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Proceedings Papers

Thermal Contact Conductance of a Paper/Elastomer Interface

J. W. Mohr, J. Seyed-Yagoobi, J. W. Wirtz, D. C. Price
Proc. ASME. IMECE96, Heat Transfer: Volume 1 — Heat Transfer in Microgravity Systems; Radiative Heat Transfer and Radiative Heat Transfer in Low-Temperature Environments; Thermal Contact Conductance and Inverse Problems in Heat Transfer, 217-222, November 17–22, 1996
Paper No: IMECE1996-0046
https://doi.org/10.1115/IMECE1996-0046
View Paper titled, Thermal Contact Conductance of a Paper/Elastomer Interface
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Topics: Contact resistance, Elastomers, Pressure, Printing, Rollers, Design, Heat transfer, Heating, Thermal conductivity
Proceedings Papers

The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints

Y. Li, R. L. Mahajan, G. Subbarayan
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 119-129, November 17–22, 1996
Paper No: IMECE1996-0782
https://doi.org/10.1115/IMECE1996-0782
View Paper titled, The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints
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Topics: Optimization, Printing, Reliability, Solder joints, Solders, Ball-Grid-Array packaging, Ceramics, Fatigue life, Cycles, Design
Proceedings Papers

Mechanistic Process Simulation Models for a Surface Mount Virtual Factory Environment

K. Darbha, A. Poddar, C. S. Sealing, C. Ramaswamy, L. Tang, K. Upadhayayula, A. Dasgupta, Y. Joshi
Proc. ASME. IMECE96, Manufacturing Science and Engineering, 153-178, November 17–22, 1996
Paper No: IMECE1996-0785
https://doi.org/10.1115/IMECE1996-0785
View Paper titled, Mechanistic Process Simulation Models for a Surface Mount Virtual Factory Environment
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Topics: Process simulation, Surface mount packaging, Manufacturing, Solders, Design, Geometry, Modeling, Cycles, Solder joints, Warping
Proceedings Papers

Dye Diffusion Digital Imaging

John E. LaFleche, Richard C. Benson, Kenneth D. Stack, Stephen J. Burns
Proc. ASME. IMECE96, 7th International Symposium on Information Storage and Processing Systems, 21-29, November 17–22, 1996
Paper No: IMECE1996-1064
https://doi.org/10.1115/IMECE1996-1064
View Paper titled, Dye Diffusion Digital Imaging
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Topics: Diffusion (Physics), Imaging, Boundary-value problems, Heat, Printing, Temperature, Diffusion processes, Heating, Mass transfer, Polymers
Proceedings Papers

2D Simulation of the Placement of a Pin-Through-Hole Component and Solder Paste Melting

Nelson Rodrigues, Inês Teixeira, Violeta Carvalho, Duarte Santos, Joao Velosa, Ana Ferreira, Delfim Soares, José Teixeira, Senhorinha Teixeira
Proc. ASME. IMECE2022, Volume 2B: Advanced Manufacturing, V02BT02A008, October 30–November 3, 2022
Paper No: IMECE2022-95960
https://doi.org/10.1115/IMECE2022-95960
View Paper titled, 2D Simulation of the Placement of a Pin-Through-Hole Component and Solder Paste Melting
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Topics: Melting, Printing, Simulation, Solders
Proceedings Papers

Characterization of Additively Manufactured Beta Materials

Efrem Dawit Dana, Subha Kumpaty, Jordan Weston
Proc. ASME. IMECE2022, Volume 3: Advanced Materials: Design, Processing, Characterization and Applications; Advances in Aerospace Technology, V003T03A002, October 30–November 3, 2022
Paper No: IMECE2022-88301
https://doi.org/10.1115/IMECE2022-88301
View Paper titled, Characterization of Additively Manufactured Beta Materials
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Topics: Additive manufacturing, Power uprate, Mechanical properties, Urethane elastomers, Materials properties, Printing, Rapid prototyping, Resins
Proceedings Papers

Effect of Curing Parameters on Warp in the SLA Printing Process

Anne Schmitz
Proc. ASME. IMECE2022, Volume 4: Biomedical and Biotechnology; Design, Systems, and Complexity, V004T05A015, October 30–November 3, 2022
Paper No: IMECE2022-88495
https://doi.org/10.1115/IMECE2022-88495
View Paper titled, Effect of Curing Parameters on Warp in the SLA Printing Process
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Topics: Hardening (Curing), Heat, Printing, Warping
Proceedings Papers

Cellular Lattices With Struts and Plates

Nandika Anne D’Souza, Mahan Ghosh
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T12A025, October 30–November 3, 2022
Paper No: IMECE2022-95942
https://doi.org/10.1115/IMECE2022-95942
View Paper titled, Cellular Lattices With Struts and Plates
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Topics: Absorption, Additive manufacturing, Architecture, Foams (Chemistry), Honeycomb structures, Manufacturing, Modeling, Plates (structures), Printing, Stress
Proceedings Papers

New Design for Implementation of 2-Degree-of-Freedom Planar Parallel Robot for Use in Creating an Infinite 3D Printer

Miguel De La Melena, Shawn Duan
Proc. ASME. IMECE2022, Volume 5: Dynamics, Vibration, and Control, V005T07A084, October 30–November 3, 2022
Paper No: IMECE2022-88317
https://doi.org/10.1115/IMECE2022-88317
View Paper titled, New Design for Implementation of 2-Degree-of-Freedom Planar Parallel Robot for Use in Creating an Infinite 3D Printer
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Topics: Additive manufacturing, Design, Finite element analysis, Manipulators, Robots, Dynamic models, Optimization, Printing, Extruding, Inertia (Mechanics)
Proceedings Papers

Ultrasonic Characterization of AlSi10Mg Specimens Printed By Direct Energy Deposition Technology

Mariya Chukovenkova, Andrei Zagrai, H. Scott Halliday, Joshua Toddy, Nylana J. Murphy
Proc. ASME. IMECE2022, Volume 1: Acoustics, Vibration, and Phononics, V001T01A020, October 30–November 3, 2022
Paper No: IMECE2022-96236
https://doi.org/10.1115/IMECE2022-96236
View Paper titled, Ultrasonic Characterization of AlSi10Mg Specimens Printed By Direct Energy Deposition Technology
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Topics: Additive manufacturing, Anisotropy, Density, Echoes, Elasticity, Fracture (Materials), Manufacturing, Materials properties, Mechanical properties, Nondestructive evaluation
Proceedings Papers

Rapid and Low-Cost Fabrication of Microfluidic Devices Using Liquid Crystal Display-Based 3D Printing

Yujie Shan, Praveen Sahu, Raji Sundararajan, Huachao Mao
Proc. ASME. IMECE2022, Volume 2A: Advanced Manufacturing, V02AT02A024, October 30–November 3, 2022
Paper No: IMECE2022-96036
https://doi.org/10.1115/IMECE2022-96036
View Paper titled, Rapid and Low-Cost Fabrication of Microfluidic Devices Using Liquid Crystal Display-Based 3D Printing
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Topics: Additive manufacturing, Biomedicine, Liquid crystals, Manufacturing, Microchannels, Microfluidics, Printing
Proceedings Papers

Investigation of the Effects of Photopolymer Resin Composition on the Mechanical Properties of Complex Dental Constructs, Fabricated Using Digital Light Processing

Regan Raines, Roozbeh (Ross) Salary
Proc. ASME. IMECE2022, Volume 2A: Advanced Manufacturing, V02AT02A002, October 30–November 3, 2022
Paper No: IMECE2022-95049
https://doi.org/10.1115/IMECE2022-95049
View Paper titled, Investigation of the Effects of Photopolymer Resin Composition on the Mechanical Properties of Complex Dental Constructs, Fabricated Using Digital Light Processing
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Topics: Additive manufacturing, Mechanical properties, Photopolymers, Resins, Biomedicine, Compression, Manufacturing, Ultraviolet radiation, Resolution (Optics), Biological tissues
Proceedings Papers

Stereolithography Printing and Sintering of Silicon Carbide (SiC) Ceramics via Oxidation-Bonding

Padmalatha Kakanuru, Kishore Pochiraju
Proc. ASME. IMECE2022, Volume 2A: Advanced Manufacturing, V02AT02A023, October 30–November 3, 2022
Paper No: IMECE2022-96009
https://doi.org/10.1115/IMECE2022-96009
View Paper titled, Stereolithography Printing and Sintering of Silicon Carbide (SiC) Ceramics via Oxidation-Bonding
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Topics: Bonding, Ceramics, Oxidation, Printing, Silicon, Sintering, Stereolithography
Proceedings Papers

Dependency Evaluation of Defect Formation and Printing Location in Additive Manufacturing

Kosar Safari, Shihab Khalfalla, Farhad Imani
Proc. ASME. IMECE2022, Volume 2A: Advanced Manufacturing, V02AT02A016, October 30–November 3, 2022
Paper No: IMECE2022-95145
https://doi.org/10.1115/IMECE2022-95145
View Paper titled, Dependency Evaluation of Defect Formation and Printing Location in Additive Manufacturing
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Topics: Additive manufacturing, Printing, Computerized tomography, Design, Imaging, Lasers, Machinery, Porosity, Shapes
Proceedings Papers

Characterization of Additively Manufactured Metals from ADDere Printing

Joshua Foster, Subha Kumpaty, Liam Coen, Al Perkins, Michael Gengler, Scott Woida
Proc. ASME. IMECE2022, Volume 2A: Advanced Manufacturing, V02AT02A004, October 30–November 3, 2022
Paper No: IMECE2022-88299
https://doi.org/10.1115/IMECE2022-88299
View Paper titled, Characterization of Additively Manufactured Metals from ADDere Printing
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Topics: Additive manufacturing, Metals, Printing, Testing, ASTM International, Collaboration, Lasers, Manufacturing, Mechanical properties, Stainless steel
Proceedings Papers

A Bio-Printing Strategy to Fabricate Geometrically Accurate 3d Scaffolds

Connor Quigley, Slesha Tuladhar, Md Ahasan Habib
Proc. ASME. IMECE2022, Volume 2A: Advanced Manufacturing, V02AT02A003, October 30–November 3, 2022
Paper No: IMECE2022-95300
https://doi.org/10.1115/IMECE2022-95300
View Paper titled, A Bio-Printing Strategy to Fabricate Geometrically Accurate 3d Scaffolds
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Topics: Hydrogels, Printing, Rheology, Bioprinting, Biological tissues, Biomaterials, Biopolymers, Geometry, Polymers, Biocompatibility
Proceedings Papers

Development of the Ultrasonic System Integration With 3D Polymer Printing

Jonathan England, Ethan Darnell, Janak Bhakta, Maria D’Orazio, Mariya Chukovenkova, Andrei Zagrai
Proc. ASME. IMECE2022, Volume 2B: Advanced Manufacturing, V02BT02A052, October 30–November 3, 2022
Paper No: IMECE2022-96028
https://doi.org/10.1115/IMECE2022-96028
View Paper titled, Development of the Ultrasonic System Integration With 3D Polymer Printing
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Topics: Polymers, Printing, Ultrasonic transducers, Temperature, Additive manufacturing, Finite element analysis, Materials properties, Nondestructive evaluation, Steel, Young's modulus
Proceedings Papers

Improving the Snap-Off Process in Solder Paste Stencil Printing via the Enhancement of Wall Slip

Toshinori Mimura, Sheng Liu, Haruhiko Asada
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 219-225, November 16–21, 1997
Paper No: IMECE1997-0821
https://doi.org/10.1115/IMECE1997-0821
View Paper titled, Improving the Snap-Off Process in Solder Paste Stencil Printing via the Enhancement of Wall Slip
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Topics: Printing, Solders, Flow (Dynamics), Printed circuit boards, Temperature, Visualization
Proceedings Papers

Ceramic Tape-Based Meso Systems Technology

Haim H. Bau, Suresh G. K. Ananthasuresh, Jorge J. Santiago-Avilés, Jihua Zhong, Moon Kim, Mingqiang Yi, Patricio Espinoza-Vallejos, Luis Sola-Laguna
Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 491-498, November 15–20, 1998
Paper No: IMECE1998-1290
https://doi.org/10.1115/IMECE1998-1290
View Paper titled, Ceramic Tape-Based Meso Systems Technology
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Topics: Ceramics, Glass, Manufacturing, Silicon, Binders (Materials), Firing, Flow (Dynamics), Lamination, Low temperature, Microelectromechanical systems
Proceedings Papers

Analysis of Process Yield in Low Cost Flip Chip on Board Assembly Processes

Ryan Thorpe, Lawrence P. McGovern, Daniel F. Baldwin
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 27-33, November 15–20, 1998
Paper No: IMECE1998-0425
https://doi.org/10.1115/IMECE1998-0425
View Paper titled, Analysis of Process Yield in Low Cost Flip Chip on Board Assembly Processes
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Topics: Flip-chip, Flip-chip devices, Manufacturing, Flow (Dynamics), Solders, Vehicles, Compression, Ovens, Printing