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TECHNICAL PAPERS

A Plane Stress Perfectly Plastic Mode I Crack Solution With Continuous Stress Field

[+] Author and Article Information
David J. Unger

Department of Mechanical and Civil Engineering, University of Evansville, 1800 Lincoln Avenue, Evansville, IN 47722 e-mail: du2@evansville.edu

J. Appl. Mech 72(1), 62-67 (Feb 01, 2005) (6 pages) doi:10.1115/1.1828061 History: Received July 21, 2003; Revised August 13, 2004; Online February 01, 2005
Copyright © 2005 by ASME
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References

Figures

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The von Mises yield condition (elliptically shaped) with inscribed Tresca yield condition. After 3.
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The alternative von Mises yield condition (parabolically shaped) compared to the Tresca yield condition. After 3.
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Predicted elastic-plastic boundaries around a crack tip for different yield criteria using the elastic stress field
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Slip lines across an elastic-plastic boundary under the Tresca yield condition. After 245.
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Characteristics for plane stress mode I crack under the von Mises yield condition (elliptically shaped). After 1.
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Stress field for plane stress mode I crack under the von Mises yield condition (elliptically shaped). After 1.
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Characteristics for plane stress mode I crack under the alternative von Mises yield condition (parabolically shaped)
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Stress field for plane stress mode I crack under alternative von Mises yield condition (parabolically shaped)

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