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Research Papers

Design of Stretchable Electronics Against Impact

[+] Author and Article Information
J. H. Yuan

Center for Mechanics and Materials,
Tsinghua University,
Beijing 100084, China;
AML,
Department of Engineering Mechanics,
Tsinghua University,
Beijing 100084, China;
Departments of Civil and
Environmental Engineering,
Mechanical Engineering, and Material
Science and Engineering,
Northwestern University,
Evanston, IL 60208;
Skin Disease Research Center,
Northwestern University,
Evanston, IL 60208
e-mail: yuanjianghong1984@gmail.com

M. Pharr, John A. Rogers

Frederick Seitz Materials Research Laboratory,
Department of Materials Science
and Engineering,
University of Illinois at Urbana-Champaign,
Urbana, IL 61801

X. Feng

Center for Mechanics and Materials,
Tsinghua University,
Beijing 100084, China;
AML,
Department of Engineering Mechanics,
Tsinghua University,
Beijing 100084, China

Yonggang Huang

Departments of Civil and
Environmental Engineering,
Mechanical Engineering, and Material
Science and Engineering,
Northwestern University,
Evanston, IL 60208;
Skin Disease Research Center,
Northwestern University,
Evanston, IL 60208

1Corresponding author.

Contributed by the Applied Mechanics Division of ASME for publication in the JOURNAL OF APPLIED MECHANICS. Manuscript received June 29, 2016; final manuscript received July 15, 2016; published online August 10, 2016. Assoc. Editor: Pradeep Sharma.

J. Appl. Mech 83(10), 101009 (Aug 10, 2016) (5 pages) Paper No: JAM-16-1331; doi: 10.1115/1.4034226 History: Received June 29, 2016; Revised July 15, 2016

Stretchable electronics offer soft, biocompatible mechanical properties; these same properties make them susceptible to device failure associated with physical impact. This paper studies designs for stretchable electronics that resist failure from impacts due to incorporation of a viscoelastic encapsulation layer. Results indicate that the impact resistance depends on the thickness and viscoelastic properties of the encapsulation layer, as well as the duration of impact. An analytic model for the critical thickness of the encapsulation layer is established. It is shown that a commercially available, low modulus silicone material offers viscous properties that make it a good candidate as the encapsulation layer for stretchable electronics.

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References

Figures

Grahic Jump Location
Fig. 1

One-dimensional model of the stretchable electronics, with viscoelastic encapsulation and soft substrate, on the surface of human skin subjected to impact loading

Grahic Jump Location
Fig. 2

ε versus X for tr/tP = 0.01 and 0.1 with Er/Ei = 0.1 and α = 0.5, based on Eq. (19) (“Approx.”) and Eq. (10) (“Exact”), respectively

Grahic Jump Location
Fig. 3

ε versus X for several values of Er/Ei with α = 0.5 and tr/tP = 0.1

Grahic Jump Location
Fig. 4

ε versus X for several values of α with Er/Ei = 0.1 and tr/tP = 0.1

Grahic Jump Location
Fig. 5

ε versus X for several values of tr/tP with Er/Ei = 0.1 and α = 0.5

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