1-20 of 219
Thermal expansion
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Thermo-Mechanical Analysis of a Composite Tapered-Land Hydrodynamic Thrust Bearing Sector Manufactured Using Fused Filament Fabrication

Isaiah Yasko, Lloyd Furuta, Collier Fais, Muhammad Ali, Brian Wisner
Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T03A054, October 30–November 3, 2022
Paper No: IMECE2022-94853
DOI: https://doi.org/10.1115/IMECE2022-94853
View Paper titled, Thermo-Mechanical Analysis of a Composite Tapered-Land Hydrodynamic Thrust Bearing Sector Manufactured Using Fused Filament Fabrication
Click here to open pdf in another window PDF for Thermo-Mechanical Analysis of a Composite Tapered-Land Hydrodynamic Thrust Bearing Sector Manufactured Using Fused Filament Fabrication
Topics: Bearings, Composite materials, Manufacturing, Thermal expansion, Thermomechanics, Thrust bearings
Proceedings Papers

Impact of the Tip Clearance and the Inflow Nozzle Shape on the Performance of Low-Pressure Axial Fans

Manuel Fritsche, Philipp Epple, Antonio Delgado
Proc. ASME. IMECE2022, Volume 8: Fluids Engineering; Heat Transfer and Thermal Engineering, V008T10A006, October 30–November 3, 2022
Paper No: IMECE2022-95881
DOI: https://doi.org/10.1115/IMECE2022-95881
View Paper titled, Impact of the Tip Clearance and the Inflow Nozzle Shape on the Performance of Low-Pressure Axial Fans
Click here to open pdf in another window PDF for Impact of the Tip Clearance and the Inflow Nozzle Shape on the Performance of Low-Pressure Axial Fans
Topics: Clearances (Engineering), Fans, Inflow, Nozzles, Pressure, Shapes, Blades, Impellers, Flow (Dynamics), Manufacturing
Proceedings Papers

Free Vibration Analysis of Composite Plates With Tailored Thermal Residual-Stresses

Sérgio Frascino Müller de Almeida, Jorn S. Hansen
Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 183-190, November 16–21, 1997
Paper No: IMECE1997-0721
DOI: https://doi.org/10.1115/IMECE1997-0721
View Paper titled, Free Vibration Analysis of Composite Plates With Tailored Thermal Residual-Stresses
Click here to open pdf in another window PDF for Free Vibration Analysis of Composite Plates With Tailored Thermal Residual-Stresses
Topics: Composite materials, Free vibrations, Plates (structures), Residual stresses, Manufacturing, Elasticity, Finite element analysis, Laminates, Membranes, Operating temperature
Proceedings Papers

Experimental Observation of Fatigue-Creep Fracture Development in Solder Joints of Different Standoffs

D. R. Liu
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 249-259, November 16–21, 1997
Paper No: IMECE1997-0824
DOI: https://doi.org/10.1115/IMECE1997-0824
View Paper titled, Experimental Observation of Fatigue-Creep Fracture Development in Solder Joints of Different Standoffs
Click here to open pdf in another window PDF for Experimental Observation of Fatigue-Creep Fracture Development in Solder Joints of Different Standoffs
Topics: Creep, Fatigue, Fracture (Materials), Fracture (Process), Solder joints, Temperature, Printed circuit boards, Damage, Melting, Separation (Technology)
Proceedings Papers

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

M. Uschitsky, E. Suhir, G. W. Kammlott
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 171-206, November 16–21, 1997
Paper No: IMECE1997-0819
DOI: https://doi.org/10.1115/IMECE1997-0819
View Paper titled, Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach
Click here to open pdf in another window PDF for Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach
Topics: Composite materials, Molding, Thermoelasticity, Fillers (Materials), Thermal stresses, Epoxy adhesives, Epoxy resins, Design, Integrated circuits, Reliability
Proceedings Papers

Structural Integrity of Optical Fibers in Connectors

Wilton W. King, Bruce G. LeFevre, A. Guy Hardee
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 261-269, November 16–21, 1997
Paper No: IMECE1997-0825
DOI: https://doi.org/10.1115/IMECE1997-0825
View Paper titled, Structural Integrity of Optical Fibers in Connectors
Click here to open pdf in another window PDF for Structural Integrity of Optical Fibers in Connectors
Topics: Epoxy adhesives, Epoxy resins, Fibers, Finite element analysis, Fracture (Materials), Fracture (Process), Optical fiber, Reliability, Stress analysis (Engineering), Structural analysis
Proceedings Papers

Nanoscale Thermometry Using Scanning Joule Expansion Microscopy

Arun Majumdar, John Varesi
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 171-179, November 16–21, 1997
Paper No: IMECE1997-0955
DOI: https://doi.org/10.1115/IMECE1997-0955
View Paper titled, Nanoscale Thermometry Using Scanning Joule Expansion Microscopy
Click here to open pdf in another window PDF for Nanoscale Thermometry Using Scanning Joule Expansion Microscopy
Topics: Joules, Microscopy, Nanoscale phenomena, Temperature measurement, Atomic force microscopy, Imaging, Metals, Resolution (Optics), Signals, Temperature distribution
Proceedings Papers

Sequential Processing Mechanics Modeling for a Model IC Package

Jianjun Wang, Sheng Liu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 401-410, November 16–21, 1997
Paper No: IMECE1997-1117
DOI: https://doi.org/10.1115/IMECE1997-1117
View Paper titled, Sequential Processing Mechanics Modeling for a Model IC Package
Click here to open pdf in another window PDF for Sequential Processing Mechanics Modeling for a Model IC Package
Topics: Modeling, Stress, Manufacturing, Solders, Temperature, Finite element analysis, Finite element methods, Finite element model, Silicon chips, Bonding
Proceedings Papers

A Thermomechanical Model of Machine Tool Spindles for Use in the Design of Reconfigurable Angular Contact Spindle Bearing Load Control Systems

Alex O. Gibson, Jeffrey L. Stein, Jay F. Tu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 23-30, November 16–21, 1997
Paper No: IMECE1997-1071
DOI: https://doi.org/10.1115/IMECE1997-1071
View Paper titled, A Thermomechanical Model of Machine Tool Spindles for Use in the Design of Reconfigurable Angular Contact Spindle Bearing Load Control Systems
Click here to open pdf in another window PDF for A Thermomechanical Model of Machine Tool Spindles for Use in the Design of Reconfigurable Angular Contact Spindle Bearing Load Control Systems
Topics: Bearings, Control systems, Design, Machine tool spindles, Stress, Thermomechanics, Roller bearings, Thermal expansion, Centrifugal force, Deflection
Proceedings Papers

A Multi-Purpose Laser Sensor for Cutting Tools

Oleg Ryabov, Kazuo Mori, Nagayoshi Kasashima
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 9-14, November 16–21, 1997
Paper No: IMECE1997-1069
DOI: https://doi.org/10.1115/IMECE1997-1069
View Paper titled, A Multi-Purpose Laser Sensor for Cutting Tools
Click here to open pdf in another window PDF for A Multi-Purpose Laser Sensor for Cutting Tools
Topics: Cutting tools, Lasers, Sensors, Milling, Displacement, Geometry, Chatter, Engineering prototypes, Failure, Laser beams
Proceedings Papers

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Prema Palaniappan, Daniel F. Baldwin
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 7-14, November 16–21, 1997
Paper No: IMECE1997-1221
DOI: https://doi.org/10.1115/IMECE1997-1221
View Paper titled, In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure
Click here to open pdf in another window PDF for In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure
Topics: Density, Electronics, Flip-chip, Flip-chip assemblies, Flip-chip devices, Fracture (Materials), Fracture (Process), Glass transition, Manufacturing, Printed circuit boards
Proceedings Papers

Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation

Carole A. Le Gall, Jianmin Qu, David L. McDowell
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 85-95, November 16–21, 1997
Paper No: IMECE1997-0503
DOI: https://doi.org/10.1115/IMECE1997-0503
View Paper titled, Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation
Click here to open pdf in another window PDF for Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation
Topics: Flip-chip, Flip-chip devices, Reliability, Thermomechanics, Stress, Creep, Dimensions, Elasticity, Flip-chip assemblies, Geometry
Proceedings Papers

Shearing Deformation in Partial Areal Arrays: Analytical Results

S. M. Heinrich, S. Shakya, P. S. Lee
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 51-59, November 16–21, 1997
Paper No: IMECE1997-0500
DOI: https://doi.org/10.1115/IMECE1997-0500
View Paper titled, Shearing Deformation in Partial Areal Arrays: Analytical Results
Click here to open pdf in another window PDF for Shearing Deformation in Partial Areal Arrays: Analytical Results
Topics: Boundary-value problems, Corners (Structural elements), Die cutting, Dimensions, Displacement, Elasticity, Fatigue life, Finite element analysis, Finite element model, Geometry
Proceedings Papers

Effect of Thermal Residual Stress on the Measurement of the Adhesion Between Polyimide and Underfill Using an Asymmetric Double Cantilever Beam Specimen

Jinbao Jiao, Charan K. Gurumurthy, Edward J. Kramer, Yan Sha, Chung-Yuen Hui, Peter Børgesen
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 97-102, November 16–21, 1997
Paper No: IMECE1997-0504
DOI: https://doi.org/10.1115/IMECE1997-0504
View Paper titled, Effect of Thermal Residual Stress on the Measurement of the Adhesion Between Polyimide and Underfill Using an Asymmetric Double Cantilever Beam Specimen
Click here to open pdf in another window PDF for Effect of Thermal Residual Stress on the Measurement of the Adhesion Between Polyimide and Underfill Using an Asymmetric Double Cantilever Beam Specimen
Topics: Adhesion, Cantilever beams, Stress, Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture (Process), Ethers (Class of compounds), Thermal expansion
Proceedings Papers

Stress Analysis of High Density Bare Chip Packaging Technologies

Yutaka Tsukada, Shogo Mizumoto, Yasuyuki Kodama, Hideo Nishimura
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 49-50, November 16–21, 1997
Paper No: IMECE1997-0499
DOI: https://doi.org/10.1115/IMECE1997-0499
View Paper titled, Stress Analysis of High Density Bare Chip Packaging Technologies
Click here to open pdf in another window PDF for Stress Analysis of High Density Bare Chip Packaging Technologies
Topics: Density, Packaging, Stress analysis (Engineering), Epoxy adhesives, Epoxy resins, Ceramics, Ball-Grid-Array packages, Ball-Grid-Array packaging, Electronic packaging, Flip-chip
Proceedings Papers

Toughening of High Performance Epoxy Adhesives Using Core-Shell Particles

Hung-Jue Sue, P. Mac Puckett, Yee Y. Wang
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 163-168, November 16–21, 1997
Paper No: IMECE1997-0512
DOI: https://doi.org/10.1115/IMECE1997-0512
View Paper titled, Toughening of High Performance Epoxy Adhesives Using Core-Shell Particles
Click here to open pdf in another window PDF for Toughening of High Performance Epoxy Adhesives Using Core-Shell Particles
Topics: Epoxy adhesives, Particulate matter, Shells, Rubber, Adhesives, Elastic moduli, Fracture toughness, Glass transition, Materials properties, Shear (Mechanics)
Proceedings Papers

Failure Analysis of P75 Graphite/934 Epoxy Composites Subjected to Thermal and Mechanical Loads

P. Atherton, A. Saigal, R. Greif
Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 155-165, November 16–21, 1997
Paper No: IMECE1997-0532
DOI: https://doi.org/10.1115/IMECE1997-0532
View Paper titled, Failure Analysis of P75 Graphite/934 Epoxy Composites Subjected to Thermal and Mechanical Loads
Click here to open pdf in another window PDF for Failure Analysis of P75 Graphite/934 Epoxy Composites Subjected to Thermal and Mechanical Loads
Topics: Composite materials, Epoxy adhesives, Epoxy resins, Failure analysis, Graphite, Stress, Failure, Finite element analysis, Residual stresses, Fibers
Proceedings Papers

Microstructure and Residual Stresses in FGMs

Antonios Zavaliangos
Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 57-64, November 16–21, 1997
Paper No: IMECE1997-0651
DOI: https://doi.org/10.1115/IMECE1997-0651
View Paper titled, Microstructure and Residual Stresses in FGMs
Click here to open pdf in another window PDF for Microstructure and Residual Stresses in FGMs
Topics: Residual stresses, Hydrostatic pressure, Thermal expansion
Proceedings Papers

Thermal Shape Control of Active and Sensory Piezoelectric Composite Plates

Ho-Jun Lee, Dimitris A. Saravanos
Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 249-257, November 16–21, 1997
Paper No: IMECE1997-0726
DOI: https://doi.org/10.1115/IMECE1997-0726
View Paper titled, Thermal Shape Control of Active and Sensory Piezoelectric Composite Plates
Click here to open pdf in another window PDF for Thermal Shape Control of Active and Sensory Piezoelectric Composite Plates
Topics: Composite materials, Plates (structures), Shapes, Temperature effects, Epoxy adhesives, Epoxy resins, Finite element analysis, Graphite, Laminates, Piezoelectric ceramics
Proceedings Papers

Thermal Expansion Behavior of Ceramic Composites for Thermal Management Applications

Yu-Lin Shen
Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 385-392, November 16–21, 1997
Paper No: IMECE1997-0689
DOI: https://doi.org/10.1115/IMECE1997-0689
View Paper titled, Thermal Expansion Behavior of Ceramic Composites for Thermal Management Applications
Click here to open pdf in another window PDF for Thermal Expansion Behavior of Ceramic Composites for Thermal Management Applications
Topics: Ceramic composites, Thermal expansion, Thermal management, Composite materials, Particulate matter, Computer simulation, Deformation, Finite element methods, Micromechanical devices, Porosity