High Current Density
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Topics: Carbon nanotubes, Current density, Damage, Oxidation, Oxygen, Atoms, Carbon, Density, Electrodes, Electrodiffusion
Proceedings Papers

Effect of Oxygen Concentration on Damage Mechanism of Carbon Nanotubes Under High Current Density

Kazuhiko Sasagawa, Jun Unuma, Takehiro Abo
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 487-491, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52169
https://doi.org/10.1115/IPACK2011-52169
View Paper titled, Effect of Oxygen Concentration on Damage Mechanism of Carbon Nanotubes Under High Current Density
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Topics: Carbon nanotubes, Current density, Damage, Oxygen, Multi-walled carbon nanotubes, Oxidation, Carbon, Density, Electrodiffusion, Electrons
Proceedings Papers

Numerical Simulations of Electromigration and Stress Migration Driven Void Propagation in Pb Free Solder Interconnects

Subramanya Sadasiva, Ganesh Subbarayan, Lei Jiang, Daniel Pantuso
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 585-590, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52230
https://doi.org/10.1115/IPACK2011-52230
View Paper titled, Numerical Simulations of Electromigration and Stress Migration Driven Void Propagation in Pb Free Solder Interconnects
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Topics: Computer simulation, Electrodiffusion, Lead-free solders, Stress, Finite element analysis, Flip-chip, Solder joints, Accounting, Diffusion (Physics), Electric potential
Proceedings Papers

Study of Interfacial Reaction and Electromigration Reliability of Pb-Free Solders With Nickel Iron Barrier Layer

Minhua Lu, Paul Lauro, Charles Goldsmith
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 453-456, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52052
https://doi.org/10.1115/IPACK2011-52052
View Paper titled, Study of Interfacial Reaction and Electromigration Reliability of Pb-Free Solders With Nickel Iron Barrier Layer
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Topics: Electrodiffusion, Iron, Lead-free solders, Nickel, Reliability, Intermetallic compounds, Metallurgy, Solders, Alloys, Stability
Proceedings Papers

Electromigration in Copper-Core Solder Ball Joints During Thermal Cycle Tests

Shinichi Fujiwara, Nobuhiko Chiwata, Masaru Fujiyoshi, Motoki Wakano, Hisashi Tanie
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 719-723, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52110
https://doi.org/10.1115/IPACK2011-52110
View Paper titled, Electromigration in Copper-Core Solder Ball Joints During Thermal Cycle Tests
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Topics: Copper, Cycles, Electrodiffusion, Solders, Intermetallic compounds, Solder joints, Current density, Joining, Reliability, Accelerated life testing
Proceedings Papers

Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections

Naokazu Murata, Naoki Saito, Kinji Tamakawa, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 677-684, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52048
https://doi.org/10.1115/IPACK2011-52048
View Paper titled, Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections
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Topics: Copper, Electrical properties, Grain boundaries, Thin films, Fracture (Materials), Annealing, Reliability, Brittle fracture, Electron backscatter diffraction, Stress
Proceedings Papers

Stress-Induced and Electro-Migration of Electroplated Copper Thin Film Interconnections Used for 3D Integration

Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 685-690, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52058
https://doi.org/10.1115/IPACK2011-52058
View Paper titled, Stress-Induced and Electro-Migration of Electroplated Copper Thin Film Interconnections Used for 3D Integration
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Topics: Copper, Electrodiffusion, Stress, Thin films, Atoms, Sulfur, Current density, Electroplating, Fracture (Materials), Fracture (Process)
Proceedings Papers

IC-Package Thermal Co-Analysis in 3D IC Environment

Stephen H. Pan, Norman Chang, Ji Zheng
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 335-341, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52240
https://doi.org/10.1115/IPACK2011-52240
View Paper titled, IC-Package Thermal Co-Analysis in 3D IC Environment
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Topics: Design, Electrodiffusion, Leakage, Power density, Reliability, Temperature, Temperature distribution
Proceedings Papers

Numerical Simulation of Threshold Current Density of Electromigration Damage in Cu Interconnect Tree

Kazuhiko Sasagawa, Akihiko Kirita, Takehiro Abo, Abdul Hafiz Nor Hassan
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 119-124, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89229
https://doi.org/10.1115/InterPACK2009-89229
View Paper titled, Numerical Simulation of Threshold Current Density of Electromigration Damage in Cu Interconnect Tree
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Topics: Computer simulation, Current density, Damage, Electrodiffusion, Reliability, Atoms, Electrons, Evaluation methods, Integrated circuits, Silicon
Proceedings Papers

Full Field Joule Heating Measurement of Copper Plate Using Phase Shifting Moire´ Interferometry in Microscopic Scale

Bicheng Chen, Cemal Basaran
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 193-200, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89014
https://doi.org/10.1115/InterPACK2009-89014
View Paper titled, Full Field Joule Heating Measurement of Copper Plate Using Phase Shifting Moire´ Interferometry in Microscopic Scale
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Topics: Copper, Heating, Interferometry, Joules, Heat, Current density, Design, Electrodiffusion, Electronic packaging, Energy dissipation
Proceedings Papers

Solder Joint Electromigration Mechanisms

Pilin Liu, Fan-yi Ouyang, Shenquan Ou, Zezhong Fu, Goyal Deepak
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 703-709, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89023
https://doi.org/10.1115/InterPACK2009-89023
View Paper titled, Solder Joint Electromigration Mechanisms
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Topics: Electrodiffusion, Solder joints, Nucleation (Physics), Failure mechanisms, Warping
Proceedings Papers

Evaluating the Dominant Factor for Electromigration in High Purities Al Film Deposited by Sputtering

Xu Zhao, Masumi Saka, Mitsuo Yamashita, Fumiaki Togoh
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 397-400, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89282
https://doi.org/10.1115/InterPACK2009-89282
View Paper titled, Evaluating the Dominant Factor for Electromigration in High Purities Al Film Deposited by Sputtering
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Topics: Electrodiffusion, Sputtering (Irradiation), Diffusion (Physics), Grain size, Temperature, Ceramics, Current density, Electron field emission, Focused ion beams, Materials properties