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research-article

Strain-limiting substrates based on non-buckling, prestrain-free mechanics for robust stretchable electronics

[+] Author and Article Information
Maoyi Zhang

State Key Laboratory of Nonlinear Mechanics, Institute of Mechanics, Chinese Academy of Sciences, Beijing 100190, ChinaSchool of Engineering Science, University of Chinese Academy of Sciences, Beijing 100049, China
maoyizhang@lnm.imech.ac.cn

Hao Liu

State Key Laboratory of Nonlinear Mechanics, Institute of Mechanics, Chinese Academy of Sciences, Beijing 100190, ChinaInstitute of Solid Mechanics, Beihang University (BUAA), Beijing 100191, China
liuhao1105@buaa.edu.cn

Peng Cao

Department of Hydraulic Engineering, Tsinghua University, Beijing 100084, China
caopeng518888@126.com

Bin Chen

Institute of Solid Mechanics, Beihang University (BUAA), Beijing 100191, China
cbbuaa@outlook.com

Jianqiao Hu

State Key Laboratory of Nonlinear Mechanics, Institute of Mechanics, Chinese Academy of Sciences, Beijing 100190, China
jianqiaohu@imech.ac.cn

Yuli Chen

Institute of Solid Mechanics, Beihang University (BUAA), Beijing 100191, China
yulichen@buaa.edu.cn

Bing Pan

Institute of Solid Mechanics, Beihang University (BUAA), Beijing 100191, China
panb@buaa.edu.cn

Jonathan A. Fan

Department of Electrical Engineering, Stanford University, Stanford, CA 94305, USA
jonfan@stanford.edu

Rui Li

State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, International Research Center for Computational Mechanics, Dalian University of Technology, Dalian 116024, China
ruili@dlut.edu.cn

Lijuan Zhang

State Key Laboratory of Nonlinear Mechanics, Institute of Mechanics, Chinese Academy of Sciences, Beijing 100190, China
zhanglijuan@imech.ac.cn

Yewang Su

State Key Laboratory of Nonlinear Mechanics, Institute of Mechanics, Chinese Academy of Sciences, Beijing 100190, ChinaSchool of Engineering Science, University of Chinese Academy of Sciences, Beijing 100049, ChinaState Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, International Research Center for Computational Mechanics, Dalian University of Technology, Dalian 116024, ChinaState Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China
yewangsu@imech.ac.cn

1Corresponding author.

ASME doi:10.1115/1.4038173 History: Received August 24, 2017; Revised October 07, 2017

Abstract

Stretchable electronics based on inorganic materials are an innovative technology with potential applications for many emerging electronic devices, due to their combination of stretchable mechanics and high electronic performance. The compliant elastomeric substrate, on which the brittle electronic components are mounted, plays a key role in achieving stretchability. However, conventional elastomeric substrates can undergo excessive mechanical deformation, which can lead to active component failure. Here, we introduce a simple and novel strategy to produce failure-resistant stretchable electronic platforms by bonding a thin film of stiff material, patterned into a serpentine network layout, to the elastomeric substrate. No prestraining of the substrate is required, and these systems offer sharp bilinear mechanical behavior and high ratio of tangent-to-elastic moduli. We perform comprehensive theoretical, numerical and experimental studies on the non-buckling based prestrain-free design, and we analyze the key parameters impacting the mechanical behavior of a strain-limiting substrate. As a device-level demonstration, we experimentally fabricate and characterize skin-mountable stretchable copper (Cu) electrodes for electrophysiological (EP) monitoring. This study paves the way to high performance stretchable electronics with failure-resistant designs.

Copyright (c) 2017 by ASME
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