1-3 of 3
Flaw detection
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Non-Intrusive Cooling System Fault Detection and Diagnostics Using Acoustic Emission

Hari Pandey, Weston Waldo, Han Hu
Proc. ASME. HT2022, ASME 2022 Heat Transfer Summer Conference, V001T09A004, July 11–13, 2022
Paper No: HT2022-85429
DOI: https://doi.org/10.1115/HT2022-85429
View Paper titled, Non-Intrusive Cooling System Fault Detection and Diagnostics Using Acoustic Emission
Click here to open pdf in another window PDF for Non-Intrusive Cooling System Fault Detection and Diagnostics Using Acoustic Emission
Topics: Acoustic emissions, Cooling systems, Critical heat flux, Flaw detection
Proceedings Papers

Using Infrared Thermography for Detecting Defects on Surfaces With Low and Variable Emissivity

Christopher Dalton, Brandon Olson, Feng C. Lai
Proc. ASME. HT2009, Volume 2: Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Computational Heat Transfer, 435-442, July 19–23, 2009
Paper No: HT2009-88645
DOI: https://doi.org/10.1115/HT2009-88645
View Paper titled, Using Infrared Thermography for Detecting Defects on Surfaces With Low and Variable Emissivity
Click here to open pdf in another window PDF for Using Infrared Thermography for Detecting Defects on Surfaces With Low and Variable Emissivity
Topics: Emissivity, Flaw detection, Thermography, Radiation (Physics), Computer software, Hardware, Radiative heat transfer, Sensors, Temperature
Proceedings Papers

Characterization of Electronic Packages by Thermal Diffusion Tomography

Hakan Erturk
Proc. ASME. HT2009, Volume 2: Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Computational Heat Transfer, 249-258, July 19–23, 2009
Paper No: HT2009-88380
DOI: https://doi.org/10.1115/HT2009-88380
View Paper titled, Characterization of Electronic Packages by Thermal Diffusion Tomography
Click here to open pdf in another window PDF for Characterization of Electronic Packages by Thermal Diffusion Tomography
Topics: Electronic packages, Thermal diffusion, Thermal management, Acoustics, Algorithms, Computerized tomography, Flaw detection, Heat, Imaging, Manufacturing