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Proceedings Papers

Investigation of the Lead-On-Chip Package’s Reliability

P.-H. Tsao, L. C. Chang, T. C. Chen, Chender Haung, C. Z. Chen

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 347-351, November 16–21, 1997

Paper No: IMECE1997-1109

DOI: https://doi.org/10.1115/IMECE1997-1109

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Topics: Reliability, Epoxy adhesives, Epoxy resins, Silicon chips, Crack propagation, Failure mechanisms, Finite element analysis, Fracture (Materials), Manufacturing, Molding

Proceedings Papers

Evaluation of Elastic Properties of a Functionally Graded Composite Using an Elastic-Impact Technique

Prabhakar R. Marur, Hareesh V. Tippur

Proc. ASME. IMECE97, Noise Control and Acoustics, 227-234, November 16–21, 1997

Paper No: IMECE1997-1048

DOI: https://doi.org/10.1115/IMECE1997-1048

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Topics: Composite materials, Elasticity, Functionally graded materials, Echoes, Epoxy adhesives, Epoxy resins, Glass, Impact testing, Particulate matter, Poisson ratio

Proceedings Papers

The Effect of Toughened Composites on Dynamic Behaviors of Composite Laminates Under the In-Plane Dynamic Load

Hongyu Jia, Craig A. Rogers

Proc. ASME. IMECE97, Noise Control and Acoustics, 269-275, November 16–21, 1997

Paper No: IMECE1997-1053

DOI: https://doi.org/10.1115/IMECE1997-1053

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Topics: Composite materials, Laminates, Stress, Buckling, Plates (structures), Graphite, Inertia (Mechanics), Epoxy adhesives, Epoxy resins, Equations of motion

Proceedings Papers

Creep Behavior Study of Plastic Power Package by Real Time Moiré Interferometry and FEM Modeling

Daqing Zou, Jianjun Wang, Minfu Lu, Sheng Liu

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 51-57, November 16–21, 1997

Paper No: IMECE1997-1227

DOI: https://doi.org/10.1115/IMECE1997-1227

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Topics: Creep, Finite element methods, Finite element model, Interferometry, Modeling, Epoxy adhesives, Epoxy resins, Molding, Constitutive equations, Deformation

Proceedings Papers

Effect of Thermal Residual Stress on the Measurement of the Adhesion Between Polyimide and Underfill Using an Asymmetric Double Cantilever Beam Specimen

Jinbao Jiao, Charan K. Gurumurthy, Edward J. Kramer, Yan Sha, Chung-Yuen Hui, Peter Børgesen

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 97-102, November 16–21, 1997

Paper No: IMECE1997-0504

DOI: https://doi.org/10.1115/IMECE1997-0504

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Topics: Adhesion, Cantilever beams, Stress, Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture (Process), Ethers (Class of compounds), Thermal expansion

Proceedings Papers

The Effect of Temperature and Humidity Exposure on Adhesion

R. A. Pearson, R. M. Hydro, T. B. Lloyd, H. F. Nied

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 1-6, November 16–21, 1997

Paper No: IMECE1997-0493

DOI: https://doi.org/10.1115/IMECE1997-0493

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Topics: Adhesion, Temperature, Adhesives, Silver, Copper, Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture (Process), Cantilever beams

Proceedings Papers

Stress Analysis of High Density Bare Chip Packaging Technologies

Yutaka Tsukada, Shogo Mizumoto, Yasuyuki Kodama, Hideo Nishimura

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 49-50, November 16–21, 1997

Paper No: IMECE1997-0499

DOI: https://doi.org/10.1115/IMECE1997-0499

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Topics: Density, Packaging, Stress analysis (Engineering), Epoxy adhesives, Epoxy resins, Ceramics, Ball-Grid-Array packages, Ball-Grid-Array packaging, Electronic packaging, Flip-chip

Proceedings Papers

Toughening of High Performance Epoxy Adhesives Using Core-Shell Particles

Hung-Jue Sue, P. Mac Puckett, Yee Y. Wang

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 163-168, November 16–21, 1997

Paper No: IMECE1997-0512

DOI: https://doi.org/10.1115/IMECE1997-0512

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Topics: Epoxy adhesives, Particulate matter, Shells, Rubber, Adhesives, Elastic moduli, Fracture toughness, Glass transition, Materials properties, Shear (Mechanics)

Proceedings Papers

The Effect of Underfill Delamination on the Reliability of Flip Chip Modules

Sven Rzepka, Matt A. Korhonen, Ekkehard Meusel, Che-Yu Li

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 73-83, November 16–21, 1997

Paper No: IMECE1997-0502

DOI: https://doi.org/10.1115/IMECE1997-0502

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Topics: Delamination, Flip-chip, Flip-chip devices, Reliability, Solders, Tension, Failure, Solder joints, Adhesion, Compressive stress

Proceedings Papers

Failure Analysis of P75 Graphite/934 Epoxy Composites Subjected to Thermal and Mechanical Loads

P. Atherton, A. Saigal, R. Greif

Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 155-165, November 16–21, 1997

Paper No: IMECE1997-0532

DOI: https://doi.org/10.1115/IMECE1997-0532

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Topics: Composite materials, Epoxy adhesives, Epoxy resins, Failure analysis, Graphite, Stress, Failure, Finite element analysis, Residual stresses, Fibers

Proceedings Papers

Crack Initiation in Notched Unidirectional Graphite/Epoxy Composites

C. L. Chow, Fan Yang, H. Eliot Fang

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 223-233, November 16–21, 1997

Paper No: IMECE1997-0668

DOI: https://doi.org/10.1115/IMECE1997-0668

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Topics: Composite materials, Epoxy adhesives, Epoxy resins, Fracture (Materials), Graphite, Damage, Failure, Fibers, Constitutive equations, Anisotropy

Proceedings Papers

Stiffness Changes in Laminates Caused by Intralaminar Cracks and Shear Deformation

Janis Varna, Nagendra V. Akshantala, Ramesh Talreja

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 165-168, November 16–21, 1997

Paper No: IMECE1997-0661

DOI: https://doi.org/10.1115/IMECE1997-0661

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Topics: Fracture (Materials), Laminates, Shear deformation, Stiffness, Damage mechanics, Epoxy adhesives, Epoxy resins, Glass, Shear modulus

Proceedings Papers

Size Effects in Tensile, Compressive and Interlaminar Failure of Unidirectional Composites

Michael R. Wisnom

Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 67-77, November 16–21, 1997

Paper No: IMECE1997-0710

DOI: https://doi.org/10.1115/IMECE1997-0710

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Topics: Composite materials, Failure, Carbon fibers, Epoxy adhesives, Epoxy resins, Glass, Buckling, Failure mechanisms, Shear (Mechanics), Shear strength

Proceedings Papers

Thermal Shape Control of Active and Sensory Piezoelectric Composite Plates

Ho-Jun Lee, Dimitris A. Saravanos

Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 249-257, November 16–21, 1997

Paper No: IMECE1997-0726

DOI: https://doi.org/10.1115/IMECE1997-0726

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Topics: Composite materials, Plates (structures), Shapes, Temperature effects, Epoxy adhesives, Epoxy resins, Finite element analysis, Graphite, Laminates, Piezoelectric ceramics

Proceedings Papers

Prediction of First Ply Failure in Scaled Cross-Ply Composite Laminates

Karen E. Jackson

Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 11-21, November 16–21, 1997

Paper No: IMECE1997-0705

DOI: https://doi.org/10.1115/IMECE1997-0705

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Topics: Composite materials, Failure, Laminates, Stress, Tension, Acoustic emissions, Dimensions, Epoxy adhesives, Epoxy resins, Failure analysis

Proceedings Papers

On the Optimization of Composite Cylindrical Sandwich Shells Subjected to Beam Type Bending

Jack R. Vinson

Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 387-399, November 16–21, 1997

Paper No: IMECE1997-0738

DOI: https://doi.org/10.1115/IMECE1997-0738

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Topics: Composite materials, Optimization, Shells, Stress, Epoxy adhesives, Epoxy resins, Weight (Mass), Buckling, Carbon, Design

Proceedings Papers

Orthotropic Column Buckling: The Euler and Engesser/Haringx/Timoshenko Formulas Versus an Elasticity Solution

George A. Kardomateas

Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 35-48, November 16–21, 1997

Paper No: IMECE1997-0707

DOI: https://doi.org/10.1115/IMECE1997-0707

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Topics: Buckling, Elasticity, Stress, Shear (Mechanics), Composite materials, Epoxy adhesives, Epoxy resins, Circular cylinders, Cylinders, Glass

Proceedings Papers

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part III — Fracture Properties

Anthony J. Rafanelli

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 207-217, November 16–21, 1997

Paper No: IMECE1997-0820

DOI: https://doi.org/10.1115/IMECE1997-0820

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Topics: Epoxy adhesives, Epoxy resins, Fracture toughness, Reliability, Solders, Adhesives, Bonding, Creep, Fatigue, Fracture (Materials)

Proceedings Papers

Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles

M. Uschitsky, E. Suhir

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 141-170, November 16–21, 1997

Paper No: IMECE1997-0818

DOI: https://doi.org/10.1115/IMECE1997-0818

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Topics: Diffusion (Physics), Epoxy adhesives, Epoxy resins, Molding, Particulate matter, Fillers (Materials), Stress, Weight (Mass), Electronic packaging, Indium compounds

Proceedings Papers

Predicted Thermally Induced Stresses in a Glass Fiber Epoxy Bonded Into an Elliptical Enclosure

M. Uschitsky, E. Suhir

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 33-54, November 16–21, 1997

Paper No: IMECE1997-0813

DOI: https://doi.org/10.1115/IMECE1997-0813

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Topics: Epoxy adhesives, Epoxy resins, Glass fibers, Stress, Fibers, Buckling, Delamination, Design, Metals, Optical fiber

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NARROW

Investigation of the Lead-On-Chip Package’s Reliability

Evaluation of Elastic Properties of a Functionally Graded Composite Using an Elastic-Impact Technique

The Effect of Toughened Composites on Dynamic Behaviors of Composite Laminates Under the In-Plane Dynamic Load

Creep Behavior Study of Plastic Power Package by Real Time Moiré Interferometry and FEM Modeling

Effect of Thermal Residual Stress on the Measurement of the Adhesion Between Polyimide and Underfill Using an Asymmetric Double Cantilever Beam Specimen

The Effect of Temperature and Humidity Exposure on Adhesion

Stress Analysis of High Density Bare Chip Packaging Technologies

Toughening of High Performance Epoxy Adhesives Using Core-Shell Particles

The Effect of Underfill Delamination on the Reliability of Flip Chip Modules

Failure Analysis of P75 Graphite/934 Epoxy Composites Subjected to Thermal and Mechanical Loads

Crack Initiation in Notched Unidirectional Graphite/Epoxy Composites

Stiffness Changes in Laminates Caused by Intralaminar Cracks and Shear Deformation

Size Effects in Tensile, Compressive and Interlaminar Failure of Unidirectional Composites

Thermal Shape Control of Active and Sensory Piezoelectric Composite Plates

Prediction of First Ply Failure in Scaled Cross-Ply Composite Laminates

On the Optimization of Composite Cylindrical Sandwich Shells Subjected to Beam Type Bending

Orthotropic Column Buckling: The Euler and Engesser/Haringx/Timoshenko Formulas Versus an Elasticity Solution

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part III — Fracture Properties

Moisture Diffusion in Epoxy Molding Compounds Filled With Silica Particles

Predicted Thermally Induced Stresses in a Glass Fiber Epoxy Bonded Into an Elliptical Enclosure

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