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Proceedings Papers

Development of a Numerical Model to Assess Sensitivity for Fiber Probe Frequency-Domain Thermoreflectance Measurements

Ronald J. Warzoha
Proc. ASME. HT2022, ASME 2022 Heat Transfer Summer Conference, V001T09A002, July 11–13, 2022
Paper No: HT2022-80540
DOI: https://doi.org/10.1115/HT2022-80540
View Paper titled, Development of a Numerical Model to Assess Sensitivity for Fiber Probe Frequency-Domain Thermoreflectance Measurements
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Topics: Computer simulation, Fibers, Probes, Thermoreflectance, Thermal properties, Cladding systems (Building), Microscopes, Thermal conductivity, Transducers
Proceedings Papers

Assessment of Models for Extracting Thermal Conductivity From Frequency Domain Thermoreflectance Experiments

Siddharth Saurav, Sandip Mazumder
Proc. ASME. HT2020, ASME 2020 Heat Transfer Summer Conference, V001T15A001, July 13–15, 2020
Paper No: HT2020-8920
DOI: https://doi.org/10.1115/HT2020-8920
View Paper titled, Assessment of Models for Extracting Thermal Conductivity From Frequency Domain Thermoreflectance Experiments
Click here to open pdf in another window PDF for Assessment of Models for Extracting Thermal Conductivity From Frequency Domain Thermoreflectance Experiments
Topics: Thermal conductivity, Thermoreflectance, Heat conduction, Boundary-value problems, Transducers, Cooling, Electrical conductance, Heat, Lasers, Pumps
Proceedings Papers

Thermal Conductivity Measurement of In 0.10 Ga 0.90 As 0.96 N 0.04 Thin Film

Antony Jan, Ramez Cheaito, Kenneth E. Goodson, Bruce M. Clemens
Proc. ASME. HT2017, Volume 2: Heat Transfer Equipment; Heat Transfer in Multiphase Systems; Heat Transfer Under Extreme Conditions; Nanoscale Transport Phenomena; Theory and Fundamental Research in Heat Transfer; Thermophysical Properties; Transport Phenomena in Materials Processing and Manufacturing, V002T15A007, July 9–12, 2017
Paper No: HT2017-5089
DOI: https://doi.org/10.1115/HT2017-5089
View Paper titled, Thermal Conductivity Measurement of In 0.10 Ga 0.90 As 0.96 N 0.04 Thin Film
Click here to open pdf in another window PDF for Thermal Conductivity Measurement of In 0.10 Ga 0.90 As 0.96 N 0.04 Thin Film
Topics: Thermal conductivity measurement, Thin films, Thermal conductivity, Electromagnetic scattering, Gallium arsenide, Metalorganic chemical vapor deposition, Optical fiber, Phonons, Radiation scattering, Scattering (Physics)
Proceedings Papers

Analytical Solutions of Enhanced Gray Boltzmann Transport Equation on Transient Thermal Grating and Time-Domain Thermoreflectance Experiments

Dadong Wang, Zhengxian Qu, Yanbao Ma
Proc. ASME. HT2017, Volume 2: Heat Transfer Equipment; Heat Transfer in Multiphase Systems; Heat Transfer Under Extreme Conditions; Nanoscale Transport Phenomena; Theory and Fundamental Research in Heat Transfer; Thermophysical Properties; Transport Phenomena in Materials Processing and Manufacturing, V002T13A003, July 9–12, 2017
Paper No: HT2017-5040
DOI: https://doi.org/10.1115/HT2017-5040
View Paper titled, Analytical Solutions of Enhanced Gray Boltzmann Transport Equation on Transient Thermal Grating and Time-Domain Thermoreflectance Experiments
Click here to open pdf in another window PDF for Analytical Solutions of Enhanced Gray Boltzmann Transport Equation on Transient Thermal Grating and Time-Domain Thermoreflectance Experiments
Topics: Diffraction gratings, Thermoreflectance, Transients (Dynamics), Heat, Fourier transforms, Nanoscale phenomena, Signals
Proceedings Papers

Temperature Measurement of Microscale Electronic Devices With 3D Thermoreflectance Imaging

Hongjie Zhang, Sy-Bor Wen
Proc. ASME. HT2017, Volume 1: Aerospace Heat Transfer; Computational Heat Transfer; Education; Environmental Heat Transfer; Fire and Combustion Systems; Gas Turbine Heat Transfer; Heat Transfer in Electronic Equipment; Heat Transfer in Energy Systems, V001T08A003, July 9–12, 2017
Paper No: HT2017-4954
DOI: https://doi.org/10.1115/HT2017-4954
View Paper titled, Temperature Measurement of Microscale Electronic Devices With 3D Thermoreflectance Imaging
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Topics: Imaging, Microscale devices, Temperature measurement, Thermoreflectance, Signals, Temperature distribution, Calibration, Construction, Field theories (Physics), High temperature
Proceedings Papers

Improving the Resolution of Steady-State, Infrared-Based Thermal Interface Resistance Measurements Using High-Precision Metrology to Determine In-Situ TIM Thickness

Ronald J. Warzoha, Andrew N. Smith, Maurice Harris
Proc. ASME. HT2016, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamentals in Heat Transfer; Nanoscale Thermal Transport; Heat Transfer in Equipment; Heat Transfer in Fire and Combustion; Transport Processes in Fuel Cells and Heat Pipes; Boiling and Condensation in Macro, Micro and Nanosystems, V001T02A001, July 10–14, 2016
Paper No: HT2016-7043
DOI: https://doi.org/10.1115/HT2016-7043
View Paper titled, Improving the Resolution of Steady-State, Infrared-Based Thermal Interface Resistance Measurements Using High-Precision Metrology to Determine In-Situ TIM Thickness
Click here to open pdf in another window PDF for Improving the Resolution of Steady-State, Infrared-Based Thermal Interface Resistance Measurements Using High-Precision Metrology to Determine In-Situ TIM Thickness
Topics: Metrology, Resolution (Optics), Steady state, Flow (Dynamics), Heat, Interfacial thermal resistance, Junctions, Measurement systems, Measurement uncertainty, Performance characterization
Proceedings Papers

The Effect of Ballistic Electron Transport on Copper-Niobium Thermal Interface Conductance

Ramez Cheaito, John C. Duda, Thomas E. Beechem, Jon F. Ihlefeld, Khalid Hattar, Edward S. Piekos, Amit Misra, Jon K. Baldwin, Patrick E. Hopkins
Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T03A009, July 14–19, 2013
Paper No: HT2013-17541
DOI: https://doi.org/10.1115/HT2013-17541
View Paper titled, The Effect of Ballistic Electron Transport on Copper-Niobium Thermal Interface Conductance
Click here to open pdf in another window PDF for The Effect of Ballistic Electron Transport on Copper-Niobium Thermal Interface Conductance
Topics: Copper, Electrical conductance, Electron transport, Electromagnetic scattering, Electrons, Metals, Thermal conductivity, Resistors, Temperature, Thermoreflectance
Proceedings Papers

Thermal Conductivity Measurement of Cobalt-Iron Thin Films Using the Time-Resolved Thermoreflectance Technique

Taehee Jeong, Jian-Gang Zhu
Proc. ASME. HT2009, Volume 2: Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Computational Heat Transfer, 235-240, July 19–23, 2009
Paper No: HT2009-88330
DOI: https://doi.org/10.1115/HT2009-88330
View Paper titled, Thermal Conductivity Measurement of Cobalt-Iron Thin Films Using the Time-Resolved Thermoreflectance Technique
Click here to open pdf in another window PDF for Thermal Conductivity Measurement of Cobalt-Iron Thin Films Using the Time-Resolved Thermoreflectance Technique
Topics: Cobalt, Iron, Thermal conductivity, Thermal conductivity measurement, Thermoreflectance, Thin films
Proceedings Papers

Thermal Models for Determining Thermal Conductivity and Thermal Boundary Conductance Using Pump-Probe Thermoreflectance Techniques

Patrick E. Hopkins, Justin R. Serrano, Leslie M. Phinney
Proc. ASME. HT2009, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment, 497-503, July 19–23, 2009
Paper No: HT2009-88269
DOI: https://doi.org/10.1115/HT2009-88269
View Paper titled, Thermal Models for Determining Thermal Conductivity and Thermal Boundary Conductance Using Pump-Probe Thermoreflectance Techniques
Click here to open pdf in another window PDF for Thermal Models for Determining Thermal Conductivity and Thermal Boundary Conductance Using Pump-Probe Thermoreflectance Techniques
Topics: Electrical conductance, Probes, Pumps, Thermal conductivity, Thermoreflectance, Locks (Waterways), Signals, Top-tensioned risers, Heating, Thin films
Proceedings Papers

Experimental Measurement of Multiple Thermal Properties by Error Minimization

Brian Smith, Cristina Amon
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 283-291, July 8–12, 2007
Paper No: HT2007-32190
DOI: https://doi.org/10.1115/HT2007-32190
View Paper titled, Experimental Measurement of Multiple Thermal Properties by Error Minimization
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Topics: Errors, Fittings, Temperature measurement, Thermal properties, Thermoreflectance, Thin films, Polymer films, Actuators, Algorithms, Approximation
Proceedings Papers

Thermal Conductivity Measurements and Modeling of Phase-Change GST Materials

Yizhang Yang, Taehee Jeong, Hendrik F. Hamann, Jimmy Zhu, Mehdi Asheghi
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1, 925-932, July 8–12, 2007
Paper No: HT2007-32830
DOI: https://doi.org/10.1115/HT2007-32830
View Paper titled, Thermal Conductivity Measurements and Modeling of Phase-Change GST Materials
Click here to open pdf in another window PDF for Thermal Conductivity Measurements and Modeling of Phase-Change GST Materials
Topics: Modeling, Thermal conductivity, Cycles, Data storage systems, Density, Disks, Electrical resistance, Jitter, Optimization, Phase change materials
Proceedings Papers

Analysis and Mitigation of Sample Heating in Thermoreflectance Microscopy

Andrew C. Miner, Uttam Ghoshal
Proc. ASME. HT2005, Heat Transfer: Volume 4, 891-894, July 17–22, 2005
Paper No: HT2005-72849
DOI: https://doi.org/10.1115/HT2005-72849
View Paper titled, Analysis and Mitigation of Sample Heating in Thermoreflectance Microscopy
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Topics: Heating, Microscopy, Thermoreflectance, Heat flux, Temperature, Electronic systems, Errors, MEMS packaging, Nanoelectromechanical systems, Pacific Rim
Proceedings Papers

Thermal Characterization of Dielectric and Phase Change Materials for the Optical Recording Applications

Y. Yang, Chun-Teh Li, S. M. Sadeghipour, M. Asheghi, H. Dieker, M. Wuttig
Proc. ASME. HT2005, Heat Transfer: Volume 4, 837-843, July 17–22, 2005
Paper No: HT2005-72679
DOI: https://doi.org/10.1115/HT2005-72679
View Paper titled, Thermal Characterization of Dielectric and Phase Change Materials for the Optical Recording Applications
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Topics: Phase change materials, Thermal characterization, Metals, Electronic systems, Interfacial thermal resistance, MEMS packaging, Modeling, Nanoelectromechanical systems, Pacific Rim, Thermoreflectance