Macrocrack-Microcrack Interaction in Piezoelectric Materials, Part II: Numerical Results and Discussions

J. Appl. Mech 66(2), 522-527 (Oct 25, 1999) (6 pages) doi:10.1115/1.2791078 History: Received May 07, 1998; Revised October 27, 1998


Numerical results are shown in figures and tables. The major features for the traditional stress intensity factors and the electric displacement intensity factor against the microcrack location angle and the distance of the microcrack center from the macrocrack tip are discussed. It is shown that, unlike single-crack problems, the mechanical loading and the electric loading are coupled together since the microcrack not only releases the near-tip stresses, but also disturbs the near-tip electric field. Furthermore, the influence of the electric loading on the mechanical strain energy release rate (MSERR) at the macrocrack tip is discussed in detail. It is found that the variable nature of the MSERR against the normalized electric loading is monotonic and proportional wherever the parallel microcrack is located near the macrocrack tip. However, the slope of the MSERR's curve considering microcracking diverges far from those without considering microcracking. This finding reveals that, besides the two sources of microcrack shielding discussed by Hutchinson (1987) for brittle solids, the disturbance of the near-tip electric field due to microcracking really provides another source of shielding for piezoelectric solids.

COPYRIGHT © 1999 by The American Society of Mechanical Engineers
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HutchinsonJW1987Crack tip shielding by microcracking in brittle solidsActa Metall66216051619 [CrossRef]
PakSBSunCT1995aFracture criteria for piezoelectric ceramicsJournal of the American Ceramic Society66214751480
PakSBSunCT1995bEffect of electric fields on fracture of piezoelectric ceramicsInternational Journal of Fracture662203216




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