The impact response of bonded media with a functionally graded interlayer weakened by a pair of two offset interfacial cracks is investigated under the condition of antiplane deformation. The material nonhomogeneity in the graded interlayer is represented in terms of power-law variations of shear modulus and mass density between the dissimilar, homogeneous half-planes. Laplace and Fourier integral transforms are employed to reduce the crack problem to solving a system of Cauchy-type singular integral equations in the Laplace domain. The crack-tip behavior in the physical domain is recovered through the inverse Laplace transform to evaluate the dynamic mode III stress intensity factors as a function of time. As a result, the transient interaction of the offset interfacial cracks spaced apart by the graded interlayer is illustrated. The peak values of the dynamic stress intensity factors are also presented versus offset crack distance, elaborating the effects of various material and geometric parameters of the bonded system on the overshoot characteristics of the transient behavior in the near-tip regions, owing to the impact-induced interaction of singular stress fields between the two cracks.