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Technical Brief

Mechanics of Solar Module on Structured Substrates

[+] Author and Article Information
Zhuangjian Liu

Institute of High Performance Computing,
1 Fusionopolis Way,
No. 16-16 Connexis,
Singapore 138632, Singapore

Huanyu Cheng

Department of Civil and Environmental Engineering,
Northwestern University,
Evanston, IL 60208
Department of Mechanical Engineering,
Northwestern University,
Evanston, IL 60208
Center for Engineering and Health,
Northwestern University,
Evanston, IL 60208
Skin Disease Research Center,
Northwestern University,
Evanston, IL 60208

Jian Wu

AML,
Department of Engineering Mechanics,
Tsinghua University,
Beijing 100084, China
Center for Mechanics and Materials,
Tsinghua University,
Beijing 100084, China
e-mail: wujian@tsinghua.edu.cn

1Corresponding author.

Manuscript received December 18, 2013; final manuscript received January 9, 2014; accepted manuscript posted January 10, 2014; published online February 4, 2014. Editor: Yonggang Huang.

J. Appl. Mech 81(6), 064502 (Feb 04, 2014) (3 pages) Paper No: JAM-13-1511; doi: 10.1115/1.4026472 History: Received December 18, 2013; Revised January 09, 2014; Accepted January 10, 2014

In the island-interconnect design, the device islands connected by interconnects are mounted on a soft elastomeric substrate. The out-of-plane motion of interconnects accommodates the deformation applied to the system, enabling stretchable feather in electronics. The areal coverage, however, decreases due to the presence of interconnects. This problem is difficult to address for many important applications where high areal coverage is desired. By minimizing the interfacial stress between the device islands and substrate, a structured substrate introduces surface relief in the substrate and this design offers a desired level of stretchability with a relatively large areal coverage. Theoretical and numerical investigations give the strain levels in both the substrate and interconnect, providing design guidance on the optimization of the geometric and material parameters in the experiment.

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References

Figures

Grahic Jump Location
Fig. 1

Schematic illustration of the stretchable solar module

Grahic Jump Location
Fig. 2

Comparison of the shape of buckled interconnects between the finite element analysis and analytic model

Grahic Jump Location
Fig. 3

Maximum strain at the top surface of the islands as a function of Young's moduli of the island and base

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