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Proceedings Papers

Dynamics of Pool Boiling on Plain and Nanotube Coated Silicon Surfaces

Vijaykumar Sathyamurthi, Debjyoti Banerjee
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 1, 563-576, August 8–13, 2010
Paper No: IHTC14-22921
https://doi.org/10.1115/IHTC14-22921
View Paper titled, Dynamics of Pool Boiling on Plain and Nanotube Coated Silicon Surfaces
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Topics: Dynamics (Mechanics), Nanotubes, Pool boiling, Silicon, Temperature, Attractors, Critical heat flux, Film boiling, Multi-walled carbon nanotubes, Chaos theory
Proceedings Papers

Pool Boiling Characteristics of Heat Transfer Surface With Micro Structures Created by Using MEMS Technology

Yasuo Koizumi, Hiroyasu Ohtake, Takato Sato
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 1, 153-160, August 8–13, 2010
Paper No: IHTC14-22087
https://doi.org/10.1115/IHTC14-22087
View Paper titled, Pool Boiling Characteristics of Heat Transfer Surface With Micro Structures Created by Using MEMS Technology
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Topics: Heat transfer, Microelectromechanical systems, Pool boiling, Cavities, Boiling, Columns (Structural), Cooling, Nucleate boiling, Subcooling, Copper
Proceedings Papers

Investigation of Flow Boiling on Nanostructured Surfaces

Saeil Jeon, Pratanu Roy, N. K. Anand, Debjyoti Banerjee
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 1, 577-582, August 8–13, 2010
Paper No: IHTC14-22926
https://doi.org/10.1115/IHTC14-22926
View Paper titled, Investigation of Flow Boiling on Nanostructured Surfaces
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Topics: Boiling, Flow (Dynamics), Bubbles, Carbon nanotubes, Copper, Heat flux, Silicon, Semiconductor wafers, Temperature, Water
Proceedings Papers

Development of Surface Plasmon Resonance Immuno-Sensors at Mid-Infrared Range

William DiPippo, Bong Jae Lee, Keunhan Park
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 1, 83-89, August 8–13, 2010
Paper No: IHTC14-22914
https://doi.org/10.1115/IHTC14-22914
View Paper titled, Development of Surface Plasmon Resonance Immuno-Sensors at Mid-Infrared Range
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Topics: Finite element analysis, Sensors, Silicon, Surface plasmon resonance, Plasmons (Physics), Diffraction gratings, Microelectromechanical systems, Resonance, Biological cells, Biosensors
Proceedings Papers

An Integrated Nano-Structured Heat Spreader for High Heat Flux Electronic Systems

Siddharth Bhopte, Seshu B. Desu, Bahgat Sammakia
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 629-635, August 8–13, 2010
Paper No: IHTC14-22918
https://doi.org/10.1115/IHTC14-22918
View Paper titled, An Integrated Nano-Structured Heat Spreader for High Heat Flux Electronic Systems
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Topics: Electronic systems, Flat heat pipes, Heat flux, Heat, Thermal conductivity, Design, Electronic packages, Thermal management, Carbon, Dimensions
Proceedings Papers

Ballistic-Diffusive Heat Conduction Model

Mingtian Xu, Lin Cheng
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 293-297, August 8–13, 2010
Paper No: IHTC14-22243
https://doi.org/10.1115/IHTC14-22243
View Paper titled, Ballistic-Diffusive Heat Conduction Model
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Topics: Heat conduction, Extended irreversible thermodynamics, Electrical conductivity, Flux (Metallurgy), Heat flux, Nanoscale phenomena, Nanowires, Silicon, Size effect, Thermal conductivity
Proceedings Papers

Self Heating Distribution in Arrayed Power Devices as a Function of External Package Temperature

Kerry Maize, Ali Shakouri
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 665-669, August 8–13, 2010
Paper No: IHTC14-23010
https://doi.org/10.1115/IHTC14-23010
View Paper titled, Self Heating Distribution in Arrayed Power Devices as a Function of External Package Temperature
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Topics: Heating, Temperature, Dimensions, Electrical measurement, Engineering simulation, Silicon, Simulation, Temperature distribution, Thermoreflectance, Transistors
Proceedings Papers

Mass Nature of Heat and Its Applications III: Thermomass Model Based Damped Wave in Dielectrics

Quan-Wen Hou, Hai-Dong Wang
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 317-320, August 8–13, 2010
Paper No: IHTC14-22359
https://doi.org/10.1115/IHTC14-22359
View Paper titled, Mass Nature of Heat and Its Applications III: Thermomass Model Based Damped Wave in Dielectrics
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Topics: Dielectric materials, Heat, Waves, Heat conduction, Computer simulation, Damping, Lasers, Silicon, Temperature, Wave phenomena
Proceedings Papers

Analysis of Transient Conjugate Heat Transfer From a Hemispherical Plate During Liquid Jet Impingement

Muhammad M. Rahman, Cesar F. Hernandez
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 5, 727-736, August 8–13, 2010
Paper No: IHTC14-23318
https://doi.org/10.1115/IHTC14-23318
View Paper titled, Analysis of Transient Conjugate Heat Transfer From a Hemispherical Plate During Liquid Jet Impingement
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Topics: Heat transfer, Transients (Dynamics), Steady state, Water, Coolants, Copper, Heat flux, Reynolds number, Silicon, Transient heat transfer
Proceedings Papers

Using Quantum Dots for Liquid-Phase Thermometry at Near-Infrared Wavelengths in Silicon Devices

Myeongsub Kim, Minami Yoda
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 4, 75-81, August 8–13, 2010
Paper No: IHTC14-22885
https://doi.org/10.1115/IHTC14-22885
View Paper titled, Using Quantum Dots for Liquid-Phase Thermometry at Near-Infrared Wavelengths in Silicon Devices
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Topics: Quantum dots, Silicon, Temperature measurement, Wavelength, Temperature, Emissions, Coolants, Shells, Resolution (Optics), Density
Proceedings Papers

A Numerical Simulation Study on the Effects of Crucible Rotation and Magnetic Fields in Growth of SiGe by the Travelling Heater Method

Youhei Takagi, Atsuko Ishida, Yasunori Okano, Sadik Dost
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 2, 927-933, August 8–13, 2010
Paper No: IHTC14-23025
https://doi.org/10.1115/IHTC14-23025
View Paper titled, A Numerical Simulation Study on the Effects of Crucible Rotation and Magnetic Fields in Growth of SiGe by the Travelling Heater Method
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Topics: Computer simulation, Magnetic fields, Rotation, Crystals, Centrifugal force, Silicon, Simulation results
Proceedings Papers

Growth of Single-Walled Carbon Nanotubes at Low Temperature and Low Pressure CVD Conditions

Shohei Chiashi, Taiki Inoue, Hiroto Okabe, Junichiro Shiomi, Shigeo Maruyama
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 513-517, August 8–13, 2010
Paper No: IHTC14-23227
https://doi.org/10.1115/IHTC14-23227
View Paper titled, Growth of Single-Walled Carbon Nanotubes at Low Temperature and Low Pressure CVD Conditions
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Topics: Chemical vapor deposition, Low temperature, Pressure, Single-walled carbon nanotubes, Single-walled nanotubes, Ethanol, Temperature, Catalysts, Metals, Nanoparticles
Proceedings Papers

AC Characterization of Heated Microcantilevers for Femtogram-Level Thermophysical Property Measurement

Andrew M. Gauffreau, William DiPippo, Keunhan Park
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 433-441, August 8–13, 2010
Paper No: IHTC14-22932
https://doi.org/10.1115/IHTC14-22932
View Paper titled, AC Characterization of Heated Microcantilevers for Femtogram-Level Thermophysical Property Measurement
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Topics: Microcantilevers, Cantilevers, Finite element analysis, Signals, Computer simulation, Heating, Joules, Nanoscale phenomena, Probes, Silicon
Proceedings Papers

Experimental Investigation of Silicon-Based Oblique Finned Microchannel Heat Sinks

Yong-Jiun Lee, Poh-Seng Lee, Siaw-Kiang Chou
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 283-291, August 8–13, 2010
Paper No: IHTC14-23413
https://doi.org/10.1115/IHTC14-23413
View Paper titled, Experimental Investigation of Silicon-Based Oblique Finned Microchannel Heat Sinks
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Topics: Fins, Heat sinks, Microchannels, Silicon
Proceedings Papers

Thermal Conductivity Measurement of Graphene Exfoliated on Silicon Dioxide

Jae Hun Seol, Arden L. Moore, Insun Jo, Zhen Yao, Li Shi
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 519-523, August 8–13, 2010
Paper No: IHTC14-23295
https://doi.org/10.1115/IHTC14-23295
View Paper titled, Thermal Conductivity Measurement of Graphene Exfoliated on Silicon Dioxide
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Topics: Graphene, Silicon, Thermal conductivity measurement, Thermal conductivity, Graphite, Nanoelectronics, Atoms, Carbon, Electron mobility, Energy dissipation
Proceedings Papers

Molecular Dynamics Modeling of Heat Transport in Metals and Semiconductors

Sreekant Narumanchi, Kwiseon Kim
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 531-539, August 8–13, 2010
Paper No: IHTC14-23314
https://doi.org/10.1115/IHTC14-23314
View Paper titled, Molecular Dynamics Modeling of Heat Transport in Metals and Semiconductors
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Topics: Aluminum, Heat, Metals, Modeling, Molecular dynamics, Semiconductors (Materials), Silicon, Thermal conductivity
Proceedings Papers

Effects of Surface Roughness and Oxide Layer on the Thermal Boundary Conductance at Aluminum/Silicon Interfaces

Patrick E. Hopkins, Leslie M. Phinney, Justin R. Serrano, Thomas E. Beechem
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 313-319, August 8–13, 2010
Paper No: IHTC14-22268
https://doi.org/10.1115/IHTC14-22268
View Paper titled, Effects of Surface Roughness and Oxide Layer on the Thermal Boundary Conductance at Aluminum/Silicon Interfaces
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Topics: Aluminum, Electrical conductance, Silicon, Surface roughness, Electromagnetic scattering, Radiation scattering, Scattering (Physics), Atomic force microscopy, Interfacial thermal resistance, Mean free path
Proceedings Papers

Experimental Investigation of Steam Condensation in a Silicon Microchannel

A. Odaymet, H. Louahlia-Gualous
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 15-20, August 8–13, 2010
Paper No: IHTC14-22191
https://doi.org/10.1115/IHTC14-22191
View Paper titled, Experimental Investigation of Steam Condensation in a Silicon Microchannel
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Topics: Condensation, Microchannels, Silicon, Steam, Flow (Dynamics), Two-phase flow, Atmospheric pressure, Borosilicate glasses, Flux (Metallurgy), Heat transfer
Proceedings Papers

Tuning Thermal Conductivity With Mechanical Strain

Xiaobo Li, Jun Liu, Ronggui Yang
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 551-558, August 8–13, 2010
Paper No: IHTC14-23334
https://doi.org/10.1115/IHTC14-23334
View Paper titled, Tuning Thermal Conductivity With Mechanical Strain
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Topics: Thermal conductivity, Carbon, Silicon, Graphene, Nanowires, Polymers, Single-walled carbon nanotubes, Thin films, Buckling, Chain
Proceedings Papers

Design and Batch-Fabrication of Diamond Thermocouple Probes for the Quantitative Thermopower Profiling of Silicon IC Devices

Byeonghee Lee, Kyeongtae Kim, Seungkoo Lee, Ohmyoung Kwon, Jong Hoon Kim, Dae Soon Lim, Woo Il Lee, Joon Sik Lee
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 559-563, August 8–13, 2010
Paper No: IHTC14-23347
https://doi.org/10.1115/IHTC14-23347
View Paper titled, Design and Batch-Fabrication of Diamond Thermocouple Probes for the Quantitative Thermopower Profiling of Silicon IC Devices
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Topics: Density, Design, Diamonds, Junctions, Manufacturing, Probes, Silicon, Thermocouples