Alternating 10 nm thermoelectric films of N-type Si/SiGe and P-type Si/SiGe and B4C/B9C have been fabricated on various substrates, electrically joined and thermoelectric properties measured from 40°K up to 700°K. These nanoscale thermoelectric films demonstrate excellent thermoelectric power factors significantly higher than current bulk thermoelectric materials. The implications of the measured thermoelectric Seebeck coefficient data and electrical resistivity data for alternating 10 nm films that are grown to thicknesses of one to 10 microns means efficiencies of 15% at 200°C temperature differences and efficiencies of 30% at 400°C temperature differences. Utilizing Seebeck and resistivity data obtained by Hi-Z and UCSD, along with published bulk thermal conductivity data, which is conservative, unique thermoelectric module and generator concept designs for both power generation and cooling are presented over wide temperature and power ranges.
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ASME 2007 2nd Energy Nanotechnology International Conference
September 5–7, 2007
Santa Clara, California, USA
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4799-3
PROCEEDINGS PAPER
Performance of Nanoscale Quantum Well Thermoelectrics
Daniel Krommenhoek,
Daniel Krommenhoek
Hi-Z Technology, Inc., San Diego, CA
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Norbert Elsner,
Norbert Elsner
Hi-Z Technology, Inc., San Diego, CA
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Saeid Ghamaty,
Saeid Ghamaty
Hi-Z Technology, Inc., San Diego, CA
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Velimir Jovanovic
Velimir Jovanovic
Hi-Z Technology, Inc., San Diego, CA
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Daniel Krommenhoek
Hi-Z Technology, Inc., San Diego, CA
Norbert Elsner
Hi-Z Technology, Inc., San Diego, CA
Saeid Ghamaty
Hi-Z Technology, Inc., San Diego, CA
Velimir Jovanovic
Hi-Z Technology, Inc., San Diego, CA
Paper No:
ENIC2007-45009, pp. 33-38; 6 pages
Published Online:
March 9, 2009
Citation
Krommenhoek, D, Elsner, N, Ghamaty, S, & Jovanovic, V. "Performance of Nanoscale Quantum Well Thermoelectrics." Proceedings of the ASME 2007 2nd Energy Nanotechnology International Conference. ASME 2007 2nd Energy Nanotechnology International Conference. Santa Clara, California, USA. September 5–7, 2007. pp. 33-38. ASME. https://doi.org/10.1115/ENIC2007-45009
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