0
Research Papers

Competing Fracture of Thin-Chip Transferring From/Onto Prestrained Compliant Substrate

[+] Author and Article Information
Huimin Liu

State Key Laboratory of Digital Manufacturing
Equipment and Technology,
Flexible Electronics Research Center,
Huazhong University of Science and Technology,
Wuhan 430074, China;
Department of Weaponry Engineering,
Naval University of Engineering,
Wuhan 430033, China
e-mail: 25731014@qq.com

Zunxu Liu

State Key Laboratory of Digital Manufacturing
Equipment and Technology,
Flexible Electronics Research Center,
Huazhong University of Science and Technology,
Wuhan 430074, China
e-mail: zunxuliu@hust.edu.cn

Zhoulong Xu

State Key Laboratory of Digital Manufacturing
Equipment and Technology,
Flexible Electronics Research Center,
Huazhong University of Science and Technology,
Wuhan 430074, China
e-mail: birdnest@qq.com

Zhouping Yin

State Key Laboratory of Digital Manufacturing
Equipment and Technology,
Flexible Electronics Research Center,
Huazhong University of Science and Technology,
Wuhan 430074, China
e-mail: yinzhp@hust.edu.cn

YongAn Huang

State Key Laboratory of Digital Manufacturing
Equipment and Technology,
Flexible Electronics Research Center,
Huazhong University of Science and Technology,
Wuhan 430074, China
e-mail: yahuang@hust.edu.cn

Jiankui Chen

State Key Laboratory of Digital Manufacturing
Equipment and Technology,
Flexible Electronics Research Center,
Huazhong University of Science and Technology,
Wuhan 430074, China
e-mail: chenjk@hust.edu.cn

1Huimin Liu and Zunxu Liu contributed equally to this work.

2Corresponding authors.

Contributed by the Applied Mechanics Division of ASME for publication in the JOURNAL OF APPLIED MECHANICS. Manuscript received May 27, 2015; final manuscript received July 12, 2015; published online July 30, 2015. Editor: Yonggang Huang.

J. Appl. Mech 82(10), 101012 (Jul 30, 2015) (10 pages) Paper No: JAM-15-1271; doi: 10.1115/1.4031047 History: Received May 27, 2015

The transferring of thin chip from donor to receptor plays a critical role in advanced electronic package, and the productivity is determined by the interfacial behavior between chip and substrate during chip transferring. The paper investigates analytical competing fracture model of chip–adhesive–substrate structure in thin-chip transferring (peeling-off and placing-on), to discover the critical process condition for distinguishing the interfacial delamination and chip crack. The structure is continuously subjected to ejecting needle, vacuum pick-up head, and wafer fixture, which leads to concentrated and distributed loads and dynamic boundary conditions. Additionally, two criterions based on competing fracture model are presented to determine the extreme chip dimension for peeling-off and the elimination of residual stress for placing-on. The theoretical results are validated by the finite-element simulation with virtual crack-closure technique (VCCT). This paper provides an insight for process optimization, to improve the success ratio and productivity of chip transferring.

FIGURES IN THIS ARTICLE
<>
Copyright © 2015 by ASME
Your Session has timed out. Please sign back in to continue.

References

Tong, H.-M. , Lai, Y.-S. , and Wong, C. , 2013, Advanced Flip Chip Packaging, Springer, New York.
Wu, G. , Tao, B. , and Yin, Z. , 2013, “Study on the Shear Strength Degradation of ACA Joints Induced by Different Hygrothermal Aging Conditions,” Microelectron. Reliab., 53(12), pp. 2030–2035. [CrossRef]
Kim, D. H. , Ahn, J. H. , Choi, W. M. , Kim, H.-S. , Kim, T.-H. , Song, J. , Huang, Y. Y. , Liu, Z. , Lu, C. , and Rogers, J. A. , 2008, “Stretchable and Foldable Silicon Integrated Circuits,” Science, 320(5875), pp. 507–511. [CrossRef] [PubMed]
Cheng, H. Y. , and Wang, S. D. , 2014, “Mechanics of Interfacial Delamination in Epidermal Electronics Systems,” ASME J. Appl. Mech., 81(4), p. 044501. [CrossRef]
Peng, B. , Huang, Y. , Yin, Z. , and Xiong, Y. , 2012, “Competing Fracture Modeling of Thin Chip Pick-Up Process,” IEEE Trans. Compon., Packag., Manuf. Technol., 2(7), pp. 1217–1225. [CrossRef]
Cheng, T. H. , Du, C. C. , and Tseng, C. H. , 2006, “Study in IC Chip Failure During Pick-Up Process by Using Experimental and Finite Element Methods,” J. Mater. Process. Technol., 172(3), pp. 407–416. [CrossRef]
Cheng, T. H. , Tseng, C. H. , and Hung, C. H. , 2006, “Analysis of Stresses in Adhesive Joints Applicable to IC Chips Using Symbolic Manipulation and the Numerical Method,” J. Adhes. Sci. Technol., 20(15), pp. 1669–1692. [CrossRef]
Lin, Y. J. , and Hwang, S. J. , 2005, “Static Analysis of the Die Picking Process,” IEEE Trans. Electron. Packag. Manuf., 28(2), pp. 142–149. [CrossRef]
Liu, Z. , Huang, Y. , Xiao, L. , Tang, P. , and Yin, Z. , 2015, “Nonlinear Characteristics in Fracture Strength Test of Ultrathin Silicon Die,” Semicond. Sci. Technol., 30(4), p. 045005. [CrossRef]
Saiki, N. , Inaba, K. , Kishimoto, K. , Seno, H. , and Ebe, K. , 2010, “Study on Peeling Behavior in Pick-Up Process of IC Chip With Adhesive Tapes,” J. Solid Mech. Mater. Eng., 4(7), pp. 1051–1060. [CrossRef]
Feng, L. , Li, X. , and Shi, T. , 2015, “Nonlinear Large Deflection of Thin Film Overhung on Compliant Substrate Using Shaft-Loaded Blister Test,” ASME J. Appl. Mech., 82(9), p. 091001. [CrossRef]
Hutchinson, J. W. , and Suo, Z. , 1992, “Mixed Mode Cracking in Layered Materials,” Adv. Appl. Mech., 29(1), pp. 63–191.
He, M. Y. , Evans, A. G. , and Hutchinson, J. W. , 1997, “Convergent Debonding of Films and Fibers,” Acta Mater., 45(8), pp. 3481–3489. [CrossRef]
Qiao, P. Z. , and Wang, J. L. , 2004, “Mechanics and Fracture of Crack Tip Deformable Bi-Material Interface,” Int. J. Solids Struct., 41(26), pp. 7423–7444. [CrossRef]
Lu, N. S. , Yoon, J. I. , and Suo, Z. G. , 2007, “Delamination of Stiff Islands Patterned on Stretchable Substrates,” Int. J. Mater. Res., 98(8), pp. 717–722. [CrossRef]
Wang, K. P. , Huang, Y. Y. , Chandra, A. , and Hu, K. X. , 2000, “Interfacial Shear Stress, Peeling Stress, and Die Cracking Stress in Trilayer Electronic Assemblies,” IEEE Trans. Compon. Packag. Technol., 23(2), pp. 309–316. [CrossRef]
Wang, H. L. , and Qiao, P. Z. , 2004, “On the Energy Release Rate and Mode Mix of Delaminated Shear Deformable Composite Plates,” Int. J. Solids Struct., 41(9–10), pp. 2757–2779. [CrossRef]
Peng, B. , Huang, Y. A. , Yin, Z. P. , and Xiong, Y. L. , 2011, “Analysis of Interfacial Peeling in IC Chip Pick-Up Process,” J. Appl. Phys., 110(7), p. 073508. [CrossRef]
Meitl, M. A. , Zhu, Z. T. , Kumar, V. , Lee, K. J. , Feng, X. , Huang, Y. Y. , Adesida, I. , Nuzzo, R. G. , and Rogers, J. A. , 2006, “Transfer Printing by Kinetic Control of Adhesion to an Elastomeric Stamp,” Nat. Mater., 5(1), pp. 33–38. [CrossRef]
Feng, X. , Cheng, H. , Bowen, A. M. , Carlson, A. W. , Nuzzo, R. G. , and Rogers, J. A. , 2013, “A Finite-Deformation Mechanics Theory for Kinetically Controlled Transfer Printing,” ASME J. Appl. Mech., 80(6), p. 061023. [CrossRef]
Li, R. , Li, Y. , Lu, C. , Song, J. , Saeidpouraza, R. , Fang, B. , Zhong, Y. , Ferrreira, P. M. , Rogers, J. A. , and Huang, Y. , 2012, “Thermo-Mechanical Modeling of Laser-Driven Non-Contact Transfer Printing: Two-Dimensional Analysis,” Soft Matter, 8(27), pp. 7122–7127. [CrossRef]
Wang, L. , Bai, R. X. , and Chen, H. R. , 2013, “Analytical Modeling of the Interface Crack Between a Piezoelectric Actuator and an Elastic Substrate Considering Shear Effects,” Int. J. Mech. Sci., 66(1), pp. 141–148. [CrossRef]
Kovalchick, C. , Molinari, A. , and Ravichandran, G. , 2014, “Rate Dependent Adhesion Energy and Nonsteady Peeling of Inextensible Tapes,” ASME J. Appl. Mech., 81(4), p. 041016. [CrossRef]
Liu, Z. , Huang, Y. , Yin, Z. , Bennati, S. , and Valvo, P. S. , 2014, “A General Solution for the Two-Dimensional Stress Analysis of Balanced and Unbalanced Adhesively Bonded Joints,” Int. J. Adhes. Adhes., 54(1), pp. 112–123. [CrossRef]
Liu, Z. , Huang, Y. , Chen, J. , and Yin, Z. , 2014, “Tunable Peeling Technique and Mechanism of Thin Chip From Compliant Adhesive Tapes,” IEEE Trans. Compon., Packag. Manuf. Technol., 4(4), pp. 560–568. [CrossRef]
Cheng, H. , Wu, J. , Yu, Q. , Kim-Lee, H.-J. , Carlson, A. , Turner, K. T. , Hwang, K.-C. , Huang, Y. , and Rogers, J. A. , 2012, “An Analytical Model for Shear-Enhanced Adhesiveless Transfer Printing,” Mech. Res. Commun., 43(1), pp. 46–49. [CrossRef]
da Silva, L. F. M. , das Neves, P. J. C. , Adams, R. D. , and Spelt, J. K. , 2009, “Analytical Models of Adhesively Bonded Joints—Part II: Comparative Study,” Int. J. Adhes. Adhes., 29(3), pp. 331–341. [CrossRef]
Yang, C. , Chadegani, A. , and Tomblin, J. S. , 2008, “Strain Energy Release Rate Determination of Prescribed Cracks in Adhesively-Bonded Single-Lap Composite Joints With Thick Bondlines,” Composites, Part B, 39(5), pp. 863–873. [CrossRef]
Liu, Z. , Valvo, P. S. , Huang, Y. , and Yin, Z. , 2013, “Cohesive Failure Analysis of an Array of IC Chips Bonded to a Stretched Substrate,” Int. J. Solids Struct., 50(22), pp. 3528–3538. [CrossRef]
Peng, B. , Huang, Y. , Yin, Z. , and Xiong, Y. , 2011, “On the Analysis of Dynamic Effect in the Die Pick-Up Process,” 12th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Shanghai, Aug. 8–11.
Xie, D. , and Biggers, S. B. , 2006, “Progressive Crack Growth Analysis Using Interface Element Based on the Virtual Crack Closure Technique,” Finite Elem. Anal. Des., 42(11), pp. 977–984. [CrossRef]
Huang, Y. , Chen, J. , Yin, Z. , and Xiong, Y. , 2011, “Roll-to-Roll Processing of Flexible Heterogeneous Electronics With Low Interfacial Residual Stress,” IEEE Trans. Compon., Packag. Manuf. Technol., 1(9), pp. 1368–1377. [CrossRef]

Figures

Grahic Jump Location
Fig. 1

(a) Schematics of chip-transferring process, (b) peeling process of chip from adhesive substrate, (c) chip–adhesive–substrate structure, and (d) four stages of chip transferring in flip-chip process

Grahic Jump Location
Fig. 2

Mechanics model of multilayer structure: (a) chip–adhesive–substrate with bending moments, axial and transverse loads acting on a segment of delaminated chip–adhesive–substrate structure immediately behind and ahead of the crack tip and (b) the half of the chip–adhesive–substrate structure

Grahic Jump Location
Fig. 6

The interfacial ERR and chip cracking stress as functions of chip thickness and length

Grahic Jump Location
Fig. 5

Chip cracking of a radio frequency indentification (RFID) chip, with pierce-through crack on the center: (a) chip cracking of a RFID chip, with pierce-through crack on the center and (b) two competing failure modes

Grahic Jump Location
Fig. 4

The ERR and mode angle as functions of the chip size: (a) the length and (b) the thickness

Grahic Jump Location
Fig. 3

Three phases in peeling of chip from substrate

Grahic Jump Location
Fig. 7

(a) Mode II ERR as a function of the distance between the chips. The chip length is fixed at lchip = 1.0 mm, and the distance between chips, 2lvacancy, varies from 0.04 mm to 4.0 mm. (b) Mode II ERR as a function of the chip size.

Grahic Jump Location
Fig. 8

Maximum ERR as a function of the chip size and Young's modulus of substrate. Two critical fracture toughness of the adhesive layer, Γadhesive = Γa = 0.0035 N/mm and Γadhesive = Γa = 0.002 N/mm, are added in the figure as the dash line.

Grahic Jump Location
Fig. 9

Interfacial shear stress related with thickness and web tension stress, where the deposit temperature is (a) Tdeposition = 150 °C and (b) Tdeposition = 200 °C

Grahic Jump Location
Fig. 10

(a) Comparison of two design methods (interface-based method and moment-based method) and (b) design based on material, structure, and processes

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In