0
Research Papers

Interfacial Delamination of Inorganic Films on Viscoelastic Substrates

[+] Author and Article Information
Yin Huang, Jianghong Yuan, Yingchao Zhang

AML,
Department of Engineering Mechanics,
Tsinghua University,
Beijing 100084, China;
Center for Mechanics and Materials,
Tsinghua University,
Beijing 100084, China

Xue Feng

AML,
Department of Engineering Mechanics,
Tsinghua University,
Beijing 100084, China;
Center for Mechanics and Materials,
Tsinghua University,
Beijing 100084, China
e-mail: fengxue@tsinghua.edu.cn

1Corresponding author.

Contributed by the Applied Mechanics Division of ASME for publication in the JOURNAL OF APPLIED MECHANICS. Manuscript received April 21, 2016; final manuscript received June 17, 2016; published online August 3, 2016. Editor: Yonggang Huang.

J. Appl. Mech 83(10), 101005 (Aug 03, 2016) (9 pages) Paper No: JAM-16-1200; doi: 10.1115/1.4034116 History: Received April 21, 2016; Revised June 17, 2016

The performance of flexible/stretchable electronics may be significantly reduced by the interfacial delamination due to the large mismatch at the interface between stiff films and soft substrates. Based on the theory of viscoelasticity, a cracked composite beam model is proposed in this paper to analyze the delamination of an elastic thin film from a viscoelastic substrate. The time-varying neutral plane of the composite beam is derived analytically, and then the energy release rate of the interfacial crack is obtained from the Griffith's theory. Further, three different states of the crack propagation under constant external loadings are predicted, which has potential applications on the structural design of inorganic flexible/stretchable electronics.

FIGURES IN THIS ARTICLE
<>
Copyright © 2016 by ASME
Your Session has timed out. Please sign back in to continue.

References

Figures

Grahic Jump Location
Fig. 1

Schematic diagram of the elastic-film/viscoelastic-substrate system with interfacial delamination under the constant axial force and bending moment

Grahic Jump Location
Fig. 2

Comparison curves of the time-varying neutral plane under N0=0 between our analytical solution (“analytical”) and the finite-element results (“FEM”): (a) for different stiffness ratios with λ=1 and β1=β2; and (b) for different thickness ratios with β1=β2=1

Grahic Jump Location
Fig. 3

Variation of the dimensionless neutral plane with the dimensionless loading time: (a) for different values of β2 with λ=β1=1 under N0=0 or M0=0; and (b) for different loading ratios with λ=β1=1 and β2=10

Grahic Jump Location
Fig. 4

Dimensionless time-varying energy release rate of the cracked composite beam subjected to N0 or M0 for different values of β2 with λ=β1=1.0×10−6

Grahic Jump Location
Fig. 5

Dimensionless time-varying energy release rate of the cracked composite beam subjected to M0: (a) for different values of β1=β2 with λ=1.0×10−6; and (b) for different values of λ with β1=β2=1.0×10−6

Grahic Jump Location
Fig. 6

Three different states of the interfacial crack propagation under N0=0 in the viscoelastic composite beam with a constant interfacial fracture toughness Gc

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In