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research-article

Revisiting the Constrained Blister Test to Measure Thin Film Adhesion

[+] Author and Article Information
Tingting Zhu

Mechanical and Industrial Engineering Northeastern University Boston, MA, 02115
zhu.tin@husky.neu.edu

Guangxu Li

Mechanical and Industrial Engineering Northeastern University Boston, MA, 02115
guangxu3559@gmail.com

Sinan Muftu

Mechanical and Industrial Engineering Northeastern University Boston, MA, 02115
s.muftu@neu.edu

Kai-tak Wan

Mechanical and Industrial Engineering Northeastern University Boston, MA, 02115
ktwan@coe.neu.edu

1Corresponding author.

ASME doi:10.1115/1.4036776 History: Received April 02, 2017; Revised May 13, 2017

Abstract

A thin film is clamped at the periphery to form a circular freestanding diaphragm before a uniform pressure, p, is applied to inflate it into a blister. The bulging membrane adheres to a rigid constraining plate with height, w0, from the non-deformed membrane. Increasing pressure expands the contact circle of radius, c. Depressurization causes shrinkage of the contact and “pull-off” or spontaneous detachment from the plate. Simultaneous measurement of ( p, w0, c ) allows one to determine the adhesion energy, ?. A solid mechanics model is constructed based on small strain and linear elasticity, which shows a characteristic loading-unloading hysteresis. The results are consistent with a large deformation model in the literature.

Copyright (c) 2017 by ASME
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