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Research Papers

Quantitative Prediction of the Whole Peeling Process of an Elastic Film on a Rigid Substrate

[+] Author and Article Information
H. B. Yin

LNM,
Institute of Mechanics,
Chinese Academy of Sciences,
Beijing 100190, China;
School of Engineering Sciences,
University of Chinese Academy of Sciences,
Beijing 100049, China

S. H. Chen

Institute of Advanced Structure Technology,
Beijing Institute of Technology,
Beijing 100081, China;
Beijing Key Laboratory of Lightweight
Multi-Functional Composite
Materials and Structures,
Beijing Institute of Technology,
Beijing 100081, China
e-mail: shchen@bit.edu.cn

L. H. Liang

LNM,
Institute of Mechanics,
Chinese Academy of Sciences,
Beijing 100190, China;
School of Engineering Sciences,
University of Chinese Academy of Sciences,
Beijing 100049, China
e-mail: lianglh@lnm.imech.ac.cn

Z. L. Peng

Institute of Advanced Structure Technology,
Beijing Institute of Technology,
Beijing 100081, China;
Beijing Key Laboratory of Lightweight
Multi-Functional Composite
Materials and Structures,
Beijing Institute of Technology,
Beijing 100081, China

Y. G. Wei

College of Engineering,
Peking University,
Beijing 100871, China

1Corresponding authors.

Contributed by the Applied Mechanics Division of ASME for publication in the JOURNAL OF APPLIED MECHANICS. Manuscript received March 8, 2018; final manuscript received May 21, 2018; published online June 14, 2018. Editor: Yonggang Huang.

J. Appl. Mech 85(9), 091004 (Jun 14, 2018) (9 pages) Paper No: JAM-18-1134; doi: 10.1115/1.4040336 History: Received March 08, 2018; Revised May 21, 2018

The whole peeling behavior of thin films on substrates attract lots of research interests due to the wide application of film-substrate systems, which was well modeled theoretically by introducing Lennard–Jones (L-J) potential to describe the interface in Peng and Chen (2015, Effect of Bending Stiffness on the Peeling Behavior of an Elastic Thin Film on a Rigid Substrate,” Phys. Rev. E, 91(4), p. 042401). However, it is difficult for real applications because the parameters in the L-J potential are difficult to determine experimentally. In this paper, with the help of the peeling test and combining the constitutive relation of a cohesive zone model (CZM) with the L-J potential, we establish a new method to find the parameters in the L-J potential. The whole peeling process can then be analyzed quantitatively. Both the theoretical prediction and the experimental result agree well with each other. Finite element simulations of the whole peeling process are carried out subsequently. Quantitative agreements among the theoretical prediction, numerical calculation, and the experiment measurement further demonstrate the feasibility of the method. Effects of not only the interface strength but also the interface toughness on the whole peeling behavior are analyzed. It is found that the peeling force at a peeling angle of 90 deg during the steady-state stage is affected only by the interface toughness, while the peeling force before the steady-state stage would be influenced significantly by the interface toughness, interface strength, and bending stiffness of the film. All the present results should be helpful for deep understanding and theoretical prediction of the interface behavior of film-substrate systems in real applications.

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Figures

Grahic Jump Location
Fig. 3

The T-S curve of the L-J potential, where y/β is the dimensionless interface separation displacement and V′β/α is the dimensionless interface traction

Grahic Jump Location
Fig. 2

The bilinear T-S curves of the interface CZM: (a) the total response, (b) the response in the normal direction, and (c) the response in the tangent direction

Grahic Jump Location
Fig. 1

Schematics of an elastic thin film with a length L peeling from a rigid substrate with a peeling force P and a peeling angle θP at the right end of the film. A curvilinear coordinate (s,θ) and a rectangular one (x,y) are attached to the film-substrate system with the origin o at the left end of the film. (a) The initial peeling state and (b) an intermediate state.

Grahic Jump Location
Fig. 4

Schematic of the peeling test

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Fig. 5

The universal test machine and the peeling fixture

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Fig. 11

The results of finite element model discussing the effect of different parameters on the peeling force in the whole peeling process in the case with the peeling angle of 90 deg: (a) the effect of the interface toughness, (b) the effect of the interface strength, (c) the effect of the film modulus, and (d) the effect of the film thickness

Grahic Jump Location
Fig. 6

The peeling force-crosshead displacement curves with films of different thickness on different substrates in the case with the peeling angle of 90 deg: (a) the experimental data on PVC substrates and (b) the experimental data on glass substrates

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Fig. 7

Pictures of the cohesive zone for different substrate interfaces: (a) the interface of a film on a PVC substrate and (b) the interface of a film on a glass substrate

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Fig. 8

Comparison of the theoretical results predicted by Peng and Chen's model [19], the finite element calculations and the experiment data in the case with the peeling angle of 90 deg: (a) a 0.4 mm film on a PVC substrate and (b) a 0.4 mm film on a glass substrate

Grahic Jump Location
Fig. 9

The finite element model and the details of the meshes

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Fig. 10

The effect of the stiffness K (i.e., δ0/δ¯) in the CZM on the whole peeling behavior when the peeling angle is 90 deg

Grahic Jump Location
Fig. 12

The effect of different dimensionless parameters on the maximum peeling force, including the dimensionless interface toughness, interface strength, film thickness, and film's Young's modulus

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