Research Articles

Predicted Thermal Stresses in a Trimaterial Assembly With Application to Silicon-Based Photovoltaic Module

[+] Author and Article Information
E. Suhir

Bell Labs,
Physical Sciences and Engineering
Research Division,
Murray Hill, NJ;
University of California,
Santa Cruz, CA;
University of Maryland,
College Park, MD;
Technical University,
Vienna, Austria;
Santa Cruz, CA 95064
e-mail: suhire@aol.com

D. Shangguan

Flextronics Corporation,
Milpitas, CA 95035
e-mail: Dongkai.Shangguan@flextronics.com

L. Bechou

Bordeaux University,
Bordeaux, France
e-mail: Laurent.Bechou@ims-bordeaux.fr

Manuscript received January 22, 2012; final manuscript received June 3, 2012; accepted manuscript posted August 27, 2012; published online January 22, 2013. Assoc. Editor: Martin Ostoja-Starzewski.

J. Appl. Mech 80(2), 021008 (Jan 22, 2013) (10 pages) Paper No: JAM-12-1025; doi: 10.1115/1.4007477 History: Received January 22, 2012; Revised June 03, 2012; Accepted August 27, 2012

Low-temperature thermally induced stresses in a trimaterial assembly subjected to the change in temperature are predicted based on an approximate structural analysis (strength-of-materials) analytical (“mathematical”) model. The addressed stresses include normal stresses acting in the cross-sections of the assembly components and determining their short- and long-term reliability, as well as the interfacial shearing and peeling stresses responsible for the adhesive and cohesive strength of the assembly. The model is applied to a preframed crystalline silicon photovoltaic module (PVM) assembly. It is concluded that the interfacial thermal stresses, and especially the peeling stresses, can be rather high, so that the structural integrity of the module could be compromised, unless appropriate design for reliability measures are taken. The developed model can be helpful in the stress analysis and physical (structural) design of the PVM and other trimaterial assemblies.

Copyright © 2013 by ASME
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Grahic Jump Location
Fig. 1

Trimaterial assembly

Grahic Jump Location
Fig. 2

Element of a Si-EVA composite structure




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