0
Research Papers

Analytical Model on Lithiation-Induced Interfacial Debonding of an Active Layer From a Rigid Substrate

[+] Author and Article Information
Bo Lu

Shanghai Institute of Applied
Mathematics and Mechanics,
Shanghai University,
Shanghai 200072, China
e-mail: riverbug@t.shu.edu.cn

Yanfei Zhao

Materials Genome Institute,
Shanghai University,
Shanghai 200444, China;
Shanghai Institute of Applied
Mathematics and Mechanics,
Shanghai University,
Shanghai 200072, China
e-mail: yfzhao50@sina.com

Yicheng Song

Department of Mechanics,Shanghai Key Laboratory of
Mechanics in Energy Engineering,
Shanghai University,
Shanghai 200444, China
e-mail: ycsong@shu.edu.cn

Junqian Zhang

Department of Mechanics,Materials Genome Institute,Shanghai Key Laboratory of
Mechanics in Energy Engineering,
Shanghai University,
Shanghai 200444, China
e-mail: jqzhang2@shu.edu.cn

1Corresponding author.

Contributed by the Applied Mechanics Division of ASME for publication in the JOURNAL OF APPLIED MECHANICS. Manuscript received June 28, 2016; final manuscript received September 15, 2016; published online October 5, 2016. Assoc. Editor: Kyung-Suk Kim.

J. Appl. Mech 83(12), 121009 (Oct 05, 2016) (8 pages) Paper No: JAM-16-1329; doi: 10.1115/1.4034783 History: Received June 28, 2016; Revised September 15, 2016

By directly solving the prescribed differential equations, an analytical method based on the cohesive model has been developed to investigate the interfacial debonding process induced by lithiation in an axisymmetric thin film electrode where an elastic active layer is bonded on a rigid substrate. The assumption of rigid substrate has been proved acceptable for high-modulus substrates such as copper and aluminum which are common materials for current collectors in lithium-ion batteries. For the case where the weak interface is assumed and the radial concentration gradient is neglected, an extremely simplified solution has been obtained. The simplified solution which has acceptable accuracy provides a good guidance for understanding and predicting the interfacial debonding.

FIGURES IN THIS ARTICLE
<>
Copyright © 2016 by ASME
Your Session has timed out. Please sign back in to continue.

References

Figures

Grahic Jump Location
Fig. 1

A circular active thin film bonded to a rigid substrate: (a) axisymmetric model shown by side view and (b) debonding model shown by top view

Grahic Jump Location
Fig. 2

Size of the debonding zone changing with dimensionless lithiation time t¯ for different loading factor I¯

Grahic Jump Location
Fig. 3

Size of the debonding zone changing with dimensionless lithiation time t¯ for different α

Grahic Jump Location
Fig. 4

Illustration of applicability of the rigid substrate assumption: (a) loading factor I¯=0.002 and (b) loading factor I¯=0.01

Grahic Jump Location
Fig. 5

Variation of the debonding onset with respect to α : (a) loading factor I¯=0.002 and (b) loading factor I¯=0.01. The dashed line represents the simplified solution for weak interface with no concentration gradient along the radius.

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In