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Proceedings Papers

Sustainable Production of Rotationally Symmetrical Components: Approaches to Resource Saving on Tool and Workpiece

Pascal Volke, Gabriel Brock, Sebastian Berger, Jannis Saelzer, Jan Nickel, Dirk Biermann
Proc. ASME. IMECE2022, Volume 2B: Advanced Manufacturing, V02BT02A005, October 30–November 3, 2022
Paper No: IMECE2022-95378
DOI: https://doi.org/10.1115/IMECE2022-95378
View Paper titled, Sustainable Production of Rotationally Symmetrical Components: Approaches to Resource Saving on Tool and Workpiece
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Topics: Cutting, Friction, Simulation, Sustainability, Symmetry (Physics), Wear, Additive manufacturing, Computer simulation, Cutting tools, Finite element analysis
Proceedings Papers

Thermo-Mechanical Process Modeling of Additive Friction Stir Deposition of Ti-6Al-4V Alloy

Gazi Abu Raihan, Uttam K. Chakravarty
Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T04A018, October 30–November 3, 2022
Paper No: IMECE2022-94717
DOI: https://doi.org/10.1115/IMECE2022-94717
View Paper titled, Thermo-Mechanical Process Modeling of Additive Friction Stir Deposition of Ti-6Al-4V Alloy
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Topics: Additive manufacturing, Alloys, Computational fluid dynamics, Friction, Modeling, Thermomechanics
Proceedings Papers

Thermo-Mechanical Behavior of Multi-Layer Deposition for Wire Arc Additive Manufacturing of Structural Steel: Wire Arc Additive Manufacturing

Amritesh Kumar, Swarup Bag, V. C. Srivastava, M. Ruhul Amin
Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T03A024, October 30–November 3, 2022
Paper No: IMECE2022-88917
DOI: https://doi.org/10.1115/IMECE2022-88917
View Paper titled, Thermo-Mechanical Behavior of Multi-Layer Deposition for Wire Arc Additive Manufacturing of Structural Steel: Wire Arc Additive Manufacturing
Click here to open pdf in another window PDF for Thermo-Mechanical Behavior of Multi-Layer Deposition for Wire Arc Additive Manufacturing of Structural Steel: Wire Arc Additive Manufacturing
Topics: Additive manufacturing, Cooling, Stress, Structural steel, Thermomechanics, Wire
Proceedings Papers

Thermo-Mechanical Properties of SiC-Mineral Binder Composites for Space Applications

Sujithra Chandrasekaran, Ahmed El-Ghannam, James A. Monroe, Chengying Xu
Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T04A004, October 30–November 3, 2022
Paper No: IMECE2022-95056
DOI: https://doi.org/10.1115/IMECE2022-95056
View Paper titled, Thermo-Mechanical Properties of SiC-Mineral Binder Composites for Space Applications
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Topics: Binders (Materials), Composite materials, Minerals, Mirrors, Thermal shock, Thermomechanics
Proceedings Papers

Thermo-Mechanical Analysis of a Composite Tapered-Land Hydrodynamic Thrust Bearing Sector Manufactured Using Fused Filament Fabrication

Isaiah Yasko, Lloyd Furuta, Collier Fais, Muhammad Ali, Brian Wisner
Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T03A054, October 30–November 3, 2022
Paper No: IMECE2022-94853
DOI: https://doi.org/10.1115/IMECE2022-94853
View Paper titled, Thermo-Mechanical Analysis of a Composite Tapered-Land Hydrodynamic Thrust Bearing Sector Manufactured Using Fused Filament Fabrication
Click here to open pdf in another window PDF for Thermo-Mechanical Analysis of a Composite Tapered-Land Hydrodynamic Thrust Bearing Sector Manufactured Using Fused Filament Fabrication
Topics: Bearings, Composite materials, Manufacturing, Thermal expansion, Thermomechanics, Thrust bearings
Proceedings Papers

Overview of the Base Model for the Parametric Sensitivity Studies Specific to Performance Assessments of U-Mo Fuel Plates

Hakan Ozaltun, Hee Seok Roh, Walid Mohamed
Proc. ASME. IMECE2022, Volume 6: Energy, V006T08A046, October 30–November 3, 2022
Paper No: IMECE2022-93718
DOI: https://doi.org/10.1115/IMECE2022-93718
View Paper titled, Overview of the Base Model for the Parametric Sensitivity Studies Specific to Performance Assessments of U-Mo Fuel Plates
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Topics: Fuels, Plates (structures), Geometry, Irradiation (Radiation exposure), Aluminum, Constitutive equations, Creep, Density, Design, Diffusion (Physics)
Proceedings Papers

Phase-Field Modelling for Crack Evolution of PBX Under Thermomechanical Loadings

Xu Long, Jiaqi Zhu, Yutai Su, Kim S. Siow, Chuantong Chen
Proc. ASME. IMECE2022, Volume 1: Acoustics, Vibration, and Phononics, V001T01A009, October 30–November 3, 2022
Paper No: IMECE2022-96468
DOI: https://doi.org/10.1115/IMECE2022-96468
View Paper titled, Phase-Field Modelling for Crack Evolution of PBX Under Thermomechanical Loadings
Click here to open pdf in another window PDF for Phase-Field Modelling for Crack Evolution of PBX Under Thermomechanical Loadings
Topics: Fracture (Materials), Fracture (Process), Modeling, Thermomechanics
Proceedings Papers

Topology Optimization Through Deep Neural Network for Different Mechanical and Thermomechanical Problems

Md. Imrul Reza Shishir, Alireza Tabarraei
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T12A010, October 30–November 3, 2022
Paper No: IMECE2022-94604
DOI: https://doi.org/10.1115/IMECE2022-94604
View Paper titled, Topology Optimization Through Deep Neural Network for Different Mechanical and Thermomechanical Problems
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Topics: Artificial neural networks, Thermomechanics, Topology optimization
Proceedings Papers

Unified Constitutive Modeling of Haynes 230 for Thermomechanical Fatigue-Creep and Creep Behavior

Wenyu Cao, Hualiang Zhang
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T12A037, October 30–November 3, 2022
Paper No: IMECE2022-94802
DOI: https://doi.org/10.1115/IMECE2022-94802
View Paper titled, Unified Constitutive Modeling of Haynes 230 for Thermomechanical Fatigue-Creep and Creep Behavior
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Topics: Creep, Fatigue, Modeling, Thermomechanics
Proceedings Papers

Thermomechanical Response of Laminated Flat Panels Featuring Interlaminar Bonding Imperfections

U. Icardi, L. Librescu, M. Di Sciuva
Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 197-214, November 16–21, 1997
Paper No: IMECE1997-0723
DOI: https://doi.org/10.1115/IMECE1997-0723
View Paper titled, Thermomechanical Response of Laminated Flat Panels Featuring Interlaminar Bonding Imperfections
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Topics: Bonding, Thermomechanics, Composite materials, Anisotropy, Stress, Temperature
Proceedings Papers

A Thermomechanical Model of Machine Tool Spindles for Use in the Design of Reconfigurable Angular Contact Spindle Bearing Load Control Systems

Alex O. Gibson, Jeffrey L. Stein, Jay F. Tu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 23-30, November 16–21, 1997
Paper No: IMECE1997-1071
DOI: https://doi.org/10.1115/IMECE1997-1071
View Paper titled, A Thermomechanical Model of Machine Tool Spindles for Use in the Design of Reconfigurable Angular Contact Spindle Bearing Load Control Systems
Click here to open pdf in another window PDF for A Thermomechanical Model of Machine Tool Spindles for Use in the Design of Reconfigurable Angular Contact Spindle Bearing Load Control Systems
Topics: Bearings, Control systems, Design, Machine tool spindles, Stress, Thermomechanics, Roller bearings, Thermal expansion, Centrifugal force, Deflection
Proceedings Papers

Analysis and Evaluation of Malfunctions in Thermomechanical Systems

Javier Royo, Alejandro Zaleta, Antonio Valero
Proc. ASME. IMECE97, Advanced Energy Systems, 103-108, November 16–21, 1997
Paper No: IMECE1997-0979
DOI: https://doi.org/10.1115/IMECE1997-0979
View Paper titled, Analysis and Evaluation of Malfunctions in Thermomechanical Systems
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Topics: Cycles, Economic analysis, Energy dissipation, Gates (Closures), High pressure (Physics), Maintenance, Power stations, Simulation, Steam turbines, Temperature
Proceedings Papers

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Prema Palaniappan, Daniel F. Baldwin
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 7-14, November 16–21, 1997
Paper No: IMECE1997-1221
DOI: https://doi.org/10.1115/IMECE1997-1221
View Paper titled, In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure
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Topics: Density, Electronics, Flip-chip, Flip-chip assemblies, Flip-chip devices, Fracture (Materials), Fracture (Process), Glass transition, Manufacturing, Printed circuit boards
Proceedings Papers

Ultrasonic Time-Frequency Characterization of Silicon Wafers at Elevated Temperatures

C. Steve Suh, G. Andrew Rabroker, Christian P. Burger, Ravinder Chona
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 37-43, November 16–21, 1997
Paper No: IMECE1997-1225
DOI: https://doi.org/10.1115/IMECE1997-1225
View Paper titled, Ultrasonic Time-Frequency Characterization of Silicon Wafers at Elevated Temperatures
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Topics: Semiconductor wafers, Temperature, Waves, Acoustics, Fibers, Interferometers, Mechanical properties, Nondestructive evaluation, Splines, Thermomechanics
Proceedings Papers

Testing and Constitutive Modeling of Thin Polymer Films and Underfills by a 6-Axis Submicron Tester

Zhengfang Qian, Minfu Lu, Jianjun Wang, Sheng Liu
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 105-112, November 16–21, 1997
Paper No: IMECE1997-1234
DOI: https://doi.org/10.1115/IMECE1997-1234
View Paper titled, Testing and Constitutive Modeling of Thin Polymer Films and Underfills by a 6-Axis Submicron Tester
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Topics: Modeling, Polymer films, Testing, Thermomechanics, Nylon film
Proceedings Papers

Driving PWA Thermomechanical Analysis From Step AP210 Product Models

Diego R. Tamburini, Russell S. Peak, Robert E. Fulton
Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 33-45, November 16–21, 1997
Paper No: IMECE1997-1212
DOI: https://doi.org/10.1115/IMECE1997-1212
View Paper titled, Driving PWA Thermomechanical Analysis From Step AP210 Product Models
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Topics: Thermomechanics, Design, Arches, Computer programming, Electrical wires, Geometry, Manufacturing, Mentoring, Product design, Thrust
Proceedings Papers

Thermo-Mechanical Analysis of Solder-Sealed Electronic Modules During Power Cycling

Raed A. Sherif, David L. Edwards, Michael J. Ellsworth, Jr.
Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 7-12, November 16–21, 1997
Paper No: IMECE1997-1209
DOI: https://doi.org/10.1115/IMECE1997-1209
View Paper titled, Thermo-Mechanical Analysis of Solder-Sealed Electronic Modules During Power Cycling
Click here to open pdf in another window PDF for Thermo-Mechanical Analysis of Solder-Sealed Electronic Modules During Power Cycling
Topics: Solders, Thermomechanics, Ceramics, Cracking (Materials), Cycles, Design, Energy dissipation, Fatigue life, Finite element methods, Finite element model
Proceedings Papers

Improving Electronic Packaging Manufacturing Through Product and Process-Driven Analysis: A PWB Case Study

Andrew J. Scholand, Russell S. Peak, Robert E. Fulton
Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 23-31, November 16–21, 1997
Paper No: IMECE1997-1211
DOI: https://doi.org/10.1115/IMECE1997-1211
View Paper titled, Improving Electronic Packaging Manufacturing Through Product and Process-Driven Analysis: A PWB Case Study
Click here to open pdf in another window PDF for Improving Electronic Packaging Manufacturing Through Product and Process-Driven Analysis: A PWB Case Study
Topics: Electronic packaging, Manufacturing, Printed circuit boards, Product quality, Warping, Ovens, Economics , Materials properties, Temperature, Thermomechanics
Proceedings Papers

Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation

Carole A. Le Gall, Jianmin Qu, David L. McDowell
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 85-95, November 16–21, 1997
Paper No: IMECE1997-0503
DOI: https://doi.org/10.1115/IMECE1997-0503
View Paper titled, Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation
Click here to open pdf in another window PDF for Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation
Topics: Flip-chip, Flip-chip devices, Reliability, Thermomechanics, Stress, Creep, Dimensions, Elasticity, Flip-chip assemblies, Geometry
Proceedings Papers

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

Jürgen Auersperg, Andreas Schubert, Dietmar Vogel, Bernd Michel, Herbert Reichl
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 133-138, November 16–21, 1997
Paper No: IMECE1997-0508
DOI: https://doi.org/10.1115/IMECE1997-0508
View Paper titled, Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC
Click here to open pdf in another window PDF for Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC
Topics: Damage, Finite element analysis, Flip-chip assemblies, Fracture (Materials), Fracture (Process), Solders, Reliability, Simulation, Thermomechanics, Delamination