0
Research Articles

Predicted Thermal Stresses in a Trimaterial Assembly With Application to Silicon-Based Photovoltaic Module

[+] Author and Article Information
E. Suhir

Bell Labs,
Physical Sciences and Engineering
Research Division,
Murray Hill, NJ;
University of California,
Santa Cruz, CA;
University of Maryland,
College Park, MD;
Technical University,
Vienna, Austria;
ERS Co. LLC,
Santa Cruz, CA 95064
e-mail: suhire@aol.com

D. Shangguan

Flextronics Corporation,
Milpitas, CA 95035
e-mail: Dongkai.Shangguan@flextronics.com

L. Bechou

Bordeaux University,
Bordeaux, France
e-mail: Laurent.Bechou@ims-bordeaux.fr

Manuscript received January 22, 2012; final manuscript received June 3, 2012; accepted manuscript posted August 27, 2012; published online January 22, 2013. Assoc. Editor: Martin Ostoja-Starzewski.

J. Appl. Mech 80(2), 021008 (Jan 22, 2013) (10 pages) Paper No: JAM-12-1025; doi: 10.1115/1.4007477 History: Received January 22, 2012; Revised June 03, 2012; Accepted August 27, 2012

Low-temperature thermally induced stresses in a trimaterial assembly subjected to the change in temperature are predicted based on an approximate structural analysis (strength-of-materials) analytical (“mathematical”) model. The addressed stresses include normal stresses acting in the cross-sections of the assembly components and determining their short- and long-term reliability, as well as the interfacial shearing and peeling stresses responsible for the adhesive and cohesive strength of the assembly. The model is applied to a preframed crystalline silicon photovoltaic module (PVM) assembly. It is concluded that the interfacial thermal stresses, and especially the peeling stresses, can be rather high, so that the structural integrity of the module could be compromised, unless appropriate design for reliability measures are taken. The developed model can be helpful in the stress analysis and physical (structural) design of the PVM and other trimaterial assemblies.

FIGURES IN THIS ARTICLE
<>
Copyright © 2013 by ASME
Your Session has timed out. Please sign back in to continue.

References

Timoshenko, S. P., 1925, “Analysis of Bi-Metal Thermostats,” J. Opt. Soc. Am., 11(3), pp. 233–255. [CrossRef]
Völkersen, O., 1938, “Die Nietkraftverteilung in Zugbeanspruchten Nietverbindungen mit konstanten Laschenquerschnitten,” Luftfahrtforschung, 15, pp. 41–47.
Aleck, B. J., 1949, “Thermal Stresses in a Rectangular Plate Clamped Along an Edge,” ASME J. Appl. Mech., 16, pp. 118–122.
Zeyfang, R., 1971, “Stresses and Strains in a Plate Bonded to a Substrate: Semiconductor Devices,” Solid-State Electron., 14, pp. 1035–1039. [CrossRef]
Chang, F.-V., 1983, “Thermal Contact Stresses of Bi-Metal Strip Thermostat,” Appl. Math. Mech., 4(3), pp. 363–376. [CrossRef]
Suhir, E., 1986, “Stresses in Bi-Metal Thermostats,” ASME J. Appl. Mech., 53(3), pp. 657–660. [CrossRef]
Kuo, A. Y., 1989, “Thermal Stresses at the Edge of a Bimetallic Thermostat,” ASME J. Appl. Mech., 56(3), pp. 585–589. [CrossRef]
Yamada, S. E., 1992, “A Bonded Joint Analysis for Surface Mount Components,” ASME J. Electron. Packag., 114(1), pp. 1–7. [CrossRef]
Suhir, E., 1999, “Thermal Stress Failures in Microelectronics and Photonics: Prediction and Prevention,” Future Circuits International, 5, pp. 83–89.
E.Suhir, 2009, “Predictive Analytical Thermal Stress Modeling in Electronic and Photonics,” ASME Appl. Mech. Rev., 62(4), p. 040801. [CrossRef]
Quintana, M. A., King, D. L., McMahon, T. J., and OsterwaldC. R., 2002, “Commonly Observed Degradation in Field-Aged Photovoltaic Modules,” Conference Record of the 29th IEEE Photovoltaic Specialists Conference, New Orleans, LA, May 19–24, pp. 1436–1439. [CrossRef]
Underwriters Laboratories, 2002, UL 1703: Standard for Flat-Plate Photovoltaic Modules and Panels, 3rd ed., UL LLC.
Hacke, P., Terwilliger, K., Glick, S., Trudell, D., Bosco, N., Johnston, and Kurtz, S., 2010, “Test-to-Failure of Crystalline Silicon Modules,” 35th IEEE Photovoltaic Specialists Conference (PVSC), Honolulu, HI, June 20–25, pp. 244–250. [CrossRef]
Wohlgemuth, J. H., Cunningham, D. W., Amin, D., Shaner, J., Xia, Z., and Miller, J., 2008, “Using Accelerated Tests and Field Data to Predict Module Reliability and Lifetime,” Proceedings of the 23rd European Photovoltaic Solar Energy Conference and Exhibition, Valencia, Spain, September 1–5, pp. 2663–2669. [CrossRef]
Gabor, A. M., Ralli, M., Montminy, S., Alegria, L., Bordonaro, C., Woods, J., Felton, L., Davis, M., Atchley, B., and Williams, T., 2006, “Soldering Induced Damage to Thin Si Solar Cells and Detection of Cracked Cells in Modules,” 21st European Photovoltaic Solar Energy Conference, Dresden, Germany, September 4–8, pp. 2042–2047.
Rose, D., and Daroczi, S., 2005, “Development and Manufacture of Reliable PV Modules With > 17% Efficiency,” Proceedings of the 20th European Photovoltaic Solar Energy Conference, Barcelona, Spain, June 6–10.
Meydbray, Y., Wilson, K., Brambila, E., Terao, A., and Daroczi, S., 2007, “Solder Joint Degradation in High Efficiency All Back Contact Solar Cells,” Proceedings of the 22th European Photovoltaic Solar Energy Conference, Milan, Italy, September 3–7.
Timoshenko, S. P., and Woinowsky-Krieger, S., 1959, Theory of Plates and Shells, 2nd ed., McGraw-Hill, New York.

Figures

Grahic Jump Location
Fig. 1

Trimaterial assembly

Grahic Jump Location
Fig. 2

Element of a Si-EVA composite structure

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In