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Technical Briefs

Mechanics of Interfacial Delamination in Epidermal Electronics Systems

[+] Author and Article Information
Huanyu Cheng

Departments of Mechanical Engineering
and Civil and Environmental Engineering,
Center for Engineering and Health,
and Skin Disease Research Center,
Northwestern University,
Evanston, IL 60208

Shuodao Wang

Department of Materials Science and Engineering,
University of Illinois,
Urbana, IL 61801
e-mail: shuodaowang@gmail.com

1 Corresponding author.

Manuscript received August 7, 2013; final manuscript received August 20, 2013; accepted manuscript posted August 28, 2013; published online October 16, 2013. Editor: Yonggang Huang.

J. Appl. Mech 81(4), 044501 (Oct 16, 2013) (3 pages) Paper No: JAM-13-1330; doi: 10.1115/1.4025305 History: Received August 07, 2013; Revised August 20, 2013; Accepted August 28, 2013

In order to provide continuous diagnostic and therapeutic options that exploit electrophysiological signals from the epidermis, this study discusses epidermal electronics systems (EES) that conform to the skin surface via van der Waals force alone, which is otherwise susceptible to artifacts associated with motion-induced changes. This paper not only establishes a criterion of conformal contact between the EES and the skin for both initial contact and the case where the skin is subject to external loading but also investigates the criterion to prevent any partial delamination between electronics and the skin. These results improve the performance of EES by maximizing intimate contact between the EES and skin, revealing important underlying physical insights for device optimization and future design.

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Figures

Grahic Jump Location
Fig. 1

(a) Top view of epidermal electronics system and (b) schematic illustration of initial contact (inset: cross-section layout of EES)

Grahic Jump Location
Fig. 2

Total energy (per unit length) of a typical EES/skin system Uconformal/L0 versus Solaris thickness

Grahic Jump Location
Fig. 3

Critical Solaris thickness decreases as the applied strain increases

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