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Technical Briefs

Digital Photothermoelastic and Numerical Analysis of Transient Thermal Stresses in Cracked Bimaterial Interfaces

[+] Author and Article Information
B. Neethi Simon

Department of Applied Mechanics, IIT Madras, Chennai - 600 036, Indianeethisimon@gmail.com

K. Ramesh

Department of Applied Mechanics, IIT Madras, Chennai - 600 036, Indiakramesh@iitm.ac.in

J. Appl. Mech 76(4), 044502 (Apr 28, 2009) (5 pages) doi:10.1115/1.3086782 History: Received September 16, 2008; Revised January 16, 2009; Published April 28, 2009

Transient thermal stresses of a bimaterial specimen with interface cracks, under uniform cooling by convection, are analyzed by photothermoelasticity and a coupled temperature-displacement, finite element scheme. The stress intensity factors of the interface crack are determined by a multiparameter overdeterministic system of equations in a least-squares sense using the experimental data and by J-integral, numerically. The study showed that a normal temperature variation can lead to significant stresses due to the mismatch of thermal expansion coefficients.

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Copyright © 2009 by American Society of Mechanical Engineers
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Figures

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Figure 1

Aluminum-polycarbonate bimaterial specimen with interface cracks and dimensions indicated

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Figure 2

Circular polariscope dark-field arrangement

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Figure 3

SIF evaluation for steady state condition of whole-field convection-cooled bimaterial specimen

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Figure 4

(a) FE mesh and (b) zoomed FE mesh near the crack tip

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Figure 5

Transient isochromatic fringe patterns with monochromatic light source for region surrounding the crack tip cooled by convection to 28 °C from a bonding temperature of 36 °C. (a)–(d) Experimental isochromatics. (e)–(h) Isochromatics plotted from FE results.

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Figure 6

Steady-state whole-field isochromatic fringe patterns with white light source for bimaterial specimen cooled to 28 °C from the bonding temperature of 36 °C. (a) Experimental isochromatics. (b) Isochromatics plotted from FE results.

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Figure 7

Comparison of transient experimental and numerical SIFs for convection-cooled bimaterial specimen

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Figure 8

Experimental whole-field isochromatic fringe patterns with white light source for bimaterial specimen cooled to 25 °C from bonding temperature of 36 °C. (a) Before the crack propagated. (b) After the crack propagated.

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