Technical Brief

One-Dimensional Constrained Blister Test to Measure Thin Film Adhesion

[+] Author and Article Information
Tingting Zhu, Sinan Müftü

Mechanical and Industrial Engineering,
Northeastern University,
Boston, MA 02115

Kai-tak Wan

Mechanical and Industrial Engineering,
Northeastern University,
Boston, MA 02115
e-mail: ktwan@coe.neu.edu

1Corresponding author.

Manuscript received December 18, 2017; final manuscript received January 29, 2018; published online March 2, 2018. Editor: Yonggang Huang.

J. Appl. Mech 85(5), 054501 (Mar 02, 2018) (3 pages) Paper No: JAM-17-1682; doi: 10.1115/1.4039171 History: Received December 18, 2017; Revised January 29, 2018

A rectangular film is clamped at the opposite ends before being inflated into a blister by an external pressure, p. The bulging film adheres to a constraining plate with distance, w0, above. Increasing pressure expands the contact area of length, 2c. Depressurization shrinks the contact area and ultimate detaches the film. The relation of (p, w0, c) is established for a fixed interfacial adhesion energy.

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Zhu, T. , Li, G. , Muftu, S. , and Wan, K.-T. , 2017, “ Revisiting the Constrained Blister Test to Measure Thin Film Adhesion,” ASME J. Appl. Mech., 84(7), p. 071005. [CrossRef]
Williams, J. G. , 1997, “ Energy Release Rates for the Peeling of Flexible Membranes and the Analysis of Blister Tests,” Int. J. Fract., 87(3), pp. 265–288. [CrossRef]
Li, G. , and Wan, K. T. , 2010, “ Delamination Mechanics of a Clamped Rectangular Membrane in the Presence of Long-Range Intersurface Forces: Transition From JKR to DMT Limits,” J. Adhes., 86(3), pp. 335–351. [CrossRef]


Grahic Jump Location
Fig. 1

Schematic of a pressurized 1D rectangular film adhering to a rigid constraining plate above

Grahic Jump Location
Fig. 2

Mechanical response of (a) contact length, c, (b) contact angle, θ, and (c) force to keep plate in equilibrium, F, as functions of applied pressure for w0 = 1 and fixed adhesion energy. Initial loading along OA causes the film to bulge but yet to touch the plate. For γ = 5, pressurization along AB causes (a) contact to expand from null to maximum, (b) θ to remain at zero, and (c) F to increase to counterbalance the rising pressure. Initial depressurization along BCD causes (a) c to remain constant, (b) θ to increase to raise G, and (c) F to diminish. Further decrease in p causes delamination along DP, where (a) contact shrinks, (b) θ to rise further, and (c) F to diminish further. Pinch-off occurs at P when the contact area reduces to a line and the film spontaneously detaches from the plate. Stronger adhesion with γ = 20 retraces the loading path OAB. Initial depressurization along BCDHK where the contact remains unchanged. Further decrease in p leads to delamination along KQ. Pull-off occurs at Q when dp/dc = 0.

Grahic Jump Location
Fig. 3

Changing film profile for w0 = 1. (a) Initial pressurization along OAB causes the film to bulge and the contact to expand. (b) For γ = 5, pressure decreases along BCDP. Along BCD, the contact area remains unchanged but θ increases. Delamination occurs along DP until pinch-off at P. (c) For γ = 20, pressure decreases along BCDHKQ with pull-off at Q. The curves are labeled based on Fig. 2.

Grahic Jump Location
Fig. 4

Contact length as a function of applied pressure for w0 = 1 and a range of adhesion energy. The lowest curve corresponds to γ = 0, and the area underneath is forbidden. Curves labeled γ = 5 and γ = 20 correspond to those shown in Figs. 2 and 3. Curve labeled γ = 8 indicates the transition from pinch-off to pull-off. The locus of pull-off (dp/dc = 0) is shown as gray curve.

Grahic Jump Location
Fig. 5

Relations of “pull-off” parameters for a range of w0. (a) Critical pressure and (b) contact length as functions of adhesion energy with a range of gap w0. (c) Critical contact length as a function of critical pressure. The symbols denote the transition γ = γ from pinch-off to pull-off.




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