Research Papers

Evaluation of the Interfacial Strength of Layered Structures by Indentation Method

[+] Author and Article Information
Masaki Omiya1

Department of Mechanical Engineering, Faculty of Science and Technology,  Keio University, 3-14-1, Hiyoshi, Kohoku-ku, Yokohama, Kanagawa 223-8522, Japanoomiya@mech.keio.ac.jp

Kikuo Kishimoto, Takashi Nakano

Department of Mechanical and Sciences Engineering, Graduate School of Science and Engineering,  Tokyo Institute of Technology, 2-12-1, O-okayama, Meguro-ku, Tokyo 152-8552, Japan


Corresponding author.

J. Appl. Mech 75(3), 031006 (Apr 04, 2008) (6 pages) doi:10.1115/1.2839890 History: Received May 18, 2006; Revised August 30, 2007; Published April 04, 2008

The delamination of thin coating films from substrates is a critical issue for the reliability of micro- and nanoelectronic devices. Indentation methods have the potential to measure interfacial strength in micro- and nanofilm thickness coating films. In this paper, indentation tests of layered structures are simulated using the damage-based cohesive zone model. When the delamination initiates, the indentation load and depth curve tend to deviate from the indentation load and depth curve for the perfectly bonded case. When the interface is stiffer than the coating film, a brittlelike delamination occurs on the interface; when the stiffness of the interface is smaller than that of the coating layer, a ductilelike delamination occurs on the interface. The ratio of shear moduli, μintμPI, characterizes the delamination behavior on the interface during indentation tests. Focusing on the discontinuous point during the indentation tests and introducing the balance of energy before and after the onset of delamination, the evaluation method of the interfacial strength is proposed. The proposed method can be used to estimate the interfacial strength when the ratio of hardness and the yield stress of the coating film is 3.5<HAσy<4.5.

Copyright © 2008 by American Society of Mechanical Engineers
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Figure 1

Concept of interfacial cohesive coupling models

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Figure 2

Interfacial traction and separation relations: (a) Pure tangential deformation case; (b) pure normal deformation case

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Figure 3

The dependence of Kn0∕Kt0 on the decohesion energy; δn0∕δt0=1

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Figure 4

The dependence of δn0∕δt0 on the decohesion energy; Kn0∕Kt0=1

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Figure 5

Numerical model of indentation test on film and substrate system

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Figure 6

(a) Indentation load and depth curve for δc=0.01. Symbols show the effective crack length during the indentation. (b) Equivalent interfacial separation just before and after debonding.

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Figure 7

The phase angle of interface crack tip and effective crack length

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Figure 8

(a) Indentation load and depth curve for the case of Γ=0.1, δc=0.005, and μint∕μPI=1.51. Polyimide layer is assumed to be elastic material. The indentation load-depth curve for Model B (precracked model) coincides with the original model at Point B. (b) Equivalent interfacial separation at Points A and B.

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Figure 9

Indentation load and depth curve for Γ=0.1, δc=0.005, μint∕μPI=1.51; elastic-plastic film case. Polyimide layer is assumed to be elastic perfectly plastic material. Compared to Fig. 8, the indentation load is lower due to the plastic deformation of the polyimide layer.

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Figure 10

The effects of interfacial strength on the evaluation results



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