... solutions and determination of optimal designs. We believe that the analysis and methodology presented in this paper would be helpful in the development of better thermal management devices aided by additive manufacturing in future. electronics cooling thermal management additive manufacturing...

..., and correspondingly the maximum Nusselt number is enhanced by 51%. liquid crystal electronics cooling jet impingement cooling Proceedings of the ASME 2022 Heat Transfer Summer Conference HT2022 July 11-13, 2022, Philadelphia, Pennsylvania HT2022-81617 AN EXPERIMENTAL STUDY ON HEAT TRANSFER PERFORMANCE...

...-induced disruptions of liquid supply to the evaporator. A latent heat flux of approximately 6.7 W/cm 2 is absorbed per unit area of the evaporator during the device startup phase. electronics cooling thermal management loop heat pipe capillary pumped loop microfluidics A planar evaporator...

..., multiple-channel heat sink system. Recommendations for moving toward an optimum geometry, based on thermal performance and agitator power are made. Electronics cooling agitation heat sink aspect ratio EFFECTS OF CHANNEL ASPECT RATIO ON CONVECTIVE HEAT TRANSFER IN AN ELECTRONICS COOLING HEAT...

... of approximately 35m/s from 92, 0.9 mm × 0.9 mm orifices. The results give guidance to those who face a similar interference problem and are considering displacement of the synthetic jet assembly. Electronics cooling synthetic jets heat sink heat transfer enhancement 1 Copyright © 2013 by ASME HEAT...

... flow is of a low velocity compared to the synthetic jet peak velocity (as low as 4 m/s in the present study). synthetic jet heat transfer enhancement electronics cooling heat sink 1 Copyright © 2012 by ASME HEAT TRANSFER ENHANCEMENT BY SYNTHETIC JET ARRAYS IN AIR-COOLED HEAT SINKS FOR USE...

... 23 02 2010 Piezoelectric fans have been investigated for electronics cooling over the last several decades. The primary usage of these meso scale-vibrating fans has been to create sweeping flows over the heated surfaces. In this paper, an experimental study to understand the heat...

... the jet orifice was measured, and the calculated pressure loss coefficients agree well with available correlations. Curve fits for the Nusselt number and pressure loss coefficient are given. electronics cooling microscale jet heat transfer microjet orifice pressure loss coefficient 1...

... and jet-to-surface spacing, resulting in about 90% enhancement of the maximum and overall cooling rate compared to a single jet, without the need for external cross-flow forcing. synthetic jet impinging jet vectoring cross-flow electronics cooling particle image velocimetry HEAT TRANSFER...

... resistance as a function of hydrodynamic power consumed was formulated, thus facilitating the selection of a cold plate for a practical application. Electronics Cooling Thermal Management Liquid Cooling Primary Heat Exchangers Cold Plates 1 Copyright © 2007 by ASME Proceedings of HT2007 2007...

... of the overall dimensions as the FHP. Keywords: Flat heat pipe, Transient, Electronics cooling, Hydrodynamic model NOMENCLATURE A area, m mass flow rate, kg m-3 Cp specific heat capacity, Jkg-1K-1 density, kgm-3 H thickness, m surface tension, N m-1 Proceedings of 2008 ASME Summer Heat transfer Conferen...

... 10 07 2009 Piezoelectric fans have been investigated for electronics cooling over the last decade. The primary usage or method has been to place the vibrating fan near the surface to be cooled. The piezofan used in the current study is composed of a piezo actuator attached...

... and chaotic churn flow typified the evaporators with small diameters. In line with previous pool boiling experiments, the nucleate boiling mechanism was significantly enhanced, up to 4 times, by the nano- and micro-porous enhancement structure. Thermosyphon electronics cooling enhanced boiling nano...

... surface. Test data indicating an evaporator thermal resistance of 0.080 cm 2 ·°C/W at 290W/cm 2 are presented. Heat pipe thermal resistance coefficient of thermal expansion silicon electronics cooling test artic copper/mo Test data i cm2·ºC/W KEYWOR Heat expansion, NOMENC A = cross s BLT...

... Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems . Heat Pipe Remote Heat Exchanger Electronics Cooling Notebook Mobile Proceedings of HT2005: ASME Summer Heat Transfer Conference Proceedings of HT2005 2005 ASME Summer Heat Transfer Conference 1...

... of the surface and to be well predicted by a correlation available in the literature. boiling channel confinement electronics cooling Proceedings of HT2005 2005 ASME Summer Heat Transfer Conference ro Fl be co co IN di re so in Fl te m as pr co co Proceedings of HT2005 2005 ASME Summer Heat Transfer...

... found increasingly widespread use in electronics cooling applications. With chip-level heat fluxes reaching 75-100 W/cm2, heat pipes provide an attractive passive alternative for use as heat spreaders and to transport heat to remote heat sinks for dissipation. Though a variety of analytical...

..., the total power dissipated increases with both Reynolds number and component spacing. As in natural convection, the relative location of the electrical sources and the positioning of the sources are found to have a strong influence on power dissipation. Electronics Cooling Opto-Electronics High Heat...